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IS29GL128-70SLA3T

Integrated Silicon Solution

IS29GL128-70SLA3T by Integrated Silicon Solution

IS29GL128-70SLA3T by Integrated Silicon Solution is a 128M Flash Memory with 134217728-bit density. Operating at 3V, it offers fast access time of 70ns. Ideal for automotive applications due to AEC-Q100 screening and wide temperature range from -40°C to 125°C.

Median Price

$9.066

Lifecycle Status

Suppliers In-Stock

5

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< 1k

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 96 parts In-Stock

1+ parts

$10.142

100+ parts

$7.989

1k+ parts

$7.677

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96

$10.142

$7.989

$7.677

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EBV Elektronik

Germany . 102 parts In-Stock

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102

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Verical

USA . 96 parts In-Stock

1+ parts

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$7.989

1k+ parts

$7.677

10k+ parts

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96

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$7.989

$7.677

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Distributors (In-Stock)

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Vyrian

USA . 340 parts In-Stock

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340

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Nova Conductors

Japan . 100 parts In-Stock

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100

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AZTECH Wire

Italy . 340 parts In-Stock

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$6.378

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340

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Argo Parts USA

USA . 4,285 parts In-Stock

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Continental Prestige Electronics

USA . 2,940 parts In-Stock

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Bastille Electronics

Australia . 46 parts In-Stock

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Overview

Unlock the power of reliable and high-quality flash memory with the IS29GL128-70SLA3T by Integrated Silicon Solution. As a trusted manufacturer in the industry, ISS offers top-notch products that meet stringent standards, making this flash memory ideal for a wide range of applications. Experience seamless performance, durability, and versatility with this cutting-edge technology. Upgrade your devices with the IS29GL128-70SLA3T and enjoy the benefits of reliable storage solutions that enhance efficiency and productivity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and thermal resistance, making the product reliable for various applications.

No. of Logic Cells: 50000

With a large number of logic cells, this FPGA can handle complex computations and processes efficiently.

Surface Mount: YES

Being surface mountable makes it easier to integrate this FPGA into electronic designs without the need for additional mounting hardware.

Maximum Supply Voltage: 1.13 V

This voltage range ensures compatibility with a wide range of power supply systems and helps in reducing power consumption.

Technology Used: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the FPGA energy-efficient and reliable.

No. of Inputs: 368

With a high number of inputs, this FPGA can accommodate a large amount of data input, making it suitable for demanding applications.

Package Shape: SQUARE

The square package shape offers efficient use of space on circuit boards, optimizing the layout and design of electronic systems.

Form Of Terminal: BALL

The ball terminals provide a reliable connection and are suitable for high-density packaging, ensuring stable performance.

Nominal Supply Voltage (V): 1.1

The nominal supply voltage of 1.1V is commonly used in electronic systems, ensuring compatibility with existing components.

Power Supplies (V): 1.1,1.2/3.3,2.5

Support for multiple power supply voltages allows flexibility in system design and compatibility with different voltage requirements.

No. of Terminals: 672

A high number of terminals offer connectivity options and flexibility in circuit design, allowing for versatile applications.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being field-programmable means that this FPGA can be customized and reconfigured as needed, providing flexibility in design and functionality.

Package Style (Meter): GRID ARRAY

The grid array package style provides reliable electrical connections and efficient heat dissipation, enhancing the overall performance of the FPGA.

Minimum Supply Voltage: 1.07 V

The minimum supply voltage of 1.07V ensures operational stability and reliability, even under low voltage conditions.

Pitch Of Terminal: 1 mm

The 1mm pitch of terminals enables high-density packaging and efficient use of space on PCBs, improving overall system integration.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin, silver, and copper finishing on terminals ensures good conductivity, corrosion resistance, and solderability, enhancing the durability and reliability of the FPGA.

Position Of Terminal: BOTTOM

Bottom-positioned terminals facilitate easy and secure PCB mounting, ensuring stable connections and reliable performance.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that this FPGA has a moderate level of moisture sensitivity, making it suitable for a wide range of environmental conditions.

Maximum Seated Height: 2 mm

The low seated height of 2mm allows for compact and slim device designs, maximizing space efficiency in electronic systems.

Width: 27 mm

The width of 27mm provides a good balance between size and functionality, making this FPGA suitable for various applications.

No. of Outputs: 368

With a high number of outputs, this FPGA can deliver data and signals efficiently, enabling seamless communication with external devices.

Maximum Time At Peak Reflow Temperature (s): 30

This FPGA can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering and assembly in manufacturing processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this FPGA can withstand the high temperatures required for soldering, ensuring proper assembly on PCBs.

Length: 27 mm

The length of 27mm offers a compact form factor, allowing for efficient space utilization in electronic designs without compromising on performance.

Technical Specifications

Flash Memory IS29GL128-70SLA3T attributes and parameters. Explore more Flash Memory devices from Integrated Silicon Solution

Specs

Maximum Access Time:

70 ns

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e3

Length:

18.4 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

56

No. of Words:

134217728 words

No. of Words Code:

128M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128MX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Programming Voltage (V):

3

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

14 mm

Trade Compliance

IS29GL128-70SLA3T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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