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XC167CI32F40FBBAKXQMA1

Infineon Technologies

XC167CI32F40FBBAKXQMA1 by Infineon Technologies

Infineon's XC167CI32F40FBBAKXQMA1 microcontroller features 16-bit address and external data bus width, with a max clock frequency of 16 MHz. Ideal for automotive applications, it offers Flash ROM programmability, 103 I/O lines, and PWM channels for versatile control in a compact square package.

Median Price

$44.505

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 160 parts In-Stock

1+ parts

$44.505

100+ parts

$41.446

1k+ parts

$41.055

10k+ parts

-

160

$44.505

$41.446

$41.055

-

Verical

USA . 160 parts In-Stock

1+ parts

$44.505

100+ parts

$41.446

1k+ parts

$41.055

10k+ parts

-

160

$44.505

$41.446

$41.055

-

Chip1Stop

Japan . 160 parts In-Stock

1+ parts

$45.344

100+ parts

$42.217

1k+ parts

-

10k+ parts

-

160

$45.344

$42.217

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 67 parts In-Stock

1+ parts

$32.336

100+ parts

-

1k+ parts

-

10k+ parts

-

67

$32.336

-

-

-

Digiode

USA . 51 parts In-Stock

1+ parts

$42.280

100+ parts

-

1k+ parts

-

10k+ parts

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51

$42.280

-

-

-

Chip Stock

USA . 3,125 parts In-Stock

1+ parts

-

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-

1k+ parts

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3,125

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Vyrian

USA . 2,445 parts In-Stock

1+ parts

-

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-

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2,445

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 570 parts In-Stock

1+ parts

$9.511

100+ parts

-

1k+ parts

-

10k+ parts

-

570

$9.511

-

-

-

Continental Prestige Electronics

USA . 3,951 parts In-Stock

1+ parts

$30.490

100+ parts

-

1k+ parts

-

10k+ parts

$29.880

3,951

$30.490

-

-

$29.880

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$32.336

100+ parts

$31.689

1k+ parts

-

10k+ parts

-

2,000

$32.336

$31.689

-

-

Advanced Electronics

New Zealand . 85 parts In-Stock

1+ parts

$37.623

100+ parts

$35.742

1k+ parts

$35.742

10k+ parts

-

85

$37.623

$35.742

$35.742

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Ampacity Inc.

Singapore . 160 parts In-Stock

1+ parts

$37.830

100+ parts

-

1k+ parts

-

10k+ parts

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160

$37.830

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-

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Semicontronic

India . 160 parts In-Stock

1+ parts

$37.830

100+ parts

$36.884

1k+ parts

$36.695

10k+ parts

-

160

$37.830

$36.884

$36.695

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Corphita

USA . 302 parts In-Stock

1+ parts

$40.054

100+ parts

-

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302

$40.054

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-

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Aztec Data Supply Inc.

USA . 5,179 parts In-Stock

1+ parts

$45.260

100+ parts

-

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5,179

$45.260

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Microchip USA

USA . 1,474 parts In-Stock

1+ parts

$64.705

100+ parts

-

1k+ parts

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1,474

$64.705

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-

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Corohmni

South Africa . 678 parts In-Stock

1+ parts

$79.224

100+ parts

-

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10k+ parts

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678

$79.224

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Modulus Dynamics

Lithuania . 2,278 parts In-Stock

1+ parts

$85.900

100+ parts

$82.464

1k+ parts

$79.028

10k+ parts

-

2,278

$85.900

$82.464

$79.028

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Robosynatics

Brazil . 3,845 parts In-Stock

1+ parts

-

100+ parts

$72.149

1k+ parts

$70.676

10k+ parts

$70.676

3,845

-

$72.149

$70.676

$70.676

Lucentia Tech

USA . 3,845 parts In-Stock

1+ parts

-

100+ parts

$72.149

1k+ parts

$70.676

10k+ parts

$70.676

3,845

-

$72.149

$70.676

$70.676

Argo Parts USA

USA . 3,134 parts In-Stock

1+ parts

-

100+ parts

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3,134

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Overview

Unlock the power of innovative technology with the XC167CI32F40FBBAKXQMA1 microcontroller by Infineon Technologies. Designed with precision and reliability, this microcontroller is perfect for a wide range of applications in the automotive industry. With its advanced features and high-quality construction, Infineon ensures that customers receive top-notch performance and value. Experience seamless operation and cutting-edge functionality with Infineon's XC167CI32F40FBBAKXQMA1 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various environments.

ADC Channels: YES

Having Analog-to-Digital Converter (ADC) channels allows the microcontroller to interface with analog sensors and inputs, increasing its versatility.

Maximum Clock Frequency: 16 MHz

A higher clock frequency allows for faster processing speeds, making the microcontroller more efficient in handling tasks.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

ROM Programmability: FLASH

The ability to programm the Read-Only Memory (ROM) using FLASH technology allows for easy updates and modifications to the microcontroller's firmware.

Technical Specifications

Microcontrollers XC167CI32F40FBBAKXQMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

16

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

103

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.35 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

XC167CI32F40FBBAKXQMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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