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XC161CS32F40FBBAFXUMA1

Infineon Technologies

XC161CS32F40FBBAFXUMA1 by Infineon Technologies

Infineon's XC161CS32F40FBBAFXUMA1 microcontroller features 16-bit size, 24-bit address bus width, and 16 MHz clock frequency. Ideal for industrial applications requiring a max supply voltage of 2.7V, with PWM channels and Flash ROM programmability.

Median Price

$28.104

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 5 parts In-Stock

1+ parts

$28.470

100+ parts

-

1k+ parts

-

10k+ parts

-

5

$28.470

-

-

-

Element14

Singapore . 265 parts In-Stock

1+ parts

$36.533

100+ parts

$28.779

1k+ parts

-

10k+ parts

-

265

$36.533

$28.779

-

-

Rochester

USA . 835 parts In-Stock

1+ parts

-

100+ parts

$22.190

1k+ parts

$19.860

10k+ parts

$18.690

835

-

$22.190

$19.860

$18.690

Verical

USA . 835 parts In-Stock

1+ parts

-

100+ parts

$27.738

1k+ parts

$24.825

10k+ parts

$23.363

835

-

$27.738

$24.825

$23.363

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$30.153

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$30.153

-

-

-

Digiode

USA . 833 parts In-Stock

1+ parts

$34.706

100+ parts

-

1k+ parts

-

10k+ parts

-

833

$34.706

-

-

-

Vyrian

USA . 10,291 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,291

-

-

-

-

Chip Stock

USA . 2,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,600

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 142 parts In-Stock

1+ parts

$17.450

100+ parts

-

1k+ parts

-

10k+ parts

-

142

$17.450

-

-

-

AZTECH Wire

Italy . 466 parts In-Stock

1+ parts

$21.410

100+ parts

-

1k+ parts

-

10k+ parts

-

466

$21.410

-

-

-

Continental Prestige Electronics

USA . 878 parts In-Stock

1+ parts

$30.153

100+ parts

-

1k+ parts

-

10k+ parts

$29.550

878

$30.153

-

-

$29.550

Netroflash

USA . 100 parts In-Stock

1+ parts

$30.153

100+ parts

$29.550

1k+ parts

-

10k+ parts

-

100

$30.153

$29.550

-

-

Aztec Data Supply Inc.

USA . 2,426 parts In-Stock

1+ parts

$32.820

100+ parts

-

1k+ parts

-

10k+ parts

-

2,426

$32.820

-

-

-

Corphita

USA . 3 parts In-Stock

1+ parts

$32.880

100+ parts

-

1k+ parts

-

10k+ parts

-

3

$32.880

-

-

-

Modulus Dynamics

Lithuania . 3,091 parts In-Stock

1+ parts

$43.094

100+ parts

$41.370

1k+ parts

$39.646

10k+ parts

-

3,091

$43.094

$41.370

$39.646

-

Microchip USA

USA . 2,026 parts In-Stock

1+ parts

$57.330

100+ parts

$56.330

1k+ parts

$55.830

10k+ parts

$55.330

2,026

$57.330

$56.330

$55.830

$55.330

Corohmni

South Africa . 26 parts In-Stock

1+ parts

$57.610

100+ parts

-

1k+ parts

-

10k+ parts

-

26

$57.610

-

-

-

Eastek

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$33.666

10k+ parts

-

5,000

-

-

$33.666

-

Argo Parts USA

USA . 2,915 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,915

-

-

-

-

RC Electronics

USA . 971 parts In-Stock

1+ parts

-

100+ parts

$28.890

1k+ parts

$26.370

10k+ parts

$25.580

971

-

$28.890

$26.370

$25.580

Overview

Discover the XC161CS32F40FBBAFXUMA1 by Infineon Technologies, a top-tier microcontroller designed to elevate your projects to new heights. Crafted with precision and expertise, Infineon Technologies guarantees unparalleled quality and reliability. Ideal for a wide range of applications, this innovative microcontroller offers unmatched value and benefits to customers, providing seamless performance and efficiency. Upgrade your work with the XC161CS32F40FBBAFXUMA1 and experience the advantages it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and thermal stability, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into various electronic circuits and PCB designs.

Maximum Supply Voltage: 2.7 V

Operates efficiently within a low supply voltage range, helping to conserve power and extend battery life.

Address Bus Width: 24

With a wider address bus width, the microcontroller can access a larger memory range and handle more data efficiently.

Package Shape: SQUARE

Square package shape ensures easy handling and installation, making it convenient for manufacturing and assembly processes.

Bit Size: 16

16-bit architecture allows for faster processing and handling of data, improving overall performance and responsiveness.

No. of Terminals: 144

144 terminals provide ample connectivity options for interfacing with various peripherals and components in a system.

Minimum Supply Voltage: 2.35 V

Lower minimum supply voltage ensures compatibility with a wider range of power sources and applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and performance in harsh industrial environments.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in extreme conditions without compromising functionality.

Terminal Finish: TIN

Tin terminal finish provides excellent conductivity and solderability, ensuring secure connections and reliability.

ADC Channels: YES

Integrated ADC channels enable analog signal processing and conversion, expanding the range of applications for the microcontroller.

Terminal Position: QUAD

Quad terminal position offers efficient signal routing and layout options, enhancing design flexibility and compactness.

Maximum Seated Height: 1.6 mm

Low seated height allows for compact and slim designs, ideal for space-constrained applications and portable devices.

Width: 20 mm

Compact width dimensions enable easy integration into tight spaces and PCB layouts, ensuring versatility in various hardware designs.

External Data Bus Width: 16

16-bit external data bus width facilitates high-speed data transfer and processing, improving system performance.

Maximum Clock Frequency: 16 MHz

High clock frequency allows for fast and efficient operation, enhancing overall processing speed and responsiveness.

Length: 20 mm

Compact length dimensions enable easy integration into tight spaces and PCB layouts, ensuring versatility in various hardware designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in demanding environments, making the microcontroller suitable for rugged applications.

Peripheral IC Type: MICROCONTROLLER

Dedicated microcontroller peripheral IC type ensures efficient and optimized processing of a wide range of input/output operations.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making it suitable for various battery-operated and portable devices.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable solder connections, ensuring long-lasting performance and durability.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent and reliable operation, offering compatibility with a wide range of power sources.

PWM Channels: YES

Integrated PWM channels allow for precise control of pulse-width modulation signals, enabling efficient power management and motor control.

ROM Programmability: FLASH

Flash ROM programmability enables flexible and easy firmware updates and enhancements, ensuring adaptability to changing requirements.

Terminal Pitch: 0.5 mm

Fine terminal pitch enhances soldering precision and PCB layout density, contributing to compact and efficient system designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, requiring standard precautions during handling and storage to maintain reliability.

Speed: 40 rpm

High-speed operation at 40 rpm allows for quick data processing and response, suitable for applications requiring rapid computing capabilities.

No. of I/O Lines: 99

Ample I/O lines offer extensive connectivity options for interfacing with external devices and peripherals, enhancing the versatility and functionality of the microcontroller.

Technical Specifications

Microcontrollers XC161CS32F40FBBAFXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

99

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.35 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

XC161CS32F40FBBAFXUMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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