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SPD02N80C3

Infineon Technologies

SPD02N80C3 by Infineon Technologies

Infineon's SPD02N80C3 is a N-CHANNEL FET with 800V DS breakdown voltage, ideal for SWITCHING applications. Features include 6A pulsed drain current, 90mJ avalanche energy rating, and 2.7ohm max on-resistance. With a small outline package style and operating temperature up to 150°C, it offers efficient power management in various electronic devices.

Median Price

$1.290

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 7,500 parts In-Stock

1+ parts

-

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$1.290

1k+ parts

$1.155

10k+ parts

$1.090

7,500

-

$1.290

$1.155

$1.090

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,002 parts In-Stock

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7,002

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Rutronik

Germany . 2,500 parts In-Stock

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$0.453

2,500

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$0.453

Martec Srl

Italy . 905 parts In-Stock

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905

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Cyclops Electronics Ltd

UK . 800 parts In-Stock

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800

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SIE Connect GmbH - GreenChips

Germany . 606 parts In-Stock

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606

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Greenchips

USA . 576 parts In-Stock

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LWI Electronics Inc

India . 232 parts In-Stock

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Digiode

USA . 66 parts In-Stock

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66

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Nova Conductors

Japan . 61 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 7,067 parts In-Stock

1+ parts

$0.800

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$0.800

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Modulus Dynamics

Lithuania . 4,191 parts In-Stock

1+ parts

$0.975

100+ parts

$0.936

1k+ parts

$0.897

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-

4,191

$0.975

$0.936

$0.897

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Aztec Data Supply Inc.

USA . 3,958 parts In-Stock

1+ parts

$1.680

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$1.680

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CoreStaff

Japan . 7,500 parts In-Stock

1+ parts

$1.976

100+ parts

$0.790

1k+ parts

$0.743

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$1.976

$0.790

$0.743

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Perfect Parts

USA . 22,107 parts In-Stock

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Lixinc

USA . 15,837 parts In-Stock

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A-Z Elektronik GmbH

Germany . 8,084 parts In-Stock

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Argo Parts USA

USA . 4,175 parts In-Stock

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Continental Prestige Electronics

USA . 3,414 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Kepictronics

USA . 1,800 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Corphita

USA . 418 parts In-Stock

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418

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Overview

Upgrade your power systems with the SPD02N80C3 from Infineon Technologies. Known for their high-quality manufacturing, Infineon delivers reliable Power FETs that are perfect for a variety of switching applications. With a maximum breakdown voltage of 800V and a compact rectangular package, this N-CHANNEL FET offers enhanced performance and efficiency. Say goodbye to power disruptions and hello to seamless operations with the value and benefits that the SPD02N80C3 brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the FET, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics than P-channel FETs, making this product a good choice for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers reliable and efficient performance in controlling the flow of power.

Minimum DS Breakdown Voltage: 800 V

With a high breakdown voltage, this FET can handle high voltages without breakdown, making it suitable for high power applications.

Maximum Drain Current (ID): 2 A

The high maximum drain current allows for efficient power handling, making this FET suitable for a variety of applications.

Maximum Power Dissipation (Abs): 42 W

With a high power dissipation rating, this FET can handle heat dissipation effectively, ensuring reliable operation under heavy loads.

Technical Specifications

Power Field Effect Transistors (FET) SPD02N80C3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, HIGH VOLTAGE

Avalanche Energy Rating (EAS):

90 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (Abs) (ID):

2 A

Maximum Drain Current (ID):

2 A

Maximum Drain-Source On Resistance:

2.7 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

6 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SPD02N80C3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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