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IS42S16400J-6BLI

Integrated Silicon Solution

IS42S16400J-6BLI by Integrated Silicon Solution

IS42S16400J-6BLI by Integrated Silicon Solution is a 4MX16 Synchronous DRAM with a max clock frequency of 166 MHz. It operates in an industrial temperature grade range and has a memory density of 67108864 bits. This memory IC type is commonly used in applications requiring high-speed data storage and retrieval.

Median Price

$2.480

Lifecycle Status

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9

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1k+

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Mouser Electronics

USA . 14,866 parts In-Stock

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$2.590

100+ parts

$2.050

1k+ parts

$1.960

10k+ parts

$1.800

14,866

$2.590

$2.050

$1.960

$1.800

Verical

USA . 348 parts In-Stock

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$1.879

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348

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Rochester

USA . 274 parts In-Stock

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$2.480

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$2.220

10k+ parts

$2.090

274

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$2.220

$2.090

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Nova Conductors

Japan . 50 parts In-Stock

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$2.230

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$2.230

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Chip Stock

USA . 13,700 parts In-Stock

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Vyrian

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Bristol Electronics

USA . 450 parts In-Stock

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$1.777

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$1.561

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$1.561

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LIBRA Elektronik GmbH

Germany . 348 parts In-Stock

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ComSIT Distribution GmbH

Germany . 5 parts In-Stock

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Component Stockers USA

USA . 32,806 parts In-Stock

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$2.160

100+ parts

$1.910

1k+ parts

$1.550

10k+ parts

$1.480

32,806

$2.160

$1.910

$1.550

$1.480

Continental Prestige Electronics

USA . 6,604 parts In-Stock

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$2.230

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$2.185

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Argo Parts USA

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Aztec Data Supply Inc.

USA . 247 parts In-Stock

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$3.298

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Corohmni

South Africa . 252 parts In-Stock

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Authorized Procurement Solutions

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Netroflash

USA . 2,000 parts In-Stock

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$2.185

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$2.118

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$2.073

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$2.073

Perfect Parts

USA . 84 parts In-Stock

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Overview

Experience superior performance and reliability with the IS42S16400J-6BLI by Integrated Silicon Solution. As a leading manufacturer in the industry, Integrated Silicon Solution is known for delivering top-quality products. The IS42S16400J-6BLI belongs to the DRAM category, offering endless possibilities for various applications. With its synchronous operation, common input/output type, and self-refresh capability, this product ensures efficient and seamless performance. Its compact and durable plastic/epoxy body, surface mount compatibility, and thin profile package make it easy to integrate into your designs. Trust the IS42S16400J-6BLI to provide exceptional value and benefits, enhancing your overall user experience. Embrace innovation and elevate your projects with this cutting-edge solution from Integrated Silicon Solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's package body material is made of plastic/epoxy, which provides a sturdy and reliable construction, ensuring the durability and longevity of the DRAM.

Surface Mount: YES

With surface mount capabilities, this DRAM can be easily mounted onto the surface of a printed circuit board, allowing for a more streamlined and efficient assembly process.

No. of Functions: 1

This DRAM has a single function, simplifying its integration into various electronic devices and systems.

Package Shape: SQUARE

The square package shape of this DRAM allows for easier placement and alignment on a PCB, facilitating the assembly process and optimizing space utilization.

Operating Mode: SYNCHRONOUS

This DRAM operates in synchronous mode, enabling faster and more efficient data transfer and synchronization with the host system.

Self Refresh: YES

With self-refresh capabilities, this DRAM can automatically refresh its memory cells, eliminating the need for external refreshing mechanisms and reducing power consumption.

Input/Output Type: COMMON

The common input/output type of this DRAM ensures compatibility with a wide range of digital systems, making it a versatile and convenient choice for various applications.

Nominal Supply Voltage / Vsup (V): 3.3

This DRAM operates at a nominal supply voltage of 3.3V, providing a stable and efficient power source for reliable performance.

No. of Terminals: 54

With 54 terminals, this DRAM offers multiple connection points for seamless integration within a system, enhancing connectivity and data transfer efficiency.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style of this DRAM allows for compact and space-saving designs, making it an ideal choice for small form factor devices.

Maximum Operating Temperature: 85 °C

This DRAM can operate reliably in high-temperature environments up to 85°C, ensuring consistent performance even under challenging conditions.

Organization: 4MX16

With an organization of 4MX16, this DRAM has a high memory capacity and provides efficient storage and retrieval of data, making it suitable for demanding applications.

Output Characteristics: 3-STATE

The 3-STATE output characteristics of this DRAM allow for flexible control and manipulation of the output signals, providing versatility in system design and integration.

Minimum Operating Temperature: -40 °C

This DRAM can operate in extremely low-temperature environments down to -40°C, making it suitable for applications in harsh and demanding conditions.

Terminal Position: BOTTOM

The terminal position at the bottom of this DRAM ensures easy and secure connectivity within a system, optimizing signal transfer and reducing the risk of disconnection.

No. of Ports: 1

With a single port, this DRAM simplifies the design and integration process, making it a cost-effective choice for applications with a lower number of data transfer requirements.

Maximum Seated Height: 1.2 mm

This DRAM has a maximum seated height of 1.2 mm, providing a low-profile design that enables its use in compact devices with limited vertical space.

Maximum Clock Frequency (fCLK): 166 MHz

The maximum clock frequency of 166 MHz allows for fast and efficient data processing, enabling smooth operation and enhanced system performance.

Width: 8 mm

With a width of 8 mm, this DRAM offers a compact size that facilitates easy integration into various electronic systems with limited space availability.

Minimum Supply Voltage (Vsup): 3 V

This DRAM requires a minimum supply voltage of 3V, ensuring stable and sufficient power supply for reliable operation and data retention.

Length: 8 mm

The length of 8 mm makes this DRAM compatible with standard electronic board sizes, simplifying its integration into existing systems.

Temperature Grade: INDUSTRIAL

Built to withstand industrial temperature ranges, this DRAM is designed for reliable operation in demanding environments, making it suitable for industrial applications.

Access Mode: FOUR BANK PAGE BURST

The four-bank page burst access mode of this DRAM allows for efficient and rapid access to multiple memory banks, enhancing overall system performance.

Technology: CMOS

Built using CMOS technology, this DRAM offers low power consumption, high speed, and excellent noise immunity, making it an energy-efficient and reliable choice.

Terminal Form: BALL

The ball terminal form of this DRAM ensures reliable electrical connections and ease of soldering during the assembly process, enhancing component reliability and manufacturing efficiency.

Maximum Supply Current: 80 mA

With a maximum supply current of 80 mA, this DRAM operates with low power consumption, improving energy efficiency and prolonging battery life in battery-powered devices.

No. of Words: 4194304 words

This DRAM has a high number of words (4194304), allowing for a large amount of data storage and efficient retrieval, suitable for high-performance applications.

Sequential Burst Length: 1,2,4,8,FP

The sequential burst length options of 1, 2, 4, 8, and full page (FP) provide flexibility in data transfer and retrieval, accommodating various system requirements.

Memory Width: 16

With a memory width of 16, this DRAM offers high-speed data transfer and processing capabilities, making it suitable for applications that require large data bandwidth.

Terminal Pitch: 0.8 mm

The terminal pitch of 0.8 mm enables precise and secure connections, ensuring reliable operation and minimizing the risk of signal distortion or loss.

No. of Words Code: 4M

The 4M words code indicates a large memory capacity, enabling extensive data storage and handling capabilities, making it suitable for memory-intensive applications.

Maximum Supply Voltage (Vsup): 3.6 V

This DRAM can operate reliably at a maximum supply voltage of 3.6V, allowing for flexibility in power supply configurations and ensuring stable performance.

Memory Density: 67108864 bit

With a memory density of 67108864 bits, this DRAM offers large storage capacity, accommodating vast amounts of data and supporting memory-intensive applications.

Memory IC Type: SYNCHRONOUS DRAM

This DRAM belongs to the synchronous DRAM type, providing fast and efficient access to stored data, making it suitable for high-performance computing and multimedia applications.

Refresh Cycles: 4096

With a refresh cycle of 4096, this DRAM ensures data integrity and retention over extended periods, maintaining the reliability and accuracy of stored information.

Interleaved Burst Length: 1,2,4,8

The interleaved burst length options of 1, 2, 4, and 8 offer flexibility in data transfer and retrieval, allowing for optimized performance and efficient memory utilization.

Maximum Access Time: 5.4 ns

With a maximum access time of 5.4 ns, this DRAM offers fast and responsive data access, ensuring smooth and efficient operation of the overall system.

Technical Specifications

DRAM IS42S16400J-6BLI attributes and parameters. Explore more DRAM devices from Integrated Silicon Solution

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

5.4 ns

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

166 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

1,2,4,8

JESD-30 Code:

S-PBGA-B54

Length:

8 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

54

No. of Words:

4194304 words

No. of Words Code:

4M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA54,9X9,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Refresh Cycles:

Reverse Pinout:

NO

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

1,2,4,8,FP

Maximum Supply Current:

80 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

IS42S16400J-6BLI Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.02

SB

8542.32.00.15

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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