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IS42S16400J-7BLI-TR

Integrated Silicon Solution

IS42S16400J-7BLI-TR by Integrated Silicon Solution

IS42S16400J-7BLI-TR by Integrated Silicon Solution is a 4MX16 Synchronous DRAM with 3.3V supply, 143 MHz clock frequency, and -40 to 85°C operating temp. Ideal for industrial applications requiring high memory density and fast access times.

Median Price

$1.710

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 6,657 parts In-Stock

1+ parts

$3.050

100+ parts

$2.400

1k+ parts

$2.160

10k+ parts

$2.100

6,657

$3.050

$2.400

$2.160

$2.100

Chip1Stop

Japan . 22,500 parts In-Stock

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Verical

USA . 15,000 parts In-Stock

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$1.710

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$1.710

Arrow

USA . 5,000 parts In-Stock

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$1.710

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$1.710

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Nova Conductors

Japan . 100 parts In-Stock

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$1.800

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100

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Vyrian

USA . 11,829 parts In-Stock

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Chip Stock

USA . 10,970 parts In-Stock

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NAC Semi

USA . 10,000 parts In-Stock

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GLYN GmbH & Co. KG

Germany . 5,000 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 5,126 parts In-Stock

1+ parts

$1.800

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$1.764

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$1.800

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Argo Parts USA

USA . 2,739 parts In-Stock

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$1.800

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Netroflash

USA . 500 parts In-Stock

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$1.800

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$1.800

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Aztec Data Supply Inc.

USA . 3,317 parts In-Stock

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$4.030

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Corohmni

South Africa . 180 parts In-Stock

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$4.658

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Eastek

USA . 15,000 parts In-Stock

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Perfect Parts

USA . 8,400 parts In-Stock

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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GreenTree Electronics

Israel . 7,500 parts In-Stock

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Lixinc

USA . 6,891 parts In-Stock

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Futuretech Components

Singapore . 2,500 parts In-Stock

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Overview

Experience seamless performance and reliability with the IS42S16400J-7BLI-TR by Integrated Silicon Solution. As a leading manufacturer in the industry, ISS delivers top-notch DRAM products that cater to various applications. With a focus on quality and innovation, this product offers customers unparalleled value and benefits, ensuring efficient operations and enhanced user experience. Upgrade your system today with the IS42S16400J-7BLI-TR and enjoy the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications without adding unnecessary weight.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a low supply voltage of 3.3V helps in reducing power consumption and heat generation, improving overall energy efficiency.

Maximum Clock Frequency (fCLK): 143 MHz

With a high maximum clock frequency, this product can handle fast data processing and operations, making it suitable for high-performance applications.

Technology: CMOS

Being based on CMOS technology enables lower power consumption, faster switching speeds, and higher integration levels, enhancing the efficiency of the product.

Memory Density: 67108864 bit

The high memory density allows for storing a large amount of data in a compact form factor, making it ideal for applications that require high data storage capacity.

Memory IC Type: SYNCHRONOUS DRAM

Synchronous DRAM technology offers faster data access speeds and improved performance compared to traditional DRAM, making this product suitable for demanding computing tasks.

Technical Specifications

DRAM IS42S16400J-7BLI-TR attributes and parameters. Explore more DRAM devices from Integrated Silicon Solution

Specs

Maximum Access Time:

5.4 ns

Maximum Clock Frequency (fCLK):

143 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

1,2,4,8

JESD-30 Code:

S-PBGA-B54

JESD-609 Code:

e1

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

54

No. of Words:

4194304 words

No. of Words Code:

4M

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA54,9X9,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Refresh Cycles:

Sequential Burst Length:

1,2,4,8,FP

Maximum Standby Current:

.002 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

130 mA

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

IS42S16400J-7BLI-TR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.02

SB

8542.32.00.15

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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