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XC164CS32F40FBBAKXUMA1

Infineon Technologies

XC164CS32F40FBBAKXUMA1 by Infineon Technologies

Infineon Technologies' XC164CS32F40FBBAKXUMA1 is a 16-bit microcontroller with a max clock frequency of 40 MHz. It features 14-channel, 10-bit ADCs and offers connectivity options such as CAN, SPI, and USART. This automotive-grade microcontroller is suitable for applications requiring high-speed processing and analog-to-digital conversion.

Median Price

$26.275

Lifecycle Status

EOL

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

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$26.275

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50

$26.275

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Vyrian

USA . 5,011 parts In-Stock

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Chip Stock

USA . 3,380 parts In-Stock

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Digiode

USA . 544 parts In-Stock

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544

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Distributors (Availability)

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AZTECH Wire

Italy . 423 parts In-Stock

1+ parts

$8.134

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423

$8.134

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Modulus Dynamics

Lithuania . 4,364 parts In-Stock

1+ parts

$25.120

100+ parts

$24.115

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$23.110

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4,364

$25.120

$24.115

$23.110

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Corohmni

South Africa . 187 parts In-Stock

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$25.120

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$25.120

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$25.694

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$25.694

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$25.694

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2,500

$25.694

$25.694

$25.694

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Continental Prestige Electronics

USA . 6,310 parts In-Stock

1+ parts

$26.215

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$25.691

6,310

$26.215

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$25.691

Semicontronic

India . 2,429 parts In-Stock

1+ parts

$27.000

100+ parts

$26.325

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$26.190

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Ampacity Inc.

Singapore . 7,380 parts In-Stock

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$31.000

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Microchip USA

USA . 2,018 parts In-Stock

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$53.401

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$53.401

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Aztec Data Supply Inc.

USA . 28,923 parts In-Stock

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$65.970

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Lixinc

USA . 12,576 parts In-Stock

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Argo Parts USA

USA . 4,964 parts In-Stock

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Corphita

USA . 982 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$25.749

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$24.961

10k+ parts

$24.436

500

-

$25.749

$24.961

$24.436

Overview

Experience the power of the XC164CS32F40FBBAKXUMA1 by Infineon Technologies, a high-quality microcontroller designed to revolutionize your applications. With its advanced technology and extensive range of peripherals including RTC, timers, and PWM channels, this microcontroller offers unparalleled performance and flexibility. Its automotive-grade temperature grade ensures reliable operation even in extreme conditions. Whether you're designing automotive systems, industrial equipment, or consumer electronics, the XC164CS32F40FBBAKXUMA1 is the perfect choice to bring your ideas to life. Trust in Infineon Technologies, a leading manufacturer known for delivering top-notch products that exceed expectations. Elevate your designs with the XC164CS32F40FBBAKXUMA1 and unlock endless possibilities.

Feature Benefit Bullets

High Clock Frequency (40 MHz):

The microcontroller operates at a high clock frequency, allowing for faster processing and response times. This means that the product can handle complex tasks quickly, providing efficient performance to the customer.

Wide Address Bus Width (24):

With a wide address bus width, the microcontroller can access a large amount of memory, enabling it to store and retrieve more data. This benefits the customer by allowing for extensive storage and processing capabilities in their applications.

Large ROM Words (262144):

The microcontroller has a large ROM capacity, providing ample space for storing program instructions. This allows the customer to develop complex programs and algorithms without worrying about running out of memory.

Multiple Peripherals (RTC, TIMER(11), WDT(2)):

The microcontroller comes with various peripherals such as a real-time clock (RTC), timers, and watchdog timers (WDT). These peripherals enhance the functionality of the product, enabling the customer to implement time-sensitive operations and ensure system integrity.

High RAM Capacity (12288 bytes):

With a large RAM capacity, the microcontroller can efficiently store and manipulate data during program execution. This benefits the customer by enabling them to work with larger data sets and perform more complex calculations.

Analog to Digital Converters (14-Ch 10-Bit):

The microcontroller includes analog to digital converters (ADCs) with 14 channels and 10-bit resolution. This enables the customer to accurately measure and convert analog signals into digital values, expanding the range of applications that can be supported.

PWM Channels:

The microcontroller supports pulse width modulation (PWM) channels, allowing the customer to generate variable width pulses for controlling motors, LEDs, and other devices. This provides precise control over these devices, enhancing the overall functionality of the product.

Multiple Connectivity Options (CAN(2), SPI(2), USART(2)):

The microcontroller offers multiple connectivity options such as Controller Area Network (CAN), Serial Peripheral Interface (SPI), and Universal Synchronous/Asynchronous Receiver/Transmitter (USART). This enables the customer to communicate with other devices, exchange data, and integrate the product into larger systems.

Flash ROM Programmability:

The microcontroller's ROM is programmable using flash technology, allowing the customer to update or modify the program stored in memory. This provides flexibility and adaptability, as the customer can make changes to the product's functionality without needing to replace the microcontroller.

Automotive Temperature Grade:

The microcontroller is designed to operate in automotive environments, with a temperature grade specified for automotive applications. This ensures reliable performance even in extreme temperature conditions, providing peace of mind to the customer.

Small Package Size (14 mm x 14 mm):

The microcontroller has a compact package size, making it suitable for space-constrained applications. This benefits the customer by allowing them to incorporate the product into smaller devices or systems without compromising on performance.

Low Seated Height (1.6 mm):

The microcontroller has a low seated height, which is desirable for applications where space is limited. This contributes to the product's overall value by enabling its integration into thin devices or systems while maintaining a slim profile.

Wide Operating Temperature Range (-40°C to 125°C):

The microcontroller can operate within a wide temperature range, making it suitable for various environments and applications. This ensures consistent performance and reliability across different operating conditions, offering durability and versatility to the customer.

Moisture Sensitivity Level (MSL) 3:

The microcontroller has a moisture sensitivity level of 3, indicating that it has a moderate level of sensitivity to moisture. This ensures proper handling and storage requirements, preventing potential damage and ensuring the longevity of the product.

CMOS Technology:

The microcontroller is built using complementary metal-oxide-semiconductor (CMOS) technology. This provides low power consumption, allowing the customer to design energy-efficient systems that can run on battery power for extended periods.

Terminal Finish (Tin):

The microcontroller has tin terminal finish, which offers good solderability and corrosion resistance. This ensures reliable connections between the microcontroller and other components, contributing to the overall durability and performance of the product.

Technical Specifications

Microcontrollers XC164CS32F40FBBAKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

79

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

12288

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.35 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), SPI(2), USART(2)

Peripherals:

RTC, TIMER(11), WDT(2)

Analog To Digital Convertors:

14-Ch 10-Bit

Trade Compliance

XC164CS32F40FBBAKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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