Loading...

SPD06N60C3

Infineon Technologies

SPD06N60C3 by Infineon Technologies

Infineon's SPD06N60C3 is a N-CHANNEL FET with 600V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 18.6A IDM, 200mJ EAS, and 0.75 ohm RDS(on). With a max power dissipation of 74W and operating temp up to 150°C, it offers reliable performance in various electronic systems.

Median Price

$1.001

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Maritex

Poland . 5,000 parts In-Stock

1+ parts

$1.161

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

$1.161

-

-

-

Rutronik

Germany . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.841

2,500

-

-

-

$0.841

Freddi Giovanni

Italy . 2,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,400

-

-

-

-

ComSIT Distribution GmbH

Germany . 2,330 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,330

-

-

-

-

Vyrian

USA . 1,084 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,084

-

-

-

-

Digiode

USA . 182 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

182

-

-

-

-

Nova Conductors

Japan . 98 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

98

-

-

-

-

Bristol Electronics

USA . 74 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

74

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 6,074 parts In-Stock

1+ parts

$0.625

100+ parts

$0.600

1k+ parts

$0.575

10k+ parts

-

6,074

$0.625

$0.600

$0.575

-

Aztec Data Supply Inc.

USA . 206 parts In-Stock

1+ parts

$1.880

100+ parts

-

1k+ parts

-

10k+ parts

-

206

$1.880

-

-

-

AZTECH Wire

Italy . 523 parts In-Stock

1+ parts

$18.806

100+ parts

-

1k+ parts

-

10k+ parts

-

523

$18.806

-

-

-

Ampacity Inc.

Singapore . 1,148 parts In-Stock

1+ parts

$41.050

100+ parts

-

1k+ parts

-

10k+ parts

-

1,148

$41.050

-

-

-

Kepictronics

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20,000

-

-

-

-

Perfect Parts

USA . 14,148 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14,148

-

-

-

-

A-Z Elektronik GmbH

Germany . 7,005 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,005

-

-

-

-

Continental Prestige Electronics

USA . 6,115 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,115

-

-

-

-

Authorized Procurement Solutions

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

-

-

-

-

Lixinc

USA . 4,951 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,951

-

-

-

-

S.R.D Solutions

India . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Argo Parts USA

USA . 2,218 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,218

-

-

-

-

Corphita

USA . 974 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

974

-

-

-

-

Bastille Electronics

Australia . 75 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

75

-

-

-

-

Technoshack Inc. (Excess)

Canada . 68 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

68

-

-

-

-

Overview

Unleash the power of the SPD06N60C3 by Infineon Technologies, a top-quality Power Field Effect Transistor designed for switching applications. With a durable plastic/epoxy package and N-channel configuration, this single transistor offers a built-in diode for enhanced performance. Experience the benefits of its 600V minimum DS breakdown voltage and 18.6A maximum pulsed drain current. Whether you're looking to optimize your energy efficiency or streamline your circuit design, Infineon's SPD06N60C3 delivers reliability and value with every use. Elevate your projects with this innovative solution today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection for the internal components, making this FET a reliable choice.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher efficiency, making this product a good choice for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in this FET simplifies circuit design and protects against reverse voltage, making it a convenient choice for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and efficient performance.

Surface Mount: YES

Being surface mountable makes installation easier and saves space on the PCB, making this FET a practical choice for compact designs.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle high voltage applications and provide reliable performance under stress.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy mounting and heat dissipation, contributing to the overall reliability of the FET.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and easy soldering, ensuring a reliable electrical connection for the FET.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easy control of the flow of current, making this product a versatile choice for various applications.

Maximum Pulsed Drain Current (IDM): 18.6 A

With a high pulsed drain current rating, this FET can handle short-term peak loads, making it suitable for applications with high transient current requirements.

Technical Specifications

Power Field Effect Transistors (FET) SPD06N60C3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

HIGH VOLTAGE

Avalanche Energy Rating (EAS):

200 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

6.2 A

Maximum Drain Current (ID):

6.2 A

Maximum Drain-Source On Resistance:

.75 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

18.6 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SPD06N60C3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19