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CY14B104LA-ZS45XI

Infineon Technologies

CY14B104LA-ZS45XI by Infineon Technologies

Infineon's CY14B104LA-ZS45XI is a 512Kx8 SRAM with 3V nominal voltage. Operating in industrial temperature range, it offers fast access time of 45ns and low standby current of 0.005A. Ideal for applications requiring high-speed data storage in compact form factor.

Median Price

$29.225

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 123 parts In-Stock

1+ parts

$12.890

100+ parts

-

1k+ parts

-

10k+ parts

-

123

$12.890

-

-

-

Mouser Electronics

USA . 140 parts In-Stock

1+ parts

$37.540

100+ parts

$32.800

1k+ parts

-

10k+ parts

-

140

$37.540

$32.800

-

-

DigiKey

USA . 82 parts In-Stock

1+ parts

$37.540

100+ parts

$32.791

1k+ parts

$30.814

10k+ parts

-

82

$37.540

$32.791

$30.814

-

Flip Electronics (Authorized)

USA . 1,790 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,790

-

-

-

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Verical

USA . 110 parts In-Stock

1+ parts

-

100+ parts

$29.225

1k+ parts

$26.150

10k+ parts

$24.613

110

-

$29.225

$26.150

$24.613

Rochester

USA . 110 parts In-Stock

1+ parts

-

100+ parts

$23.380

1k+ parts

$20.920

10k+ parts

$19.690

110

-

$23.380

$20.920

$19.690

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 6 parts In-Stock

1+ parts

$19.200

100+ parts

-

1k+ parts

-

10k+ parts

-

6

$19.200

-

-

-

Digiode

USA . 74 parts In-Stock

1+ parts

$22.448

100+ parts

-

1k+ parts

-

10k+ parts

-

74

$22.448

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$25.585

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$25.585

-

-

-

Chip Stock

USA . 6,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,500

-

-

-

-

Flip Electronics

USA . 540 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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540

-

-

-

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Vyrian

USA . 343 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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343

-

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Electronics Depot

USA . 34 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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34

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 2,434 parts In-Stock

1+ parts

$2.369

100+ parts

-

1k+ parts

-

10k+ parts

-

2,434

$2.369

-

-

-

Semicontronic

India . 457 parts In-Stock

1+ parts

$20.090

100+ parts

$19.588

1k+ parts

$19.487

10k+ parts

-

457

$20.090

$19.588

$19.487

-

Ampacity Inc.

Singapore . 417 parts In-Stock

1+ parts

$20.090

100+ parts

-

1k+ parts

-

10k+ parts

-

417

$20.090

-

-

-

Corphita

USA . 356 parts In-Stock

1+ parts

$21.267

100+ parts

-

1k+ parts

-

10k+ parts

-

356

$21.267

-

-

-

Modulus Dynamics

Lithuania . 6,338 parts In-Stock

1+ parts

$25.268

100+ parts

$24.257

1k+ parts

$23.247

10k+ parts

-

6,338

$25.268

$24.257

$23.247

-

Corohmni

South Africa . 126 parts In-Stock

1+ parts

$25.268

100+ parts

-

1k+ parts

-

10k+ parts

-

126

$25.268

-

-

-

Continental Prestige Electronics

USA . 6,165 parts In-Stock

1+ parts

$25.585

100+ parts

-

1k+ parts

-

10k+ parts

$25.073

6,165

$25.585

-

-

$25.073

Component Stockers USA

USA . 362 parts In-Stock

1+ parts

$29.640

100+ parts

$26.060

1k+ parts

-

10k+ parts

-

362

$29.640

$26.060

-

-

A-Z Elektronik GmbH

Germany . 6,897 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,897

-

-

-

-

Alle Elektronik GmbH

Germany . 4,598 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,598

-

-

-

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Perfect Parts

USA . 993 parts In-Stock

1+ parts

-

100+ parts

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993

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-

-

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Kepictronics

USA . 677 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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677

-

-

-

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$25.073

1k+ parts

$24.306

10k+ parts

$23.794

500

-

$25.073

$24.306

$23.794

Argo Parts USA

USA . 90 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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90

-

-

-

-

Overview

Experience unparalleled quality and reliability with the CY14B104LA-ZS45XI by Infineon Technologies, a leading manufacturer in the industry. As a Non-Volatile SRAM, this product offers 512Kx8 organization and 524,288 words, providing high performance for a variety of industrial applications. With a low standby current of 0.005 Amp and a maximum access time of 45 ns, this memory chip ensures efficient operation while maintaining data integrity. Trust Infineon Technologies to deliver cutting-edge technology that exceeds expectations and enhances your projects with seamless functionality and superior performance.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and protection for the components inside, making this SRAM suitable for various applications.

Surface Mount:

YES - Allows for easy installation and integration onto circuit boards, saving time and effort during assembly.

Package Shape:

RECTANGULAR - Offers a compact design that can fit into tight spaces, ideal for applications where space is limited.

Operating Mode:

ASYNCHRONOUS - Enables independent and flexible operation, making this SRAM versatile for different systems and configurations.

Nominal Supply Voltage / Vsup (V):

3 - Operates at a standard voltage level, ensuring compatibility with a wide range of devices and systems.

Power Supplies (V):

3/3.3 - Provides dual power supply options for flexibility in design and compatibility with various power sources.

No. of Terminals:

44 - Offers ample connectivity options for interfacing with other components and peripherals in a system.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE - Features a space-saving design that is suitable for compact electronic devices and applications.

Maximum Operating Temperature:

85 °C - Withstands high temperatures, making this SRAM reliable for industrial and harsh environments.

Organization:

512KX8 - Organized in a 512K x 8 configuration, providing a balanced combination of memory capacity and data width for efficient data storage and retrieval.

Minimum Operating Temperature:

40 °C - Functions reliably in low-temperature environments, ensuring consistent performance in various conditions.

Terminal Finish:

NICKEL PALLADIUM GOLD - Utilizes high-quality terminal finish for enhanced conductivity and longevity, improving overall reliability.

Terminal Position:

DUAL - Features dual terminal positions for compatibility with different PCB layouts and mounting orientations.

Maximum Seated Height:

1.194 mm - Has a low profile design, suitable for applications with height restrictions or limited space availability.

Width:

10.16 mm - Compact width dimension for easier integration into electronic systems and devices of various sizes.

Minimum Supply Voltage (Vsup):

2.7 V - Supports a minimum supply voltage requirement, ensuring proper operation even with lower power sources.

Maximum Time At Peak Reflow Temperature (s):

20 - Allows for a sufficient reflow time during assembly, ensuring proper soldering and reliable connections.

Peak Reflow Temperature °C:

260 - Withstands high reflow temperatures during soldering processes, maintaining component integrity in manufacturing.

Length:

18.415 mm - Compact length dimension for space-efficient placement on PCBs and within electronic enclosures.

Temperature Grade:

INDUSTRIAL - Designed for industrial-grade applications, providing high reliability and performance in demanding environments.

Technology:

CMOS - Utilizes CMOS technology for low power consumption and reliable operation, ideal for energy-efficient devices and applications.

Parallel or Serial:

PARALLEL - Employs parallel data transfer for fast and efficient memory access, suitable for applications requiring high-speed data processing.

Terminal Form:

GULL WING - Gull-wing terminal form factor for easy soldering and secure attachment to the PCB, ensuring reliable connections.

Maximum Supply Current:

52 mA - Operates at a low supply current, minimizing power consumption and heat generation for energy-efficient operation.

No. of Words:

524288 words - Offers a large memory capacity with 524,288 words for storing a significant amount of data, ideal for memory-intensive applications.

Memory Width:

8 - Provides an 8-bit wide memory architecture, suitable for processing and storing data in byte-sized units.

Terminal Pitch:

0.8 mm - Fine terminal pitch spacing of 0.8mm for precise connection and compatibility with modern PCB designs.

No. of Words Code:

512K - Categorized with a 512K words code for easy identification and compatibility with memory addressing systems.

Moisture Sensitivity Level (MSL):

3 - Rated at MSL 3, indicating a moderate level of moisture sensitivity for safe handling and storage practices.

Maximum Supply Voltage (Vsup):

3.6 V - Withstands a maximum supply voltage of 3.6V, offering flexibility and compatibility with higher voltage systems.

Memory Density:

4194304 bit - Offers high memory density of 4,194,304 bits for efficient data storage and processing capabilities.

Memory IC Type:

NON-VOLATILE SRAM - Features non-volatile SRAM technology for retaining data without power, ideal for applications requiring data persistence.

Maximum Standby Current:

0.005 Amp - Consumes minimal standby current of 0.005 Amp, ensuring energy efficiency during idle or standby modes.

Maximum Access Time:

45 ns - Provides fast access time of 45 nanoseconds for rapid data retrieval and processing, suitable for high-performance applications.

Technical Specifications

SRAM CY14B104LA-ZS45XI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e4

Length:

18.415 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP44,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.194 mm

Maximum Standby Current:

.005 Amp

Sub-Category:

SRAMs

Maximum Supply Current:

52 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

10.16 mm

Trade Compliance

CY14B104LA-ZS45XI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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