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SPD07N60C3ATMA1

Infineon Technologies

SPD07N60C3ATMA1 by Infineon Technologies

Infineon's SPD07N60C3ATMA1 is a N-CHANNEL FET with 600V DS breakdown voltage, ideal for switching applications. Features include 21.9A IDM, 0.6 ohm RDS(on), and 230mJ EAS rating. Its GULL WING terminals and ENHANCEMENT MODE operation make it suitable for surface mount designs.

Median Price

$1.200

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 1,715 parts In-Stock

1+ parts

$2.800

100+ parts

$1.960

1k+ parts

$1.530

10k+ parts

-

1,715

$2.800

$1.960

$1.530

-

Mouser Electronics

USA . 878 parts In-Stock

1+ parts

$2.990

100+ parts

$1.340

1k+ parts

$1.120

10k+ parts

$1.050

878

$2.990

$1.340

$1.120

$1.050

Newark

USA . 2,139 parts In-Stock

1+ parts

$3.080

100+ parts

$1.380

1k+ parts

$1.150

10k+ parts

-

2,139

$3.080

$1.380

$1.150

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DigiKey

USA . 2,191 parts In-Stock

1+ parts

$3.640

100+ parts

$1.637

1k+ parts

$1.226

10k+ parts

-

2,191

$3.640

$1.637

$1.226

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Arrow

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

$0.153

10,000

-

-

-

$0.153

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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$0.153

10,000

-

-

-

$0.153

Avnet

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.492

5,000

-

-

-

$0.492

Future Electronics

Canada . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.540

2,500

-

-

-

$0.540

Chip1Stop

Japan . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.860

2,500

-

-

-

$0.860

EBV Elektronik

Germany . 2,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,500

-

-

-

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Farnell

UK . 1,715 parts In-Stock

1+ parts

-

100+ parts

$1.200

1k+ parts

$0.929

10k+ parts

-

1,715

-

$1.200

$0.929

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Rochester

USA . 758 parts In-Stock

1+ parts

-

100+ parts

$1.240

1k+ parts

$1.030

10k+ parts

$0.918

758

-

$1.240

$1.030

$0.918

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 676 parts In-Stock

1+ parts

$1.109

100+ parts

-

1k+ parts

-

10k+ parts

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676

$1.109

-

-

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Nova Conductors

Japan . 39 parts In-Stock

1+ parts

$1.505

100+ parts

-

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39

$1.505

-

-

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Chip Stock

USA . 29,710 parts In-Stock

1+ parts

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29,710

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IBS Electronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$1.669

5,000

-

-

-

$1.669

Vyrian

USA . 3,544 parts In-Stock

1+ parts

-

100+ parts

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3,544

-

-

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NAC Semi

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

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$1.250

2,500

-

-

-

$1.250

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 9,619 parts In-Stock

1+ parts

$0.321

100+ parts

$0.308

1k+ parts

$0.295

10k+ parts

-

9,619

$0.321

$0.308

$0.295

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Corohmni

South Africa . 286 parts In-Stock

1+ parts

$0.446

100+ parts

-

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-

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286

$0.446

-

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Ampacity Inc.

Singapore . 4,325 parts In-Stock

1+ parts

$0.480

100+ parts

-

1k+ parts

-

10k+ parts

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4,325

$0.480

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Corphita

USA . 503 parts In-Stock

1+ parts

$1.050

100+ parts

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503

$1.050

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Component Stockers USA

USA . 18,220 parts In-Stock

1+ parts

$1.380

100+ parts

$1.140

1k+ parts

$1.110

10k+ parts

$0.890

18,220

$1.380

$1.140

$1.110

$0.890

Argo Parts USA

USA . 1,583 parts In-Stock

1+ parts

$1.505

100+ parts

-

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1,583

$1.505

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Netroflash

USA . 100 parts In-Stock

1+ parts

$1.505

100+ parts

-

1k+ parts

$1.430

10k+ parts

$1.400

100

$1.505

-

$1.430

$1.400

Aztec Data Supply Inc.

USA . 1,164 parts In-Stock

1+ parts

$1.722

100+ parts

-

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1,164

$1.722

-

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Continental Prestige Electronics

USA . 1,796 parts In-Stock

1+ parts

$1.830

100+ parts

$1.090

1k+ parts

$0.735

10k+ parts

-

1,796

$1.830

$1.090

$0.735

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Microchip USA

USA . 2,751 parts In-Stock

1+ parts

$8.186

100+ parts

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2,751

$8.186

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Eastek

USA . 7,500 parts In-Stock

1+ parts

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$1.530

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7,500

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-

$1.530

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GreenTree Electronics

Israel . 2,500 parts In-Stock

1+ parts

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2,500

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Glotronic Ltd.

UK . 2,250 parts In-Stock

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2,250

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Perfect Parts

USA . 11 parts In-Stock

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11

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Overview

Unlock the power of cutting-edge technology with the SPD07N60C3ATMA1 by Infineon Technologies. Crafted from high-quality materials, this N-channel Power FET offers unparalleled performance and reliability in switching applications. With a maximum pulsed drain current of 21.9 A and a minimum DS breakdown voltage of 600 V, this transistor is designed to exceed expectations. Whether you're looking to optimize your circuit design or enhance efficiency, Infineon's SPD07N60C3ATMA1 delivers the value, benefits, and advantages you need to succeed. Elevate your projects with Infineon Technologies today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the transistor lightweight and durable, ideal for portable or rugged applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better electrical performance and lower resistance, making them more efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy implementation in circuits where reverse current protection is required, simplifying design.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance and efficient power management.

Surface Mount: YES

The surface-mount capability makes installation and integration easier, saving time and effort in manufacturing processes.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle high voltages without breakdown, ensuring reliable operation in demanding environments.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space and easy integration into compact electronic devices.

Terminal Form: GULL WING

The gull-wing terminals make soldering easier and provide a secure connection, improving overall reliability.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for precise control over the transistor's conductivity, enabling efficient power management.

Maximum Pulsed Drain Current (IDM): 21.9 A

The high pulsed drain current rating allows the transistor to handle short bursts of high current, making it suitable for applications with high power demands.

Avalanche Energy Rating (EAS): 230 mJ

With a high avalanche energy rating, this FET can withstand sudden voltage spikes or surges, ensuring reliable operation in challenging conditions.

No. of Terminals: 2

Having only 2 terminals simplifies the connection process and reduces the chances of errors during installation.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it suitable for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology offers high performance and efficient power management capabilities.

Transistor Element Material: SILICON

Silicon is a reliable and durable material for transistor elements, ensuring long-term performance and stability.

Terminal Finish: TIN

The tin terminal finish provides corrosion resistance and ensures a secure electrical connection for reliable operation.

Maximum Drain Current (ID): 7.3 A

The high drain current rating allows the FET to handle large amounts of current, making it suitable for high-power applications.

Maximum Drain-Source On Resistance: 0.6 ohm

The low drain-source on resistance minimizes power loss and heat generation, improving efficiency and reliability.

Terminal Position: SINGLE

Having a single terminal position simplifies installation and reduces the chances of wiring errors.

Case Connection: DRAIN

The drain case connection allows for easy heat dissipation, ensuring the transistor operates within safe temperature limits.

Technical Specifications

Power Field Effect Transistors (FET) SPD07N60C3ATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

230 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

7.3 A

Maximum Drain-Source On Resistance:

.6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

21.9 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SPD07N60C3ATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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