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XC161CJ16F40FBBKXUMA1

Infineon Technologies

XC161CJ16F40FBBKXUMA1 by Infineon Technologies

XC161CJ16F40FBBKXUMA1 by Infineon is a 16-bit microcontroller with 24-bit address bus width, operating at a max frequency of 40 MHz. Designed for automotive applications, it features PWM channels, ADC channels, and flash ROM programmability.

Median Price

$20.542

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 689 parts In-Stock

1+ parts

$20.542

100+ parts

$16.378

1k+ parts

$16.073

10k+ parts

-

689

$20.542

$16.378

$16.073

-

DigiKey

USA . 1,963 parts In-Stock

1+ parts

$86.100

100+ parts

$64.310

1k+ parts

$60.386

10k+ parts

-

1,963

$86.100

$64.310

$60.386

-

Rochester

USA . 1,328 parts In-Stock

1+ parts

-

100+ parts

$19.110

1k+ parts

$17.100

10k+ parts

$16.100

1,328

-

$19.110

$17.100

$16.100

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 849 parts In-Stock

1+ parts

$19.515

100+ parts

-

1k+ parts

-

10k+ parts

-

849

$19.515

-

-

-

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$26.042

100+ parts

-

1k+ parts

-

10k+ parts

-

200

$26.042

-

-

-

Chip Stock

USA . 3,038 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,038

-

-

-

-

Vyrian

USA . 1,159 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,159

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,243 parts In-Stock

1+ parts

$17.460

100+ parts

$17.024

1k+ parts

$16.936

10k+ parts

-

1,243

$17.460

$17.024

$16.936

-

Ampacity Inc.

Singapore . 951 parts In-Stock

1+ parts

$17.460

100+ parts

-

1k+ parts

-

10k+ parts

-

951

$17.460

-

-

-

Corphita

USA . 311 parts In-Stock

1+ parts

$18.488

100+ parts

-

1k+ parts

-

10k+ parts

-

311

$18.488

-

-

-

Modulus Dynamics

Lithuania . 524 parts In-Stock

1+ parts

$22.975

100+ parts

$22.056

1k+ parts

$21.137

10k+ parts

-

524

$22.975

$22.056

$21.137

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Aztec Data Supply Inc.

USA . 4,788 parts In-Stock

1+ parts

$25.640

100+ parts

-

1k+ parts

-

10k+ parts

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4,788

$25.640

-

-

-

Continental Prestige Electronics

USA . 3,844 parts In-Stock

1+ parts

$26.042

100+ parts

-

1k+ parts

-

10k+ parts

$25.521

3,844

$26.042

-

-

$25.521

Netroflash

USA . 100 parts In-Stock

1+ parts

$26.042

100+ parts

-

1k+ parts

$24.740

10k+ parts

$24.219

100

$26.042

-

$24.740

$24.219

Microchip USA

USA . 2,255 parts In-Stock

1+ parts

$49.337

100+ parts

-

1k+ parts

-

10k+ parts

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2,255

$49.337

-

-

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Corohmni

South Africa . 324 parts In-Stock

1+ parts

$86.617

100+ parts

-

1k+ parts

-

10k+ parts

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324

$86.617

-

-

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,000

-

-

-

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Argo Parts USA

USA . 1,887 parts In-Stock

1+ parts

-

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1,887

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-

-

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Eastek

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$28.964

10k+ parts

-

1,000

-

-

$28.964

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Perfect Parts

USA . 353 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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353

-

-

-

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Robosynatics

Brazil . 100 parts In-Stock

1+ parts

-

100+ parts

$3.995

1k+ parts

$3.995

10k+ parts

$3.995

100

-

$3.995

$3.995

$3.995

Lucentia Tech

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$3.995

1k+ parts

$3.995

10k+ parts

$3.995

100

-

$3.995

$3.995

$3.995

Overview

Unleash the power of innovation with the XC161CJ16F40FBBKXUMA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality microcontrollers that are versatile and reliable for a wide range of applications. Whether you're working on automotive projects or consumer electronics, this microcontroller offers unmatched value with its advanced features and high performance. Experience seamless operation and superior functionality with the XC161CJ16F40FBBKXUMA1, setting new standards in the world of microcontrollers. Elevate your designs and unleash endless possibilities with this exceptional product from Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and effort in production.

Maximum Supply Voltage: 2.7 V

With a maximum supply voltage of 2.7V, this microcontroller is suitable for low power applications and helps in reducing power consumption.

Address Bus Width: 24

A wide address bus width of 24 bits allows for efficient memory addressing and data transfer in complex systems.

Terminal Finish: MATTE TIN

MATTE TIN terminal finish offers good solderability and conductivity, ensuring reliable connections and performance.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this microcontroller can withstand harsh environmental conditions and operate in various industrial settings.

ADC Channels: YES

Having ADC channels allows the microcontroller to interface with analog sensors and devices, enabling precise and accurate data acquisition.

ROM Programmability: FLASH

ROM programmability with FLASH technology enables quick and easy firmware updates, making the microcontroller adaptable to changing requirements.

Technical Specifications

Microcontrollers XC161CJ16F40FBBKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 5V SUPPLY

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

99

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.35 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

XC161CJ16F40FBBKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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