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IS64C1024AL-15KA3-TR

Integrated Silicon Solution

IS64C1024AL-15KA3-TR by Integrated Silicon Solution

IS64C1024AL-15KA3-TR by Integrated Silicon Solution is a 128KX8 SRAM with 125°C max temp, 15 ns access time, and 1048576 bit memory density. Ideal for automotive applications due to AEC-Q100 screening level and CMOS technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Vyrian

USA . 727 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 365 parts In-Stock

1+ parts

$13.290

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365

$13.290

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Aranea Global

USA . 50 parts In-Stock

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Overview

Elevate your projects with the IS64C1024AL-15KA3-TR by Integrated Silicon Solution. As a leading manufacturer of high-quality SRAM components, ISS delivers top-notch products that guarantee reliability and performance. This versatile memory IC is perfect for automotive applications with its AEC-Q100 screening level and 125°C operating temperature. With a compact package style and fast access time of 15 ns, this chip offers exceptional value and efficiency for any project. Upgrade to ISS for superior quality and seamless integration in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and reliable, making the product resistant to various environmental factors.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement which is commonly used in many electronic systems, ensuring compatibility.

No. of Terminals: 32

A moderate number of terminals allowing for necessary connectivity without being overly complex.

Maximum Operating Temperature: 125 °C

High operating temperature range suitable for automotive applications where temperature fluctuations are common.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient.

Maximum Access Time: 15 ns

Fast access time enables quick retrieval of data, enhancing the overall performance of the product.

Technical Specifications

SRAM IS64C1024AL-15KA3-TR attributes and parameters. Explore more SRAM devices from Integrated Silicon Solution

Specs

Maximum Access Time:

15 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-J32

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

32

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOJ

Package Equivalence Code:

SOJ32,.44

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Standby Current:

.0005 Amp

Minimum Standby Voltage:

2 V

Sub-Category:

SRAMs

Maximum Supply Current:

55 mA

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

IS64C1024AL-15KA3-TR Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.B

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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