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SPD06N80C3BTMA1

Infineon Technologies

SPD06N80C3BTMA1 by Infineon Technologies

Infineon Technologies' SPD06N80C3BTMA1 is a power FET with N-channel configuration and built-in diode. It has a min DS breakdown voltage of 800V, making it suitable for switching applications. With a max pulsed drain current of 18A and low on-resistance of 0.9 ohm, it offers efficient performance in various electronic devices.

Median Price

$2.240

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 39 parts In-Stock

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$2.240

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Chip Stock

USA . 31,496 parts In-Stock

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Vyrian

USA . 7,724 parts In-Stock

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7,724

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Elcom Components

USA . 1,763 parts In-Stock

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Digiode

USA . 701 parts In-Stock

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701

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 332 parts In-Stock

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$0.840

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332

$0.840

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Modulus Dynamics

Lithuania . 6,425 parts In-Stock

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$2.200

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$2.112

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$2.024

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6,425

$2.200

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$2.024

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Corohmni

South Africa . 124 parts In-Stock

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$2.200

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Argo Parts USA

USA . 2,776 parts In-Stock

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$2.240

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Continental Prestige Electronics

USA . 1,311 parts In-Stock

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$2.240

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$2.195

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Ampacity Inc.

Singapore . 589 parts In-Stock

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$4.050

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589

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AZTECH Wire

Italy . 872 parts In-Stock

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$10.118

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Semicontronic

India . 1,457 parts In-Stock

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$46.050

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$44.899

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$44.668

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$44.899

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Microchip USA

USA . 3,741 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$2.195

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$2.128

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$2.083

1,000

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$2.195

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$2.083

Corphita

USA . 321 parts In-Stock

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Overview

Discover the SPD06N80C3BTMA1 by Infineon Technologies, a top-quality Power Field Effect Transistor (FET) designed to meet all your switching needs. With its single configuration and built-in diode, this N-channel transistor offers exceptional performance and reliability. Whether you're working on industrial or automotive applications, this surface-mount device is perfect for you. Boasting a minimum DS breakdown voltage of 800V and maximum pulsed drain current of 18A, it delivers unrivaled power. Experience the benefits of Infineon Technologies' superior manufacturing expertise – choose the SPD06N80C3BTMA1 for ultimate value and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's plastic/epoxy package body material provides durability and protection, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

The N-channel polarity or channel type of this product ensures efficient and reliable channel control, making it ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The single configuration with a built-in diode feature of this product allows for simplified circuit design and enhanced functionality.

Transistor Application: SWITCHING

This product is specifically designed for switching applications, ensuring optimal performance and reliable operation.

Surface Mount: YES

The surface mount capability of this product enables easy and secure installation on PCBs, saving space and time during assembly.

Minimum DS Breakdown Voltage: 800 V

With a minimum DS breakdown voltage of 800 V, this product can handle high voltage applications, making it suitable for power-related tasks.

Package Shape: RECTANGULAR

The rectangular package shape of this product offers a compact and space-saving design, making it versatile and suitable for various device configurations.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connectivity, ensuring efficient power delivery and signal transmission.

Operating Mode: ENHANCEMENT MODE

With an enhancement mode operating mode, this product offers enhanced control and performance, delivering precise switching capabilities.

No. of Elements: 1

This product consists of a single element, providing a simplified circuit design and reducing complexity in applications.

Maximum Pulsed Drain Current (IDM): 18 A

The maximum pulsed drain current of 18 A allows this product to handle high current demands, making it suitable for demanding tasks.

Avalanche Energy Rating (EAS): 230 mJ

With an avalanche energy rating of 230 mJ, this product can handle sudden high-energy events, ensuring protection and reliability in harsh conditions.

No. of Terminals: 2

This product has two terminals, providing a simple and straightforward connection for easy integration into electronic systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers compactness and space-saving advantages, enabling flexible and efficient system integration.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

This product utilizes metal-oxide semiconductor technology, offering low power consumption, high efficiency, and excellent performance characteristics.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this product can withstand elevated temperatures, ensuring reliable operation in demanding environments.

Transistor Element Material: SILICON

The silicon transistor element material provides reliable and stable performance, making this product suitable for various applications.

Terminal Finish: TIN

The tin terminal finish ensures optimum conductivity and resistance against corrosion, ensuring long-term reliability and performance.

Maximum Drain Current (ID): 6 A

With a maximum drain current of 6 A, this product is capable of delivering substantial current for powering various electronic devices and systems.

Maximum Drain-Source On Resistance: 0.9 ohm

The maximum drain-source on resistance of 0.9 ohm ensures minimal power loss and efficient power transfer, making this product ideal for high-performance applications.

Terminal Position: SINGLE

The single terminal position provides a straightforward and convenient connection, simplifying the integration process in electronic systems.

Moisture Sensitivity Level (MSL): 1

With a moisture sensitivity level of 1, this product has excellent moisture resistance, ensuring reliable performance even in humid environments.

Case Connection: DRAIN

The drain case connection enhances thermal dissipation and allows for efficient heat management, ensuring durability and reliability in demanding conditions.

Maximum Time At Peak Reflow Temperature (s): 40

This product can withstand a maximum time of 40 seconds at the peak reflow temperature, ensuring secure and reliable soldering during assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can handle high-temperature soldering processes, ensuring a robust and reliable connection.

Technical Specifications

Power Field Effect Transistors (FET) SPD06N80C3BTMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, HIGH VOLTAGE

Avalanche Energy Rating (EAS):

230 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (ID):

6 A

Maximum Drain-Source On Resistance:

.9 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

18 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SPD06N80C3BTMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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