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SAK-XC164CS-32F40FBB-A

Infineon Technologies

SAK-XC164CS-32F40FBB-A by Infineon Technologies

SAK-XC164CS-32F40FBB-A by Infineon: 16-bit microcontroller with 24-bit address bus, 16 MHz clock frequency. Ideal for automotive applications due to its low profile, fine pitch package and RISC technology. Features include Flash ROM programmability, 79 I/O lines, and PWM channels for versatile functionality.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 881 parts In-Stock

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Digiode

USA . 90 parts In-Stock

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90

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Nova Conductors

Japan . 50 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 258 parts In-Stock

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$10.790

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258

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Ampacity Inc.

Singapore . 697 parts In-Stock

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$33.000

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Semicontronic

India . 822 parts In-Stock

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$35.000

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$34.125

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$33.950

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822

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$33.950

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Corohmni

South Africa . 301 parts In-Stock

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$36.836

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301

$36.836

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Andel Nordic

Denmark . 2,739 parts In-Stock

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$52.470

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$36.729

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$36.729

2,739

$52.470

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$36.729

$36.729

Modulus Dynamics

Lithuania . 2,805 parts In-Stock

1+ parts

$59.763

100+ parts

$57.372

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$54.982

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2,805

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$54.982

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Bastille Electronics

Australia . 4,487 parts In-Stock

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Argo Parts USA

USA . 4,198 parts In-Stock

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Continental Prestige Electronics

USA . 3,783 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,993 parts In-Stock

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GreenTree Electronics

Israel . 1,080 parts In-Stock

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Corphita

USA . 624 parts In-Stock

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Perfect Parts

USA . 605 parts In-Stock

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Kepictronics

USA . 125 parts In-Stock

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125

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Overview

Unlock the power of innovation with the SAK-XC164CS-32F40FBB-A microcontroller by Infineon Technologies. Designed with precision and reliability in mind, this cutting-edge device offers unparalleled performance for a wide range of applications in the automotive industry and beyond. From its advanced technology to its sleek design, customers can trust in the quality and value that this product delivers. Experience the difference with the SAK-XC164CS-32F40FBB-A and elevate your projects to new heights of success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for applications where weight and durability are important factors.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation, making this product ideal for mass production and compact designs.

Maximum Supply Voltage: 2.7 V

With a maximum supply voltage of 2.7V, this product is energy-efficient and can operate within a low voltage range, making it suitable for battery-powered devices.

Address Bus Width: 24

A wider address bus width allows for a larger memory capacity and faster data transfer, making this product suitable for applications that require high-speed processing and large data storage.

Package Shape: SQUARE

The square package shape provides a compact design, saving space on a circuit board, making it ideal for applications with limited board space.

Bit Size: 16

With a bit size of 16, this product offers a good balance between performance and cost, making it a versatile choice for a wide range of applications.

No. of Terminals: 100

The high number of terminals provides ample connectivity options, allowing for versatile and customizable designs using this product.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style offers a sleek and compact design, making this product suitable for applications where space is limited.

Minimum Supply Voltage: 2.35 V

With a minimum supply voltage of 2.35V, this product can operate efficiently even with low power sources, making it ideal for energy-efficient applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability in high-temperature environments, making this product suitable for industrial and automotive applications.

Technical Specifications

Microcontrollers SAK-XC164CS-32F40FBB-A attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

79

No. of Terminals:

100

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.35 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SAK-XC164CS-32F40FBB-A Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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