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IS29GL128-70SLET

Integrated Silicon Solution

IS29GL128-70SLET by Integrated Silicon Solution

IS29GL128-70SLET by Integrated Silicon Solution is a 128M Flash Memory with 134217728 bit density. It operates at 3V, has 70ns access time, and supports asynchronous mode. Ideal for industrial applications requiring high-speed parallel memory with small form factor.

Median Price

$4.840

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 768 parts In-Stock

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768

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$4.840

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$4.840

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Chip Stock

USA . 14,180 parts In-Stock

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Vyrian

USA . 11,541 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 1,418 parts In-Stock

1+ parts

$4.840

100+ parts

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$4.743

1,418

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$4.743

Argo Parts USA

USA . 3,891 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$4.743

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$4.598

10k+ parts

$4.501

50

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$4.743

$4.598

$4.501

Overview

Unlock the power of reliable and high-performance flash memory with the IS29GL128-70SLET by Integrated Silicon Solution. Trusted for its quality and durability, ISSI's flash memory is perfect for a wide range of applications. Whether you're looking to boost your device's storage capacity or improve its performance, this product offers unparalleled value and benefits. Trust in ISSI's expertise and elevate your technology experience today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures the product is well protected and can withstand various environmental conditions.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into circuit boards.

Nominal Supply Voltage / Vsup (V): 3

Operating at a standard voltage of 3V ensures compatibility with a wide range of devices.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this product is suitable for industrial use where heat can be a concern.

Organization: 128MX1

The organization of 128MX1 offers a high memory capacity and efficient data storage.

Technology: CMOS

CMOS technology provides low power consumption and high-speed operation, making the product energy-efficient.

Technical Specifications

Flash Memory IS29GL128-70SLET attributes and parameters. Explore more Flash Memory devices from Integrated Silicon Solution

Specs

Maximum Access Time:

70 ns

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e3

Length:

18.4 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

56

No. of Words:

134217728 words

No. of Words Code:

128M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128MX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Programming Voltage (V):

3

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

14 mm

Trade Compliance

IS29GL128-70SLET Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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