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IS61LV6416-10TLI

Integrated Silicon Solution

IS61LV6416-10TLI by Integrated Silicon Solution

IS61LV6416-10TLI by Integrated Silicon Solution is a 64Kx16 SRAM with 3.3V supply voltage, operating at -40 to 85°C. It features a 10ns access time, 44 terminals in a small outline package, and is ideal for industrial applications requiring fast and reliable memory storage.

Median Price

$2.847

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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TME

Poland . 144 parts In-Stock

1+ parts

$2.500

100+ parts

$1.690

1k+ parts

$1.370

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144

$2.500

$1.690

$1.370

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Nova Conductors

Japan . 300 parts In-Stock

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$3.194

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$3.194

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Chip Stock

USA . 10,969 parts In-Stock

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Vyrian

USA . 8,844 parts In-Stock

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ComSIT Distribution GmbH

Germany . 62 parts In-Stock

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Bristol Electronics

USA . 1 parts In-Stock

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Atlantic Semiconductor

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Distributors (Availability)

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Continental Prestige Electronics

USA . 6,298 parts In-Stock

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$3.194

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$3.130

6,298

$3.194

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Argo Parts USA

USA . 1,963 parts In-Stock

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$3.194

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Netroflash

USA . 500 parts In-Stock

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$3.194

100+ parts

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$3.034

10k+ parts

$2.970

500

$3.194

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$3.034

$2.970

AZTECH Wire

Italy . 652 parts In-Stock

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$12.750

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Component Stockers USA

USA . 211 parts In-Stock

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$99.990

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S.R.D Solutions

India . 30,000 parts In-Stock

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Perfect Parts

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Authorized Procurement Solutions

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Kepictronics

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Overview

Discover the cutting-edge technology of the IS61LV6416-10TLI by Integrated Silicon Solution, a top-quality SRAM memory chip designed for industrial applications. With its compact design and high performance, this memory chip offers unparalleled reliability and speed, making it the perfect choice for your electronic devices. Trust in Integrated Silicon Solution's expertise and elevate your products to the next level with the IS61LV6416-10TLI. Unlock new possibilities and enhance your devices' capabilities with this innovative memory solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the PCB.

Operating Mode: ASYNCHRONOUS

The asynchronous operation of this product allows for flexible and efficient data processing.

Input/Output Type: COMMON

The common input/output type simplifies integration and compatibility with other components.

Nominal Supply Voltage / Vsup (V): 3.3

With a nominal supply voltage of 3.3V, this product offers reliable and stable performance.

No. of Terminals: 44

The 44 terminals provide ample connectivity options for versatile applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile package style saves space and enhances portability.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand harsh environmental conditions.

Organization: 64KX16

The 64KX16 organization offers a high memory capacity for storing and accessing data efficiently.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for multiple output modes, increasing flexibility in data transmission.

Technical Specifications

SRAM IS61LV6416-10TLI attributes and parameters. Explore more SRAM devices from Integrated Silicon Solution

Specs

Maximum Access Time:

10 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e3

Length:

18.415 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64KX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP44,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.01 Amp

Minimum Standby Voltage:

3.14 V

Sub-Category:

SRAMs

Maximum Supply Current:

130 mA

Maximum Supply Voltage (Vsup):

3.63 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.16 mm

Trade Compliance

IS61LV6416-10TLI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.B

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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