Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Renesas Electronics 70V35L20PFGI8 is a DUAL-PORT SRAM with 8KX18 organization, operating at 3.3V. It features a fast access time of 20ns and offers parallel interface for high-speed data transfer. Ideal for industrial applications requiring reliable memory storage in compact spaces.
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Component Stockers USA
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QUARKTWIN TECHNOLOGY LTD
Microchip USA
Continental Prestige Electronics
Argo Parts USA
Bastille Electronics
Provides durability while keeping the weight of the product low.
Allows for easy and efficient PCB assembly.
Optimal voltage for efficient performance and power consumption.
Compact design with reduced height, suitable for space-constrained applications.
Can withstand a wide range of operating temperatures, making it suitable for industrial environments.
CMOS technology offers low power consumption and high noise immunity.
Dual-port feature allows for simultaneous access from multiple sources, enhancing efficiency.
Provides fast access to data, improving overall performance.
SRAM 70V35L20PFGI8 attributes and parameters. Explore more SRAM devices from Renesas Electronics
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70V35L20PFGI8 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.41
SB
8542.32.00.40
SS14
Zowie Technology
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Operating Temperature: 125 Cel; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: 30 A;
LM358M
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
1N4148WT
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Weitronic Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358AN
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
2N2222A
Vpt Components
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Maximum Power Dissipation Ambient: .5 W;
Continental Device India
1N4148WS
Rugao Dachang Electronic
Surge Components
NDT2955
NDT2955 by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 15A and EAS of 174mJ, suitable for ENHANCEMENT MODE operation. With a compact SMALL OUTLINE package and -55 to 150 °C operating range, it offers efficient power dissipation up to 3W.
SMBJ18CA
General Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
TDK
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); No. of Phases: 1; No. of Elements: 1; Maximum Output Current: .2 A;
Motorola
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Collector-Base Capacitance: 8 pF;
Philips Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Taitron Components
ATMEGA328P-AU
Microchip Technology
ATMEGA328P-AU by Microchip: 8-bit RISC CPU, 20 MHz clock, 23 I/O lines. Ideal for industrial applications with SPI, TWI, USART connectivity and low power mode. Features include 2048 RAM bytes, 1024 EEPROM size, and 16384 ROM words.
AT90CAN128-16AUR
AT90CAN128-16AUR by Microchip: 16 MHz clock, 8-bit data RAM, and 131072 ROM words. Ideal for industrial applications with CAN, SPI, TWI connectivity and low power mode. Contains 4 timers, 8 ADC channels, and supports up to 10-bit analog to digital conversion.
2N7002
Supertex
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Maximum Feedback Capacitance (Crss): 5 pF;
1N4148
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
CY62157EV30LL-45BVXIT
Cypress Semiconductor
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: VFBGA; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
CY7C1041GN30-10BVXI
Infineon Technologies
Infineon Technologies' CY7C1041GN30-10BVXI is a 256KX16 SRAM with a package style of GRID ARRAY, VERY THIN PROFILE, FINE PITCH. It operates asynchronously at a nominal voltage of 3V and has a max access time of 10ns. This memory IC is commonly used in industrial applications requiring high-speed data storage.
DS1995L-F5+
Analog Devices
DS1995L-F5+ by Analog Devices is a 16Kx1 non-volatile SRAM with CMOS technology. It operates asynchronously at 2.8-6V, with a memory density of 16384 bits. Suitable for applications requiring reliable data storage in harsh environments due to its metal package and wide temperature range (-40 to 70°C).
AS7C38096A-10TIN
Alliance Memory
Alliance Memory's AS7C38096A-10TIN is a 1MX8 SRAM with 10ns access time, operating at 3.3V. Ideal for industrial applications, it offers a memory density of 8388608 bits and operates in parallel mode with a package size of 18.415mm x 10.16mm x 1.2mm.
71V124SA12TYGI
Renesas Electronics
Renesas Electronics' 71V124SA12TYGI is a 128Kx8 SRAM with 3.3V supply voltage, operating in industrial temperature range. Featuring asynchronous mode and 3-STATE output, it has a max access time of 12ns. Ideal for applications requiring fast and reliable memory storage in compact electronic devices.
23LCV1024-I/ST
23LCV1024-I/ST by Microchip Technology is a 128KX8 SRAM with 20 MHz clock frequency, operating at -40 to 85 °C. It has separate I/O, 3-STATE output, and uses 0.65 mm terminal pitch. Ideal for industrial applications requiring high-speed synchronous memory in a small outline package.
CY62157EV30LL-45ZSXIT
CY62157EV30LL-45ZSXIT by Infineon Technologies is a 512Kx16 SRAM with a supply voltage of 2.5/3.3V, operating in industrial temperature range. It features an asynchronous mode, 45ns access time, and output enable function. Ideal for applications requiring fast and reliable memory storage in compact electronic devices.
CY7C1041DV33-10ZSXIT
CY7C1041DV33-10ZSXIT by Cypress Semiconductor is a 256KX16 SRAM with 3.3V supply, operating at -40 to 85°C. It features 10ns access time, 90mA max supply current, and GULL WING terminals. Ideal for industrial applications requiring fast and reliable memory storage in a compact form factor.
5962-8855201XA
Integrated Device Technology
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Supply Current: 100 mA;
CY7C1061G30-10BVJXI
Infineon's CY7C1061G30-10BVJXI is a 1MX16 SRAM with 10ns access time, operating at 3V. It features a very thin profile grid array package and CMOS technology. Ideal for industrial applications requiring fast parallel memory operations.
CY62167EV30LL-45ZXA
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
7007L20JGI8
Renesas Electronics 7007L20JGI8 is a 32Kx8 DUAL-PORT SRAM with 262144-bit memory density. Operating at 5V, it offers an access time of 20ns and features a temperature range of -40 to 85°C. Ideal for industrial applications requiring fast and reliable parallel memory solutions.
W967D6HBGX7I
Winbond Electronics
W967D6HBGX7I by Winbond Electronics is an 8MX16 SRAM with 3-STATE output, operating at 1.8V. It features a very thin profile grid array package and operates in industrial temperature range. Ideal for applications requiring fast access time and low standby current consumption.
CY7C1049D-10VXI
CY7C1049D-10VXI by Cypress Semiconductor is a 512Kx8 SRAM with 10ns access time, operating at 5V. It features asynchronous mode, 3-STATE output, and common I/O type. Widely used in industrial applications for its small outline package and parallel interface.
CY7C1021DV33-10ZSXIT
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Minimum Standby Voltage: 2 V;
DS1220Y-200
Maxim Integrated
DS1220Y-200 by Maxim Integrated is a 2Kx8 SRAM with 16384-bit memory density. It operates at 5V, has an access time of 200ns, and consumes up to 75mA. Ideal for commercial applications requiring non-volatile memory in microelectronic assemblies.
CY62256NLL-70SNXC
STANDARD SRAM; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Standby Current: .000005 Amp; Package Body Material: PLASTIC/EPOXY;
5962-8855203YA
Teledyne E2v (uk)
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; Technology: CMOS;
5962-8685904LA
Defense Logistics Agency
Defense Logistics Agency's 5962-8685904LA SRAM features 16KX4 organization, CMOS technology, and MIL-STD-883 screening. With a memory density of 65536 bit, it operates in asynchronous mode at temperatures ranging from -55 to 125 °C. Ideal for military applications due to its MILITARY temperature grade and parallel operation with a max access time of 70 ns.
5962-8855206YA
Micross Components
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
70V35L15PFG8
Renesas
70V3589S133BCI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Minimum Standby Voltage: 3.15 V;
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Length: 17 mm;
70V38L20PFGI8
DUAL-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE; Maximum Supply Current: 220 mA;
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE; Maximum Access Time: 20 ns;
70V3589S133BFI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 208; Package Code: LFBGA; Package Shape: SQUARE; Power Supplies (V): 2.5/3.3,3.3;
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 208; Package Code: LFBGA; Package Shape: SQUARE; No. of Functions: 1;
70V3399S133BFI8
DUAL-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 208; Package Code: LFBGA; Package Shape: SQUARE; Maximum Seated Height: 1.7 mm;
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 208; Package Code: LFBGA; Package Shape: SQUARE; Width: 15 mm;
70V3569S5BCI8
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 20;
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Width: 17 mm;
70V3589S133DRGI8
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; Additional Features: PIPELINED OR FLOW-THROUGH ARCHITECTURE;
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;
70V3599S166BF
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 208; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 208; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
70V3599S166BFG
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 208; Package Code: LFBGA; Package Shape: SQUARE; Width: 15 mm;
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 208; Package Code: LFBGA; Package Shape: SQUARE; Maximum Access Time: 12 ns;
70V35L20PFGI8
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE; Memory Density: 147456 bit;
70V38L20PFGI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE; Qualification: Not Qualified;
DUAL-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
70V35L20PF8
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE; Terminal Form: GULL WING;
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