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XC167CI16F40FBBFXQMA1

Infineon Technologies

XC167CI16F40FBBFXQMA1 by Infineon Technologies

Infineon Technologies' XC167CI16F40FBBFXQMA1 is a 16-bit microcontroller with a max clock frequency of 16 MHz. It features 131072 ROM words, 8192 bytes of RAM, and 16-channel 10-bit ADC. This automotive-grade microcontroller offers connectivity options like ASC, CAN, I2C, and SSC for various applications.

Median Price

$25.238

Lifecycle Status

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6

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1k+

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Avnet

USA . 49 parts In-Stock

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$25.238

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$23.735

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49

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EBV Elektronik

Germany . 360 parts In-Stock

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360

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Nova Conductors

Japan . 870 parts In-Stock

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$23.630

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$23.630

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Vyrian

USA . 10,544 parts In-Stock

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Chip Stock

USA . 305 parts In-Stock

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Digiode

USA . 66 parts In-Stock

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AZTECH Wire

Italy . 314 parts In-Stock

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$5.462

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314

$5.462

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Semicontronic

India . 49 parts In-Stock

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$11.000

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$10.725

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$10.670

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49

$11.000

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$10.670

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Ampacity Inc.

Singapore . 49 parts In-Stock

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$13.000

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Continental Prestige Electronics

USA . 1,232 parts In-Stock

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$23.630

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$23.157

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Netroflash

USA . 1,000 parts In-Stock

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$23.630

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$26.947

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$24.791

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$23.230

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$26.947

$24.791

$23.230

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Aztec Data Supply Inc.

USA . 1,153 parts In-Stock

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$43.000

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$43.000

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Modulus Dynamics

Lithuania . 4,535 parts In-Stock

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$49.997

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$47.997

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$45.997

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$49.997

$47.997

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Microchip USA

USA . 2,896 parts In-Stock

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$66.750

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$65.590

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$65.000

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$64.420

2,896

$66.750

$65.590

$65.000

$64.420

Corohmni

South Africa . 689 parts In-Stock

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$73.188

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 3,379 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Perfect Parts

USA . 1,511 parts In-Stock

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Corphita

USA . 833 parts In-Stock

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Overview

Discover the XC167CI16F40FBBFXQMA1 by Infineon Technologies, a high-quality microcontroller that offers numerous advantages for various applications. With its advanced technology and innovative design, this microcontroller delivers exceptional performance and reliability. Whether you're working on automotive systems, industrial automation, or IoT devices, this versatile product is the perfect choice. Experience seamless connectivity with ASC, CAN, I2C, and SSC interfaces, while enjoying the benefits of real-time clock, timer, and watchdog functionalities. Take your projects to new heights with the XC167CI16F40FBBFXQMA1 and unlock endless possibilities for success.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection, making the microcontroller suitable for various applications.

Surface Mount:

YES - The surface mount feature allows for easy integration and efficient PCB assembly.

Maximum Supply Voltage:

2.7 V - The microcontroller can operate reliably within this voltage range, ensuring compatibility with different power sources.

Address Bus Width:

24 - With a wider address bus, the microcontroller can access a larger memory space, enabling complex operations and data handling.

Package Shape:

SQUARE - The square package shape offers better space utilization and facilitates placement on the PCB.

Bit Size:

16 - The microcontroller's 16-bit architecture provides enhanced processing capabilities, enabling faster execution of instructions and efficient data manipulation.

No. of Terminals:

144 - With a high number of terminals, the microcontroller can accommodate multiple input/output connections, expanding its functionality.

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH - This package style offers a compact design, reducing the overall size of the product and making it suitable for space-constrained applications.

Minimum Supply Voltage:

2.35 V - The microcontroller's ability to operate with a low supply voltage allows for power-efficient operation while maintaining performance.

Maximum Operating Temperature:

125 °C - The microcontroller can withstand high temperatures, making it suitable for applications with demanding environmental conditions.

Minimum Operating Temperature:

40 °C - The microcontroller's wide operating temperature range ensures reliability and functionality in extreme cold environments.

Terminal Finish:

MATTE TIN - The matte tin terminal finish provides excellent solderability, ensuring reliable electrical connections during the assembly process.

ADC Channels:

YES - The microcontroller's built-in analog-to-digital converter channels enable precise measurement and conversion of analog signals, expanding its versatility for sensor-based applications.

Terminal Position:

QUAD - The quad terminal position allows for easy soldering and secure connections, enhancing the microcontroller's reliability in different usage scenarios.

ROM Words:

131072 - The large ROM capacity enables the storage of a significant amount of program code, facilitating the implementation of complex algorithms and functionalities.

Maximum Seated Height:

1.6 mm - The microcontroller's low profile allows for compact design and integration into space-limited applications.

Width:

20 mm - The microcontroller's compact width dimension contributes to its versatility and ease of integration in different system designs.

External Data Bus Width:

16 - The wide external data bus width enhances data transmission speed and efficiency, enabling high-performance data processing.

Peripherals:

RTC, TIMER(9), WDT - The microcontroller's built-in peripherals, such as real-time clock, timers, and watchdog timer, provide additional functionalities and enhance system control.

Maximum Clock Frequency:

16 MHz - The microcontroller's high maximum clock frequency enables fast execution of instructions, enhancing overall system performance.

Length:

20 mm - The microcontroller's compact length dimension allows for flexible placement and integration within various system designs.

Temperature Grade:

AUTOMOTIVE - The microcontroller's automotive temperature grade ensures reliable operation in automotive applications, withstanding extreme temperature variations.

Peripheral IC Type:

MICROCONTROLLER - As a microcontroller, this product offers a highly integrated solution for controlling and managing various functionalities and systems.

RAM Bytes:

8192 - With a large RAM capacity, the microcontroller can store and manipulate significant amounts of data, facilitating complex calculations and data processing.

Technology:

CMOS - The CMOS technology used in this microcontroller provides low power consumption, making it suitable for battery-powered applications.

Terminal Form:

GULL WING - The gull wing terminal form enhances mechanical strength and soldering reliability, ensuring robust connections in demanding operating conditions.

Analog To Digital Converters:

16-Ch 10-Bit - The microcontroller's multiple analog-to-digital converters (ADCs) with 10-bit resolution enable precise and accurate conversion of analog signals, expanding its applicability in sensor interfacing and data acquisition.

Nominal Supply Voltage:

2.5 V - The microcontroller's nominal supply voltage ensures stable and efficient operation while maintaining compatibility with common power sources.

PWM Channels:

YES - The presence of Pulse Width Modulation (PWM) channels allows for precise control of analog-like signals, making the microcontroller suitable for motor control and other high-precision applications.

Connectivity:

ASC(2), CAN(2), I2C, SSC(2) - The microcontroller's multiple connectivity options, including ASC, CAN, I2C, and SSC, enable seamless communication with other devices and peripherals, enhancing its versatility for various applications.

ROM Programmability:

FLASH - The microcontroller's flash programmability allows for easy and flexible updating of program code, ensuring adaptability and ease of maintenance.

Terminal Pitch:

0.5 mm - The microcontroller's small terminal pitch facilitates high-density packaging and provides compatibility with modern PCB manufacturing processes.

Moisture Sensitivity Level (MSL):

3 - The microcontroller's moisture sensitivity level ensures that it can withstand the effects of humidity during storage and assembly, maintaining its reliability.

Speed:

40 rpm - The microcontroller's speed rating of 40 revolutions per minute indicates its suitability for applications involving motor control and precise speed regulation.

On Chip Program ROM Width:

8 - The microcontroller's on-chip program ROM width of 8 allows for efficient storage and execution of program code, supporting a wide range of applications.

No. of I/O Lines:

103 - With a high number of input/output lines, the microcontroller offers extensive connectivity options, enabling flexible interfacing with external devices and components.

Technical Specifications

Microcontrollers XC167CI16F40FBBFXQMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

103

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.35 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ASC(2), CAN(2), I2C, SSC(2)

Peripherals:

RTC, TIMER(9), WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

XC167CI16F40FBBFXQMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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