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XC161CJ16F40FBBFXQMA1

Infineon Technologies

XC161CJ16F40FBBFXQMA1 by Infineon Technologies

Infineon's XC161CJ16F40FBBFXQMA1 is a 16-bit microcontroller with 24-bit address bus width, operating at max 40 MHz clock frequency. Ideal for industrial applications, it features Flash ROM programmability, 99 I/O lines, and PWM channels for precise control in compact designs.

Median Price

$23.684

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 480 parts In-Stock

1+ parts

$20.720

100+ parts

-

1k+ parts

$19.560

10k+ parts

-

480

$20.720

-

$19.560

-

Farnell

UK . 212 parts In-Stock

1+ parts

$23.880

100+ parts

-

1k+ parts

-

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212

$23.880

-

-

-

Element14

Singapore . 215 parts In-Stock

1+ parts

$27.763

100+ parts

$20.538

1k+ parts

-

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215

$27.763

$20.538

-

-

Verical

USA . 162 parts In-Stock

1+ parts

-

100+ parts

$23.488

1k+ parts

-

10k+ parts

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162

-

$23.488

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 137 parts In-Stock

1+ parts

$18.896

100+ parts

-

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-

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137

$18.896

-

-

-

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$23.620

100+ parts

-

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150

$23.620

-

-

-

Vyrian

USA . 10,632 parts In-Stock

1+ parts

-

100+ parts

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10,632

-

-

-

-

Chip Stock

USA . 3,298 parts In-Stock

1+ parts

-

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3,298

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-

-

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ComSIT Distribution GmbH

Germany . 203 parts In-Stock

1+ parts

-

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203

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 805 parts In-Stock

1+ parts

$14.120

100+ parts

-

1k+ parts

-

10k+ parts

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805

$14.120

-

-

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Semicontronic

India . 13 parts In-Stock

1+ parts

$16.910

100+ parts

$16.487

1k+ parts

$16.403

10k+ parts

-

13

$16.910

$16.487

$16.403

-

Corphita

USA . 502 parts In-Stock

1+ parts

$17.901

100+ parts

-

1k+ parts

-

10k+ parts

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502

$17.901

-

-

-

Component Stockers USA

USA . 516 parts In-Stock

1+ parts

$19.250

100+ parts

$19.250

1k+ parts

-

10k+ parts

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516

$19.250

$19.250

-

-

Modulus Dynamics

Lithuania . 1,323 parts In-Stock

1+ parts

$21.690

100+ parts

$20.822

1k+ parts

$19.955

10k+ parts

-

1,323

$21.690

$20.822

$19.955

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Corohmni

South Africa . 202 parts In-Stock

1+ parts

$21.690

100+ parts

-

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-

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202

$21.690

-

-

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Bastille Electronics

Australia . 500 parts In-Stock

1+ parts

$23.620

100+ parts

$22.439

1k+ parts

-

10k+ parts

$21.022

500

$23.620

$22.439

-

$21.022

Continental Prestige Electronics

USA . 220 parts In-Stock

1+ parts

$23.890

100+ parts

-

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220

$23.890

-

-

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Ampacity Inc.

Singapore . 246 parts In-Stock

1+ parts

$36.800

100+ parts

-

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246

$36.800

-

-

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Aztec Data Supply Inc.

USA . 3,989 parts In-Stock

1+ parts

$38.390

100+ parts

-

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10k+ parts

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3,989

$38.390

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Microchip USA

USA . 2,892 parts In-Stock

1+ parts

$50.140

100+ parts

$49.270

1k+ parts

$48.840

10k+ parts

$48.400

2,892

$50.140

$49.270

$48.840

$48.400

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Perfect Parts

USA . 2,285 parts In-Stock

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2,285

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Argo Parts USA

USA . 939 parts In-Stock

1+ parts

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939

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Robosynatics

Brazil . 500 parts In-Stock

1+ parts

-

100+ parts

$56.671

1k+ parts

$56.671

10k+ parts

$56.671

500

-

$56.671

$56.671

$56.671

Lucentia Tech

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$56.671

1k+ parts

$56.671

10k+ parts

$56.671

500

-

$56.671

$56.671

$56.671

Overview

Unlock endless possibilities with the XC161CJ16F40FBBFXQMA1 microcontroller by Infineon Technologies. Designed with precision and reliability in mind, this cutting-edge product offers unmatched performance and efficiency in a wide range of applications. From automotive systems to industrial automation, this microcontroller delivers unparalleled value and benefits to customers seeking top-tier quality and advanced technology. Trust Infineon Technologies for all your microcontroller needs and experience the difference in innovation and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability for the microcontroller package.

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on circuit boards.

Maximum Supply Voltage: 2.7 V

Operates within a safe voltage range to prevent damage to the microcontroller.

Address Bus Width: 24

A wider address bus allows for more memory addressing capabilities and better performance.

Package Shape: SQUARE

Square package shape helps in efficient PCB layout and space utilization.

Bit Size: 16

16-bit architecture provides enhanced processing capabilities compared to lower bit sizes.

No. of Terminals: 144

Higher number of terminals allow for more connections and functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Low profile and fine pitch design aids in compact and high-density circuit designs.

Minimum Supply Voltage: 2.35 V

Low minimum supply voltage helps in energy efficiency and battery-operated applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range enables operation in extreme cold environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance.

ADC Channels: YES

Presence of ADC channels allows for analog signal processing and conversion.

Terminal Position: QUAD

Quad terminal position offers increased stability and reliability in connections.

Maximum Seated Height: 1.6 mm

Low seated height helps in space-constrained applications and compact designs.

Width: 20 mm

Compact width dimension for easy integration into various electronic devices.

External Data Bus Width: 16

16-bit external data bus width enables efficient data transfer and processing.

Maximum Clock Frequency: 40 MHz

High clock frequency allows for fast and responsive operation of the microcontroller.

Maximum Time At Peak Reflow Temperature (s): 40

Longer peak reflow temperature time allows for proper soldering and bonding during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper solder melting and connection reliability.

Length: 20 mm

Compact length dimension for space-efficient PCB layout and design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures durability and performance in harsh environments.

Peripheral IC Type: MICROCONTROLLER

Microcontroller type peripheral IC offers a wide range of digital and analog functions for various applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form offers secure and reliable electrical connections.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance and operation.

PWM Channels: YES

Presence of PWM channels allows for precise control of various output devices.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility for firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density integration and miniaturization of electronic designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microcontroller can withstand moderate levels of moisture during storage and handling.

Speed: 40 rpm

High RPM speed allows for fast processing and response times in applications.

No. of I/O Lines: 99

Ample number of I/O lines provide versatile connectivity options for interfacing with external devices.

Technical Specifications

Microcontrollers XC161CJ16F40FBBFXQMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 5V SUPPLY

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

99

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.35 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

XC161CJ16F40FBBFXQMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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