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CY62148GN-45ZSXI

Infineon Technologies

CY62148GN-45ZSXI by Infineon Technologies

Infineon's CY62148GN-45ZSXI is a 512Kx8 SRAM with 45ns access time, operating at 5V. It features a small outline package, suitable for industrial applications requiring fast and reliable parallel memory storage. With a temperature range of -40 to 85°C, it offers high performance in various electronic systems.

Median Price

$3.380

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 189 parts In-Stock

1+ parts

$2.759

100+ parts

$2.564

1k+ parts

$2.522

10k+ parts

$2.492

189

$2.759

$2.564

$2.522

$2.492

Mouser Electronics

USA . 120 parts In-Stock

1+ parts

$5.430

100+ parts

-

1k+ parts

$3.380

10k+ parts

-

120

$5.430

-

$3.380

-

Flip Electronics (Authorized)

USA . 19,206 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,206

-

-

-

-

Rochester

USA . 13,208 parts In-Stock

1+ parts

-

100+ parts

$3.290

1k+ parts

$2.940

10k+ parts

$2.770

13,208

-

$3.290

$2.940

$2.770

Verical

USA . 10,062 parts In-Stock

1+ parts

-

100+ parts

$4.112

1k+ parts

$3.675

10k+ parts

$3.462

10,062

-

$4.112

$3.675

$3.462

DigiKey

USA . 5,952 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.380

10k+ parts

-

5,952

-

-

$3.380

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 204 parts In-Stock

1+ parts

$2.621

100+ parts

-

1k+ parts

-

10k+ parts

-

204

$2.621

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$3.881

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$3.881

-

-

-

Flip Electronics

USA . 5,952 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,952

-

-

-

-

Vyrian

USA . 4,195 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,195

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,302 parts In-Stock

1+ parts

$2.260

100+ parts

-

1k+ parts

-

10k+ parts

-

4,302

$2.260

-

-

-

Corphita

USA . 385 parts In-Stock

1+ parts

$2.483

100+ parts

-

1k+ parts

-

10k+ parts

-

385

$2.483

-

-

-

Modulus Dynamics

Lithuania . 5,184 parts In-Stock

1+ parts

$3.193

100+ parts

$3.065

1k+ parts

$2.938

10k+ parts

-

5,184

$3.193

$3.065

$2.938

-

Continental Prestige Electronics

USA . 6,239 parts In-Stock

1+ parts

$3.881

100+ parts

-

1k+ parts

-

10k+ parts

$3.803

6,239

$3.881

-

-

$3.803

Argo Parts USA

USA . 2,751 parts In-Stock

1+ parts

$3.881

100+ parts

-

1k+ parts

-

10k+ parts

-

2,751

$3.881

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$3.881

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$3.881

-

-

-

Overview

Unlock the power of reliable data storage with the CY62148GN-45ZSXI by Infineon Technologies. Manufactured with precision and expertise, this SRAM memory module offers fast and seamless data access in a compact package. Ideal for industrial applications, this memory chip operates efficiently at extreme temperatures and guarantees high performance. Trust in the quality and innovation of Infineon Technologies to elevate your projects to new heights with the CY62148GN-45ZSXI.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and convenient assembly on circuit boards.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode enables fast and efficient data transfers.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with a wide range of systems and applications.

No. of Terminals: 32

The 32 terminals provide ample connectivity options for integration into various circuit designs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand harsh environmental conditions.

Organization: 512KX8

The 512KX8 organization offers a large memory capacity for storing and accessing data efficiently.

Minimum Operating Temperature: -40 °C

The -40°C minimum operating temperature ensures reliable performance even in cold environments.

Terminal Finish: PURE TIN

The use of pure tin as the terminal finish enhances conductivity and solderability.

Width: 10.16 mm

The compact width of 10.16mm allows for space-efficient placement on circuit boards.

Memory Width: 8

The 8-bit memory width provides sufficient data storage and retrieval capabilities.

No. of Words Code: 512K

The 512K words code signifies a high memory capacity suitable for storing large amounts of data.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high speed operation.

Terminal Form: GULL WING

The gull wing terminal form offers secure and reliable connections in circuit board assembly.

Technical Specifications

SRAM CY62148GN-45ZSXI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

JESD-30 Code:

R-PDSO-G32

Length:

20.95 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

CY62148GN-45ZSXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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