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SPD02N80C3BT

Infineon Technologies

SPD02N80C3BT by Infineon Technologies

Infineon's SPD02N80C3BT is a N-CHANNEL FET with 800V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 6A IDM, 90mJ EAS, and 2A ID. Operating from -55 to 150°C, it has a Drain-Source On Resistance of 2.7 ohm in a GULL WING package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 660 parts In-Stock

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660

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Digiode

USA . 310 parts In-Stock

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310

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Nova Conductors

Japan . 99 parts In-Stock

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99

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Distributors (Availability)

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Corohmni

South Africa . 182 parts In-Stock

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$1.034

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$1.034

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Modulus Dynamics

Lithuania . 22,359 parts In-Stock

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$1.071

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$1.028

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$0.985

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Aztec Data Supply Inc.

USA . 1,162 parts In-Stock

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$1.100

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AZTECH Wire

Italy . 665 parts In-Stock

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$15.799

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$15.799

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Ampacity Inc.

Singapore . 1,379 parts In-Stock

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$39.050

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$39.050

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Argo Parts USA

USA . 4,231 parts In-Stock

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Continental Prestige Electronics

USA . 2,998 parts In-Stock

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Corphita

USA . 658 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Unlock the power of innovation with the SPD02N80C3BT by Infineon Technologies. Designed with precision and reliability in mind, this N-channel Power FET offers seamless switching capabilities for a wide range of applications. From enhancing efficiency to boosting performance, this transistor is the key to unlocking endless possibilities. Trust in Infineon's expertise and elevate your projects to new heights with the SPD02N80C3BT. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product suitable for various environments.

Polarity or Channel Type: N-CHANNEL

Offers low on-resistance and high switching speed characteristics, enhancing overall performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by integrating a diode within the transistor package.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable operation.

Surface Mount: YES

Enables easy integration onto circuit boards, reducing assembly time and costs.

Minimum DS Breakdown Voltage: 800 V

Allows the transistor to handle high voltage applications without risk of breakdown.

Package Shape: RECTANGULAR

Facilitates easy placement and mounting within electronic devices or systems.

Terminal Form: GULL WING

Enhances solder joint reliability and thermal conductivity for improved performance.

Operating Mode: ENHANCEMENT MODE

Provides greater control over the transistor operation, leading to efficient power management.

Maximum Pulsed Drain Current (IDM): 6 A

Can handle high pulsed current loads, suitable for applications requiring short bursts of power.

Avalanche Energy Rating (EAS): 90 mJ

Offers protection against avalanche breakdown events, ensuring the reliability of the transistor in extreme conditions.

No. of Terminals: 2

Simplifies circuit connections and reduces component complexity.

Maximum Power Dissipation (Abs): 42 W

Can handle high power dissipation, making it suitable for demanding applications.

Package Style (Meter): SMALL OUTLINE

Allows for compact integration into electronic devices or systems with limited space.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides high switching speeds and low gate capacitance, improving overall efficiency.

Maximum Operating Temperature: 150 °C

Can operate reliably in high-temperature environments, suitable for industrial or automotive applications.

Transistor Element Material: SILICON

Offers high performance and reliability, making it a popular choice for various applications.

Minimum Operating Temperature: -55 °C

Can operate in cold environments without compromising performance or reliability.

Maximum Drain Current (ID): 2 A

Capable of handling continuous high current loads, suitable for various applications.

Maximum Drain-Source On Resistance: 2.7 ohm

Provides low on-resistance for efficient power management and reduced heat dissipation.

Terminal Position: SINGLE

Simplifies circuit connections and ensures proper orientation during assembly.

Case Connection: DRAIN

Facilitates easy and reliable connections for drain terminal, enhancing overall performance.

Technical Specifications

Power Field Effect Transistors (FET) SPD02N80C3BT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

90 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (ID):

2 A

Maximum Drain-Source On Resistance:

2.7 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

6 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SPD02N80C3BT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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