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XC164CS32F40FBBAFXQMA1

Infineon Technologies

XC164CS32F40FBBAFXQMA1 by Infineon Technologies

Infineon's XC164CS32F40FBBAFXQMA1 is a 16-bit microcontroller with 8KB RAM, 262144 ROM words, and 14 ADC channels. Ideal for applications requiring low power consumption, it features CAN, SPI, SSC connectivity and operates at up to 16MHz clock frequency.

Median Price

$28.032

Lifecycle Status

EOL

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 7 parts In-Stock

1+ parts

$31.150

100+ parts

$23.410

1k+ parts

-

10k+ parts

-

7

$31.150

$23.410

-

-

Element14

Singapore . 104 parts In-Stock

1+ parts

$33.600

100+ parts

$26.460

1k+ parts

-

10k+ parts

-

104

$33.600

$26.460

-

-

EBV Elektronik

Germany . 5,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,400

-

-

-

-

Rochester

USA . 215 parts In-Stock

1+ parts

-

100+ parts

$19.930

1k+ parts

$17.830

10k+ parts

$16.780

215

-

$19.930

$17.830

$16.780

Verical

USA . 215 parts In-Stock

1+ parts

-

100+ parts

$24.913

1k+ parts

$22.288

10k+ parts

$20.975

215

-

$24.913

$22.288

$20.975

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 732 parts In-Stock

1+ parts

$12.930

100+ parts

-

1k+ parts

-

10k+ parts

-

732

$12.930

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$26.360

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$26.360

-

-

-

Vyrian

USA . 8,763 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,763

-

-

-

-

Chip Stock

USA . 3,583 parts In-Stock

1+ parts

-

100+ parts

-

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3,583

-

-

-

-

Flip Electronics

USA . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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300

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 381 parts In-Stock

1+ parts

$11.570

100+ parts

$11.281

1k+ parts

$11.223

10k+ parts

-

381

$11.570

$11.281

$11.223

-

Ampacity Inc.

Singapore . 206 parts In-Stock

1+ parts

$11.570

100+ parts

-

1k+ parts

-

10k+ parts

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206

$11.570

-

-

-

Corphita

USA . 282 parts In-Stock

1+ parts

$12.249

100+ parts

-

1k+ parts

-

10k+ parts

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282

$12.249

-

-

-

Continental Prestige Electronics

USA . 104 parts In-Stock

1+ parts

$16.670

100+ parts

$12.940

1k+ parts

-

10k+ parts

-

104

$16.670

$12.940

-

-

Corohmni

South Africa . 864 parts In-Stock

1+ parts

$21.262

100+ parts

-

1k+ parts

-

10k+ parts

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864

$21.262

-

-

-

Bastille Electronics

Australia . 700 parts In-Stock

1+ parts

$26.360

100+ parts

$25.042

1k+ parts

-

10k+ parts

$23.460

700

$26.360

$25.042

-

$23.460

Component Stockers USA

USA . 2,470 parts In-Stock

1+ parts

$30.630

100+ parts

$23.020

1k+ parts

$23.010

10k+ parts

-

2,470

$30.630

$23.020

$23.010

-

Modulus Dynamics

Lithuania . 3,476 parts In-Stock

1+ parts

$70.629

100+ parts

$67.804

1k+ parts

$64.979

10k+ parts

-

3,476

$70.629

$67.804

$64.979

-

Microchip USA

USA . 2,287 parts In-Stock

1+ parts

$74.474

100+ parts

-

1k+ parts

-

10k+ parts

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2,287

$74.474

-

-

-

Advanced Electronics

New Zealand . 77 parts In-Stock

1+ parts

$79.891

100+ parts

$75.896

1k+ parts

$75.896

10k+ parts

-

77

$79.891

$75.896

$75.896

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Aztec Data Supply Inc.

USA . 26,714 parts In-Stock

1+ parts

$82.320

100+ parts

-

1k+ parts

-

10k+ parts

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26,714

$82.320

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Argo Parts USA

USA . 969 parts In-Stock

1+ parts

-

100+ parts

-

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969

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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500

-

-

-

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GreenTree Electronics

Israel . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Overview

Unlock the power of cutting-edge technology with the XC164CS32F40FBBAFXQMA1 microcontroller by Infineon Technologies. Crafted with precision and expertise, this device offers unparalleled performance and reliability in a wide range of applications. From automotive to industrial automation, this microcontroller delivers exceptional value and benefits to customers seeking top-notch quality and advanced features. Experience seamless connectivity, low power consumption, and high-speed processing with the XC164CS32F40FBBAFXQMA1, setting new standards in the world of microcontrollers. Step into the future of technology with this innovative solution from Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy integration into PCBs, saving space and reducing production costs.

Maximum Supply Voltage: 2.7 V

This voltage range is suitable for low power applications, making the microcontroller energy-efficient.

No. of Serial I/Os: 6

Having multiple serial I/O options allows for versatile communication capabilities with other devices in the system.

ROM Programmability: FLASH

Flash ROM programmability enables easy updating of firmware and allows for flexibility in the application development process.

Maximum Clock Frequency: 16 MHz

With a high clock frequency, the microcontroller can perform tasks quickly and efficiently, making it suitable for applications requiring fast processing.

Technical Specifications

Microcontrollers XC164CS32F40FBBAFXQMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

ADC ALSO OPERATES WITH 8-BIT RESOLUTION

Address Bus Width:

24

Bit Size:

16

Boundary Scan:

YES

CPU Family:

XC166

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

8

No. of I/O Lines:

79

No. of Serial I/Os:

6

No. of Terminals:

100

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

12288

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.35 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Connectivity:

CAN(2), SPI, SSC(2), UART, USART(2)

Peripherals:

RTC, TIMER(5), WDT

Analog To Digital Convertors:

14-Ch 10-Bit

Trade Compliance

XC164CS32F40FBBAFXQMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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