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XC161CS32F40FBBAKXUMA1

Infineon Technologies

XC161CS32F40FBBAKXUMA1 by Infineon Technologies

Infineon's XC161CS32F40FBBAKXUMA1 is a 16-bit microcontroller with 24-bit address bus width, operating at up to 16 MHz. Ideal for automotive applications, it features Flash ROM programmability, 99 I/O lines, and PWM channels for precise control in a compact flatpack package.

Median Price

$25.920

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,268 parts In-Stock

1+ parts

-

100+ parts

$23.040

1k+ parts

$20.610

10k+ parts

$19.400

1,268

-

$23.040

$20.610

$19.400

Verical

USA . 1,163 parts In-Stock

1+ parts

-

100+ parts

$28.800

1k+ parts

$25.762

10k+ parts

$24.250

1,163

-

$28.800

$25.762

$24.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 894 parts In-Stock

1+ parts

$24.377

100+ parts

-

1k+ parts

-

10k+ parts

-

894

$24.377

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$31.412

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$31.412

-

-

-

Vyrian

USA . 13,303 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,303

-

-

-

-

Chip Stock

USA . 2,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,900

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 778 parts In-Stock

1+ parts

$12.993

100+ parts

-

1k+ parts

-

10k+ parts

-

778

$12.993

-

-

-

Semicontronic

India . 890 parts In-Stock

1+ parts

$21.810

100+ parts

$21.265

1k+ parts

$21.156

10k+ parts

-

890

$21.810

$21.265

$21.156

-

Ampacity Inc.

Singapore . 546 parts In-Stock

1+ parts

$21.810

100+ parts

-

1k+ parts

-

10k+ parts

-

546

$21.810

-

-

-

Corphita

USA . 890 parts In-Stock

1+ parts

$23.094

100+ parts

-

1k+ parts

-

10k+ parts

-

890

$23.094

-

-

-

Continental Prestige Electronics

USA . 6,970 parts In-Stock

1+ parts

$31.412

100+ parts

-

1k+ parts

-

10k+ parts

$30.784

6,970

$31.412

-

-

$30.784

Netroflash

USA . 100 parts In-Stock

1+ parts

$31.412

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$31.412

-

-

-

Modulus Dynamics

Lithuania . 3,817 parts In-Stock

1+ parts

$44.895

100+ parts

$43.099

1k+ parts

$41.303

10k+ parts

-

3,817

$44.895

$43.099

$41.303

-

Component Stockers USA

USA . 321 parts In-Stock

1+ parts

$349.410

100+ parts

-

1k+ parts

-

10k+ parts

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321

$349.410

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 26,844 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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26,844

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-

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Argo Parts USA

USA . 4,930 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,930

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-

-

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Microchip USA

USA . 4,848 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,848

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Overview

Unlock the power of cutting-edge technology with the XC161CS32F40FBBAKXUMA1 from Infineon Technologies. As a leader in microcontroller manufacturing, Infineon delivers high-quality products that excel in automotive applications and beyond. With advanced features like Flash ROM programmability and PWM channels, this microcontroller offers unparalleled performance and reliability. Experience seamless integration and optimized functionality with the XC161CS32F40FBBAKXUMA1, setting new standards for efficiency and innovation in the industry. Elevate your projects to new heights with this exceptional product from Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and protection for the microcontroller, ensuring reliable performance in various environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost during production.

Maximum Supply Voltage: 2.7 V

Low maximum supply voltage helps in minimizing power consumption and extending battery life in portable applications.

Address Bus Width: 24

24-bit address bus width enables access to a large memory space, allowing for complex program execution and data storage.

Package Shape: SQUARE

Square package shape facilitates easy placement and mounting on the PCB, optimizing board space utilization.

Bit Size: 16

16-bit processing capability provides a balance between performance and cost, suitable for a wide range of embedded applications.

No. of Terminals: 144

144 terminals offer ample connectivity options for interfacing with external devices, sensors, and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, fine pitch package style improves thermal dissipation, reduces signal interference, and enables high-density PCB designs.

Minimum Supply Voltage: 2.35 V

Low minimum supply voltage ensures stable operation even in low-power or fluctuating power supply conditions.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range allows for reliable performance in industrial and automotive environments with varying temperature conditions.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range ensures functionality in extreme cold environments or during startup conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish offers good solderability and corrosion resistance, ensuring long-term reliability in harsh operating conditions.

ADC Channels: YES

ADC channels enable the microcontroller to interface with analog sensors, enabling data acquisition and processing for a wide range of applications.

Terminal Position: QUAD

Quad terminal position simplifies PCB layout and routing, enhancing ease of assembly and reducing signal crosstalk.

Maximum Seated Height: 1.6 mm

Low maximum seated height minimizes the overall profile of the microcontroller on the PCB, suitable for compact and space-constrained designs.

Width: 20 mm

Compact width dimension allows for efficient placement on the PCB and enables space-saving design configurations.

External Data Bus Width: 16

16-bit external data bus width facilitates high-speed data transfer and efficient communication with external memory devices or peripherals.

Maximum Clock Frequency: 16 MHz

High maximum clock frequency enables fast processing and execution of instructions, enhancing overall system performance.

Length: 20 mm

Compact length dimension supports space-efficient PCB layout and design, ideal for applications with size constraints.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliable operation in challenging automotive environments with stringent temperature requirements.

Peripheral IC Type: MICROCONTROLLER

Microcontroller peripheral IC type provides integrated features and functionalities, reducing external component count and PCB complexity.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltage levels, making it suitable for various applications.

Terminal Form: GULL WING

Gull wing terminal form facilitates automated soldering processes and provides mechanical strength for reliable connections on the PCB.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance and operation of the microcontroller under normal operating conditions.

PWM Channels: YES

PWM channels enable precise control of analog signals and pulse-width modulation, suitable for applications requiring motor control, dimming, or power regulation.

ROM Programmability: FLASH

Flash ROM programmability allows for in-system programming and firmware updates, enhancing flexibility and scalability for future enhancements.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm enables high-density packaging and routing of signals, optimizing PCB space utilization and reducing signal interference.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microcontroller can withstand moderate exposure to moisture during storage or assembly processes.

Speed: 40 rpm

High processing speed of 40 rpm allows for rapid execution of instructions and real-time data processing, enhancing system performance.

No. of I/O Lines: 99

99 I/O lines provide ample input/output connectivity options for interfacing with external devices, sensors, and peripherals, enabling versatile applications.

Technical Specifications

Microcontrollers XC161CS32F40FBBAKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

99

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.35 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

XC161CS32F40FBBAKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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