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XC167CI16F40FBBKXQMA1

Infineon Technologies

XC167CI16F40FBBKXQMA1 by Infineon Technologies

XC167CI16F40FBBKXQMA1 by Infineon: 16-bit microcontroller with 2.5V supply, 16MHz clock, and FLASH ROM. Ideal for automotive applications due to -40 to 125 °C operating temp range and CMOS technology. Package style is flatpack with low profile and fine pitch, making it suitable for space-constrained designs.

Median Price

$53.690

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 660 parts In-Stock

1+ parts

$21.280

100+ parts

$20.000

1k+ parts

$18.090

10k+ parts

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660

$21.280

$20.000

$18.090

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DigiKey

USA . 4 parts In-Stock

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$86.100

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4

$86.100

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Distributors (In-Stock)

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Digiode

USA . 778 parts In-Stock

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$20.216

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778

$20.216

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Nova Conductors

Japan . 50 parts In-Stock

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$28.729

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50

$28.729

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Vyrian

USA . 6,323 parts In-Stock

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6,323

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Sea View Technologies

USA . 1 parts In-Stock

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1

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Bristol Electronics

USA . 1 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 442 parts In-Stock

1+ parts

$11.354

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442

$11.354

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Semicontronic

India . 210 parts In-Stock

1+ parts

$18.090

100+ parts

$17.638

1k+ parts

$17.547

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210

$18.090

$17.638

$17.547

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Ampacity Inc.

Singapore . 113 parts In-Stock

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$18.090

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113

$18.090

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Corphita

USA . 167 parts In-Stock

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$19.152

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Corohmni

South Africa . 616 parts In-Stock

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$22.175

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Continental Prestige Electronics

USA . 2,142 parts In-Stock

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$26.047

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$25.526

2,142

$26.047

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$25.526

Aranea Global

USA . 100 parts In-Stock

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$28.154

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$27.028

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$28.154

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$27.028

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$34.347

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$32.630

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$32.630

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$34.347

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$32.630

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Microchip USA

USA . 1,100 parts In-Stock

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$71.415

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$71.415

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Aztec Data Supply Inc.

USA . 5,386 parts In-Stock

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$73.920

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$73.920

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Modulus Dynamics

Lithuania . 4,697 parts In-Stock

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$83.446

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$80.108

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$76.770

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4,697

$83.446

$80.108

$76.770

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Argo Parts USA

USA . 4,655 parts In-Stock

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Eastek

USA . 1,080 parts In-Stock

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Perfect Parts

USA . 403 parts In-Stock

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Overview

Unlock the power of innovation with the XC167CI16F40FBBKXQMA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-quality microcontrollers that are versatile and reliable. Ideal for automotive applications, this microcontroller offers advanced features such as PWM channels and ADC channels, making it perfect for a wide range of projects. Experience seamless performance and efficiency with the XC167CI16F40FBBKXQMA1, providing customers with unmatched value and benefits for their applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient mounting onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 2.7 V

Supports a wide range of applications while ensuring efficient power usage.

Address Bus Width: 24

Allows for efficient data transfer and processing capabilities.

Bit Size: 16

Enables the microcontroller to handle a moderate amount of data efficiently.

No. of Terminals: 144

Provides a sufficient number of connection points for interfacing with external devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enhances the overall design and functionality of the microcontroller.

Minimum Supply Voltage: 2.35 V

Ensures reliable operation even under lower voltage conditions.

Maximum Operating Temperature: 125 °C

Allows the microcontroller to operate in a wide range of temperature conditions.

Minimum Operating Temperature: -40 °C

Ensures the microcontroller can withstand extreme cold environments.

ADC Channels: YES

Enables analog-to-digital conversion, expanding the range of sensors and devices that can be interfaced.

Width: 20 mm

Compact size allows for flexibility in installation and integration into various systems.

External Data Bus Width: 16

Enhances data transfer efficiency and processing speed.

Maximum Clock Frequency: 16 MHz

Provides sufficient processing speed for a wide range of applications.

Terminal Finish: MATTE TIN

Ensures reliable electrical connections and corrosion resistance.

Technology: CMOS

Low power consumption and high noise immunity characteristics make it suitable for various applications.

Nominal Supply Voltage: 2.5 V

Optimal operating voltage for stability and efficiency.

PWM Channels: YES

Allows for precise control of connected devices, such as motors or LEDs.

ROM Programmability: FLASH

Enables flexible programming and reprogramming of the microcontroller.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture, ensuring reliability in various environments.

Technical Specifications

Microcontrollers XC167CI16F40FBBKXQMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

103

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.35 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

XC167CI16F40FBBKXQMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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