Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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IS29GL128-70SLA3T by Integrated Silicon Solution is a 128M Flash Memory with 134217728-bit density. Operating at 3V, it offers fast access time of 70ns. Ideal for automotive applications due to AEC-Q100 screening and wide temperature range from -40°C to 125°C.
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This material provides good durability and thermal resistance, making the product reliable for various applications.
With a large number of logic cells, this FPGA can handle complex computations and processes efficiently.
Being surface mountable makes it easier to integrate this FPGA into electronic designs without the need for additional mounting hardware.
This voltage range ensures compatibility with a wide range of power supply systems and helps in reducing power consumption.
CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the FPGA energy-efficient and reliable.
With a high number of inputs, this FPGA can accommodate a large amount of data input, making it suitable for demanding applications.
The square package shape offers efficient use of space on circuit boards, optimizing the layout and design of electronic systems.
The ball terminals provide a reliable connection and are suitable for high-density packaging, ensuring stable performance.
The nominal supply voltage of 1.1V is commonly used in electronic systems, ensuring compatibility with existing components.
Support for multiple power supply voltages allows flexibility in system design and compatibility with different voltage requirements.
A high number of terminals offer connectivity options and flexibility in circuit design, allowing for versatile applications.
Being field-programmable means that this FPGA can be customized and reconfigured as needed, providing flexibility in design and functionality.
The grid array package style provides reliable electrical connections and efficient heat dissipation, enhancing the overall performance of the FPGA.
The minimum supply voltage of 1.07V ensures operational stability and reliability, even under low voltage conditions.
The 1mm pitch of terminals enables high-density packaging and efficient use of space on PCBs, improving overall system integration.
The use of tin, silver, and copper finishing on terminals ensures good conductivity, corrosion resistance, and solderability, enhancing the durability and reliability of the FPGA.
Bottom-positioned terminals facilitate easy and secure PCB mounting, ensuring stable connections and reliable performance.
MSL 3 indicates that this FPGA has a moderate level of moisture sensitivity, making it suitable for a wide range of environmental conditions.
The low seated height of 2mm allows for compact and slim device designs, maximizing space efficiency in electronic systems.
The width of 27mm provides a good balance between size and functionality, making this FPGA suitable for various applications.
With a high number of outputs, this FPGA can deliver data and signals efficiently, enabling seamless communication with external devices.
This FPGA can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering and assembly in manufacturing processes.
With a peak reflow temperature of 260°C, this FPGA can withstand the high temperatures required for soldering, ensuring proper assembly on PCBs.
The length of 27mm offers a compact form factor, allowing for efficient space utilization in electronic designs without compromising on performance.
Flash Memory IS29GL128-70SLA3T attributes and parameters. Explore more Flash Memory devices from Integrated Silicon Solution
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IS29GL128-70SLA3T Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.
BSS138
Calogic
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Drain Current (Abs) (ID): .2 A;
1N4148
Itt Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3 ohm; Minimum DS Breakdown Voltage: 50 V; Terminal Form: GULL WING;
LM317T
Micro Commercial Components
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Moisture Sensitivity Level (MSL): 1; Maximum Output Current-1: 1.5 A; Operating Temperature (TJ-Min): 0 Cel;
BAV99
Kec
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317AEMP/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: SOP; Terminal Form: GULL WING; Qualification Status: Not Qualified; Width: 3.56 mm;
SMBJ18CA
Silicon Standard
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Feedback Capacitance (Crss): 10 pF; JEDEC-95 Code: TO-236AB;
SS14
Zowie Technology
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Operating Temperature: 125 Cel; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: 30 A;
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 175 Cel; Maximum Reverse Recovery Time: .004 us; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V;
LM358N
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Formosa Microsemi
ULN2803ADWR
Texas Instruments
ULN2803ADWR by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates b/w -40 to 85°C, has a max supply voltage of 3V, and is ideal for buffer or inverter-based applications requiring sink current flow direction.
Eic Semiconductor
LM107H
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
1N4148WS
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Crimson Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
2N7002
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Package Shape: RECTANGULAR;
S29GL256P90TFIR20
Spansion
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: HTSSOP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
S25FL128SAGNFI010
Cypress Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
S25FL128SAGNFI011
Infineon Technologies
S25FL128SAGNFI011 by Infineon is a NOR type flash memory with 32Mx4 organization, operating at 133MHz. It has a small outline package, synchronous mode, and supports SPI serial bus type. Ideal for industrial applications requiring high endurance with 100k write/erase cycles.
AT45DB321D-SU-SL954
Adesto Technologies
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Programming Voltage (V): 2.7;
S70FL01GSAGMFI013
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: MATTE TIN;
S25FL128SAGNFI000
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; JESD-609 Code: e3;
S25FL256LAGNFM010
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V;
AT45DB021E-SSHN-T
Dialog Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Data Retention Time: 20;
AM29F010B-70JF
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Standby Current: .000005 Amp;
SST25VF040B-50-4C-S2AF
Microchip Technology
SST25VF040B-50-4C-S2AF by Microchip Technology is a 4Mx1 NOR type flash memory with 50MHz clock frequency. It operates at 3/3.3V, has 8 terminals, and supports SPI serial bus type. Ideal for applications requiring high-speed synchronous operation and software write protection in commercial temperature grade environments.
MT25QU02GCBB8E12-0AAT
Micron Technology
MT25QU02GCBB8E12-0AAT by Micron Technology is a 256MX8 flash memory with 166 MHz clock frequency, operating at 1.8V. It features a thin profile grid array package suitable for industrial applications requiring high-speed synchronous operation and reliable data storage in harsh environments.
AT45DB161E-SSHD2B-T
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.5 V;
AT45DB321D-SU
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
M29W160ET70N6E
STMicroelectronics
STMicroelectronics M29W160ET70N6E is a 1MX16 NOR Flash Memory with 3V supply, operating at -40 to 85°C. It features asynchronous mode, 70ns access time, and 16Mbit memory density. Ideal for industrial applications requiring fast data access and reliable non-volatile storage.
AT25DF081A-SSH-B
Renesas Electronics
Renesas Electronics' AT25DF081A-SSH-B is a 1MX8 NOR type flash memory with 85MHz clock frequency and SPI serial bus. It operates at -40 to 85 °C, has 100000 write/erase cycles endurance, and supports hardware/software write protection. Ideal for industrial applications requiring high-speed data storage in compact devices.
S25FL128SAGMFIG01
S25FL128SAGMFIG01 by Infineon is a 16MX8 NOR flash memory with 133 MHz clock frequency, SPI serial bus type, and 100000 write/erase cycles. It is ideal for industrial applications requiring high-speed data storage in small outline packages.
S25FL512SAGMFIG11
S25FL512SAGMFIG11 by Infineon Technologies is a 64MX8 NOR type flash memory with 512753664 bit density. It operates at 3V, has a clock frequency of 133 MHz, and offers 100000 write/erase cycles. Ideal for industrial applications requiring high-speed synchronous operation in small outline packages.
IS25WP128-JBLE
Integrated Silicon Solution
IS25WP128-JBLE by Integrated Silicon Solution is a 128M Flash Memory with 134217728 bit memory density. It operates at 133 MHz clock frequency, has 1.8V programming voltage, and supports serial communication. Ideal for industrial applications requiring reliable data storage in a compact form factor.
S25FL127SABMFI101
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: SQUARE; Minimum Data Retention Time: 20;
SDINBDG4-8G-ZA
Western Digital
SDINBDG4-8G-ZA by Western Digital is a 8GX8 MLC NAND flash memory with 68719476736 bit density. It operates in industrial temperature range (-40 to 105 °C) and uses synchronous mode at 3.3V supply voltage. Ideal for applications requiring high-speed, reliable data storage in compact devices.
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IS29GL128-70SLA3B
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
IS29GL128-70SLA3H
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Memory Width: 1;
IS29GL128-70SLEB
IS29GL128-70SLEB by Integrated Silicon Solution is a 128M Flash Memory with 134217728-bit memory density. It operates at 3V, has a max access time of 70ns, and supports asynchronous mode. Ideal for industrial applications requiring high-speed parallel memory with a small outline package design.
IS29GL128-70SLEB-TR
FLASH; Programming Voltage (V): 3; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
IS29GL128-70SLEH
IS29GL128-70SLEH by Integrated Silicon Solution is a 128MX1 Flash Memory with a max access time of 70 ns. It operates in an asynchronous mode and has a memory density of 134217728 bits. This memory IC type is commonly used in industrial applications requiring fast and reliable data storage.
IS29GL128-70SLEL
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
IS29GL128-70SLET
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH;
IS29GL128-70SLA3L
IS29GL256-70SLET
IS29GL256-70SLET by Integrated Silicon Solution is a 256M Flash Memory with 268435456-bit memory density. It operates at 3V, has an access time of 70ns, and supports asynchronous mode. Ideal for industrial applications requiring high-speed parallel memory solutions.
IS29GL128-70DLA3B
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 64; Package Code: LBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B64;
IS29GL128-70FLA3B
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; JESD-609 Code: e3;
IS29GL128-70FLA3T
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
IS29GL128-70FLEB
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
IS29GL128-70FLET
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; No. of Functions: 1;
IS29GL128-70DLA3H
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 64; Package Code: LBGA; Package Shape: SQUARE; Terminal Finish: TIN;
IS29GL128-70DLA3L
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 64; Package Code: LBGA; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 2.7 V;
IS29GL128-70FLA3H
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; No. of Words Code: 128M;
IS29GL128-70FLA3L
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Memory Width: 1;
IS29GL128-70FLEH
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V;
IS29GL128-70FLEL
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
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