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SPD06N60C3ATMA1

Infineon Technologies

SPD06N60C3ATMA1 by Infineon Technologies

SPD06N60C3ATMA1 by Infineon Technologies is a power FET with a min DS breakdown voltage of 600V. It is an N-channel transistor used for switching applications, with a max pulsed drain current of 18.6A and a max drain-source on resistance of 0.75 ohm.

Median Price

$0.722

Lifecycle Status

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8

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1k+

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Mouser Electronics

USA . 1,290 parts In-Stock

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$2.650

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$1.220

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$0.885

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$2.650

$1.220

$0.885

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Arrow

USA . 5,000 parts In-Stock

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$0.646

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$0.646

Verical

USA . 5,000 parts In-Stock

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$0.615

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$0.615

Chip1Stop

Japan . 5,000 parts In-Stock

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$0.798

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Chip Stock

USA . 6,500 parts In-Stock

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Vyrian

USA . 5,112 parts In-Stock

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Digiode

USA . 468 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Corohmni

South Africa . 162 parts In-Stock

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$0.457

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162

$0.457

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Aztec Data Supply Inc.

USA . 107 parts In-Stock

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$0.580

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107

$0.580

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Semicontronic

India . 2,982 parts In-Stock

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$0.610

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$0.595

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$0.592

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2,982

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Decca Corp

Germany . 2,879 parts In-Stock

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$0.610

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$0.598

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$0.592

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2,879

$0.610

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$0.592

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Ampacity Inc.

Singapore . 2,991 parts In-Stock

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$1.320

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$1.320

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Modulus Dynamics

Lithuania . 5,137 parts In-Stock

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$1.740

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$1.670

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$1.601

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$1.740

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Microchip USA

USA . 2,380 parts In-Stock

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$7.163

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AZTECH Wire

Italy . 517 parts In-Stock

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$13.300

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RC Electronics

USA . 36,042 parts In-Stock

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$1.040

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$0.950

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$0.920

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Component Stockers USA

USA . 5,053 parts In-Stock

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Argo Parts USA

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GreenTree Electronics

Israel . 2,500 parts In-Stock

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Glotronic Ltd.

UK . 2,000 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Continental Prestige Electronics

USA . 269 parts In-Stock

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Corphita

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Overview

Experience the power and reliability of Infineon Technologies with the SPD06N60C3ATMA1 Power Field Effect Transistor. Designed with precision and innovation, this N-CHANNEL transistor offers exceptional performance in a compact package. Whether you need high-speed switching capabilities or enhanced efficiency, this transistor is perfect for a wide range of applications. With its built-in diode and 600V breakdown voltage, it ensures optimal functionality and durability. Trust Infineon Technologies to deliver cutting-edge solutions that exceed your expectations. Upgrade your devices today and enjoy the benefits of superior quality and performance.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The use of plastic/epoxy in the package body material provides a durable and lightweight design, making this FET ideal for various applications.

Polarity or Channel Type:

N-CHANNEL - The N-channel configuration allows for superior performance and efficient power handling, making it suitable for high-power switching applications.

Configuration:

SINGLE WITH BUILT-IN DIODE - The built-in diode enhances the product's versatility, enabling it to handle both switching and rectification tasks, making it an excellent choice for various circuit designs.

Transistor Application:

SWITCHING - Specifically designed for switching applications, this FET provides fast switching speeds and low power consumption, making it ideal for use in power electronics and motor controls.

Surface Mount:

YES - The surface mount feature simplifies PCB assembly and increases space efficiency, making it convenient and suitable for compact electronic designs.

Minimum DS Breakdown Voltage:

600 V - With a high DS breakdown voltage, this FET can handle high voltage levels, ensuring reliable performance and protection against voltage spikes in power circuits.

Package Shape:

RECTANGULAR - The rectangular package shape allows for easy mounting and placement on PCBs, facilitating efficient production and space utilization.

Terminal Form:

GULL WING - The gull wing terminal form enhances solder joint reliability and ease of assembly, ensuring increased mechanical stability and electrical connectivity.

Operating Mode:

ENHANCEMENT MODE - The enhancement mode operation provides excellent control and low leakage currents, making it suitable for applications requiring precise power regulation and efficient energy management.

Maximum Pulsed Drain Current (IDM):

18.6 A - With a high maximum pulsed drain current, this FET can handle large current surges, making it ideal for handling peak loads and short-duration power demands.

Avalanche Energy Rating (EAS):

200 mJ - The high avalanche energy rating allows this FET to withstand energy surges and transient events, ensuring reliable operation in rugged environments and protection against voltage spikes.

No. of Terminals:

2 - With only two terminals, this FET offers simplicity in circuit design and ease of integration, making it suitable for compact or space-constrained applications.

Package Style (Meter):

SMALL OUTLINE - The small outline package style reduces the footprint and offers space-saving advantages, making it perfect for applications with limited board space.

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR - With metal-oxide semiconductor technology, this FET provides high switching speeds, low power consumption, and excellent thermal properties for efficient operation and improved performance.

Transistor Element Material:

SILICON - The use of silicon as the transistor element material ensures high durability, thermal stability, and compatibility with various circuit designs, making it a reliable choice.

Terminal Finish:

TIN - The tin terminal finish offers excellent solderability and corrosion resistance, ensuring reliable electrical connections and long-term performance in demanding environments.

Maximum Drain Current (ID):

6.2 A - With a high maximum drain current, this FET can handle substantial current flows, making it suitable for applications requiring high power output and efficiency.

Maximum Drain-Source On Resistance:

0.75 ohm - The low drain-source on resistance minimizes power losses and enhances efficiency, making it an excellent choice for applications requiring high current handling and low voltage drop.

Terminal Position:

SINGLE - The single terminal position simplifies circuit design and assembly, ensuring ease of integration and reducing manufacturing complexities.

Case Connection:

DRAIN - The drain case connection offers improved thermal dissipation and enhanced protection against heat buildup, ensuring reliable performance in high-power applications.

Technical Specifications

Power Field Effect Transistors (FET) SPD06N60C3ATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

HIGH VOLTAGE

Avalanche Energy Rating (EAS):

200 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

6.2 A

Maximum Drain-Source On Resistance:

.75 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

18.6 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SPD06N60C3ATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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