Loading...

70V3589S133BFI

Integrated Device Technology

70V3589S133BFI by Integrated Device Technology

MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 208; Package Code: LFBGA; Package Shape: SQUARE; No. of Functions: 1;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

VNN

France . 5,098 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,098

-

-

-

-

Vyrian

USA . 486 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

486

-

-

-

-

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

200

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,485 parts In-Stock

1+ parts

$2.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,485

$2.000

-

-

-

AZTECH Wire

Italy . 464 parts In-Stock

1+ parts

$14.455

100+ parts

-

1k+ parts

-

10k+ parts

-

464

$14.455

-

-

-

Semicontronic

India . 1,255 parts In-Stock

1+ parts

$29.000

100+ parts

$28.275

1k+ parts

$28.130

10k+ parts

-

1,255

$29.000

$28.275

$28.130

-

Aztec Data Supply Inc.

USA . 500 parts In-Stock

1+ parts

$151.590

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$151.590

-

-

-

Corohmni

South Africa . 75 parts In-Stock

1+ parts

$154.685

100+ parts

-

1k+ parts

-

10k+ parts

-

75

$154.685

-

-

-

Advanced Electronics

New Zealand . 2,154 parts In-Stock

1+ parts

$206.347

100+ parts

$189.839

1k+ parts

$177.885

10k+ parts

-

2,154

$206.347

$189.839

$177.885

-

Microchip USA

USA . 935 parts In-Stock

1+ parts

$295.590

100+ parts

-

1k+ parts

-

10k+ parts

-

935

$295.590

-

-

-

Component Stockers USA

USA . 40 parts In-Stock

1+ parts

$2,934.380

100+ parts

-

1k+ parts

-

10k+ parts

-

40

$2,934.380

-

-

-

Continental Prestige Electronics

USA . 5,497 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,497

-

-

-

-

Argo Parts USA

USA . 4,840 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,840

-

-

-

-

Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Bastille Electronics

Australia . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Technical Specifications

SRAM 70V3589S133BFI attributes and parameters. Explore more SRAM devices from Integrated Device Technology

Specs

Maximum Access Time:

15 ns

Additional Features:

FLOW-THROUGH OR PIPELINED ARCHITECTURE

Maximum Clock Frequency (fCLK):

133 MHz

Input/Output Type:

COMMON

JESD-30 Code:

S-PBGA-B208

JESD-609 Code:

e0

Length:

15 mm

Memory Density:

2359296 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

208

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64KX36

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA208,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

225

Power Supplies (V):

2.5/3.3,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Maximum Standby Current:

.04 Amp

Minimum Standby Voltage:

3.15 V

Sub-Category:

SRAMs

Maximum Supply Current:

480 mA

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

15 mm

Trade Compliance

70V3589S133BFI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

PCN

Manufacturer Highlights

Integrated Device Technology

Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20