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XC167CI32F40FBBAFXQMA1

Infineon Technologies

XC167CI32F40FBBAFXQMA1 by Infineon Technologies

Infineon's XC167CI32F40FBBAFXQMA1 microcontroller features 16-bit size, 144 terminals, and 16 MHz clock frequency. Ideal for applications requiring a max supply voltage of 2.7 V, such as automotive control systems and industrial automation.

Median Price

$26.078

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 330 parts In-Stock

1+ parts

$23.980

100+ parts

$22.540

1k+ parts

$20.380

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330

$23.980

$22.540

$20.380

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Verical

USA . 253 parts In-Stock

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-

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$28.175

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253

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$28.175

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Distributors (In-Stock)

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Digiode

USA . 669 parts In-Stock

1+ parts

$22.781

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-

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669

$22.781

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Nova Conductors

Japan . 500 parts In-Stock

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$29.415

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500

$29.415

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Chip Stock

USA . 4,300 parts In-Stock

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4,300

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Vyrian

USA . 4,017 parts In-Stock

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4,017

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ComSIT Distribution GmbH

Germany . 65 parts In-Stock

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65

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Rutronik

Germany . 4 parts In-Stock

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$62.280

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4

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$62.280

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Distributors (Availability)

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AZTECH Wire

Italy . 797 parts In-Stock

1+ parts

$10.398

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-

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797

$10.398

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Semicontronic

India . 127 parts In-Stock

1+ parts

$20.380

100+ parts

$19.870

1k+ parts

$19.769

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127

$20.380

$19.870

$19.769

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Ampacity Inc.

Singapore . 14 parts In-Stock

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$20.380

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14

$20.380

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Corphita

USA . 574 parts In-Stock

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$21.582

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574

$21.582

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Modulus Dynamics

Lithuania . 3,787 parts In-Stock

1+ parts

$27.082

100+ parts

$25.999

1k+ parts

$24.915

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3,787

$27.082

$25.999

$24.915

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Corohmni

South Africa . 212 parts In-Stock

1+ parts

$27.082

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212

$27.082

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Component Stockers USA

USA . 20 parts In-Stock

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$27.480

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20

$27.480

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$27.894

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$26.500

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$26.500

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50

$27.894

$26.500

$26.500

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Continental Prestige Electronics

USA . 1,189 parts In-Stock

1+ parts

$28.425

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$27.856

1,189

$28.425

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$27.856

Netroflash

USA . 100 parts In-Stock

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$29.415

100+ parts

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$27.945

10k+ parts

$27.356

100

$29.415

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$27.945

$27.356

Aztec Data Supply Inc.

USA . 1,943 parts In-Stock

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$35.120

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1,943

$35.120

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Microchip USA

USA . 1,711 parts In-Stock

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$60.472

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1,711

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 2,278 parts In-Stock

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Perfect Parts

USA . 1,546 parts In-Stock

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Robosynatics

Brazil . 300 parts In-Stock

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300

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Lucentia Tech

USA . 300 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the XC167CI32F40FBBAFXQMA1 microcontroller by Infineon Technologies. Designed for high performance and reliability, this microcontroller is perfect for a wide range of applications. From automotive to industrial automation, this versatile device offers seamless integration and exceptional functionality. Experience unparalleled efficiency and precision with this top-of-the-line product, setting new standards in the industry. Trust Infineon Technologies to deliver quality and innovation that exceeds expectations. Elevate your projects to new heights with the XC167CI32F40FBBAFXQMA1 microcontroller.

Feature Benefit Bullets

Surface Mount: YES

Surface mount option allows for easy and efficient PCB assembly, saving time and cost in manufacturing.

Maximum Supply Voltage: 2.7 V

Low maximum supply voltage helps in minimizing power consumption and heat dissipation, making the product energy efficient.

Address Bus Width: 24

Wide address bus width allows for efficient memory addressing and data transfer, enhancing overall performance of the microcontroller.

Package Shape: SQUARE

Square package shape provides a compact design and easy integration into electronic devices, saving space and enabling sleek product designs.

Bit Size: 16

16-bit architecture offers a good balance between performance and cost, suitable for a wide range of applications.

No. of Terminals: 144

High number of terminals allows for versatile connectivity options and interfacing with external components, enhancing the functionality of the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style offers efficient heat dissipation, compact design, and easy PCB layout, contributing to overall product reliability and performance.

Minimum Supply Voltage: 2.35 V

Low minimum supply voltage ensures stable operation of the microcontroller even under varying voltage conditions, improving product reliability.

ADC Channels: YES

Presence of ADC channels allows for analog-to-digital conversion, enabling the microcontroller to interface with a wide range of sensors and devices.

Terminal Position: QUAD

Quad terminal position facilitates easy and secure connectivity, reducing the chances of signal interference or connection issues.

Width: 20 mm

Compact width dimensions enable the microcontroller to fit into small spaces or tight enclosures, making it suitable for compact electronic devices.

External Data Bus Width: 16

16-bit external data bus width allows for efficient data transfer between the microcontroller and external memory or peripherals, enhancing overall system performance.

Maximum Clock Frequency: 16 MHz

High maximum clock frequency enables fast processing speeds and real-time operation, making the microcontroller suitable for high-performance applications.

Length: 20 mm

Compact length dimensions contribute to space-saving design and easy integration into electronic devices, enhancing product versatility.

Peripheral IC Type: MICROCONTROLLER

Dedicated peripheral IC type ensures that the microcontroller is optimized for a wide range of functions and interfaces, providing versatility in application usage.

Terminal Form: GULL WING

Gull wing terminal form offers secure soldering connections, ensuring reliable electrical connections and long-lasting performance of the microcontroller.

Nominal Supply Voltage: 2.5 V

Standard nominal supply voltage ensures compatibility with a wide range of power sources and operating conditions, enhancing product flexibility.

PWM Channels: YES

Presence of PWM channels allows for precise control of output signals, enabling the microcontroller to drive motors, LEDs, and other devices with varying levels of power.

Terminal Pitch: 0.5 mm

Fine terminal pitch facilitates high-density packaging and compact PCB design, allowing for efficient use of space and enabling miniaturization of electronic devices.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture, requiring standard handling precautions during assembly and operation to ensure product reliability.

Speed: 40 rpm

Operating speed of 40 rpm enables fast data processing and response times, making the microcontroller suitable for real-time control applications.

No. of I/O Lines: 103

High number of I/O lines provides ample interfacing options for connecting to external devices, sensors, and peripherals, enhancing the versatility and functionality of the microcontroller.

Technical Specifications

Microcontrollers XC167CI32F40FBBAFXQMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

103

No. of Terminals:

144

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Speed:

40 rpm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.35 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

XC167CI32F40FBBAFXQMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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