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SAK-XC2365-72F66LAC

Infineon Technologies

SAK-XC2365-72F66LAC by Infineon Technologies

SAK-XC2365-72F66LAC by Infineon: 32-bit microcontroller with 40MHz clock, 24-bit address bus, and 16-bit external data bus. Ideal for applications requiring ADC/DMA channels, PWM support, and 73 I/O lines in a compact package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,594 parts In-Stock

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Digiode

USA . 758 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Ampacity Inc.

Singapore . 1,050 parts In-Stock

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$17.000

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$17.000

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AZTECH Wire

Italy . 316 parts In-Stock

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$18.760

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316

$18.760

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Modulus Dynamics

Lithuania . 3,504 parts In-Stock

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$41.084

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$39.441

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$37.797

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$41.084

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$37.797

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Corohmni

South Africa . 847 parts In-Stock

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$60.487

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$60.487

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Component Stockers USA

USA . 238 parts In-Stock

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$99.990

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Argo Parts USA

USA . 5,104 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,815 parts In-Stock

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Continental Prestige Electronics

USA . 655 parts In-Stock

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655

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Aranea Global

USA . 500 parts In-Stock

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500

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Microchip USA

USA . 258 parts In-Stock

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Corphita

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Overview

Elevate your projects with the cutting-edge SAK-XC2365-72F66LAC microcontroller by Infineon Technologies. As a leader in the industry, Infineon delivers top-quality products that guarantee superior performance and reliability. This versatile microcontroller is perfect for a wide range of applications, offering advanced features like ADC and DMA channels, PWM channels, and a high clock frequency of 40 MHz. With Infineon's SAK-XC2365-72F66LAC, you can unlock endless possibilities and take your designs to the next level. Upgrade today and experience the value and benefits it brings to your projects!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the microcontroller onto a circuit board, saving time and ensuring reliable connections.

Maximum Supply Voltage: 1.6 V

Operates within a safe voltage range, protecting the microcontroller from potential damage due to overvoltage.

Address Bus Width: 24

Wide address bus width allows for efficient memory addressing, improving overall performance of the microcontroller.

Package Shape: SQUARE

Square package shape makes it easier to integrate the microcontroller into a circuit design, optimizing space usage.

Bit Size: 32

32-bit architecture provides high processing power and precision, making it suitable for handling complex tasks efficiently.

No. of Terminals: 100

Ample number of terminals allow for versatile connection options with other components, increasing the flexibility of the microcontroller.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Various package styles offer different mounting options, catering to diverse design requirements and ensuring compatibility with different circuit layouts.

Minimum Supply Voltage: 1.4 V

Wide operating voltage range allows for flexibility in power supply selection, accommodating different system configurations.

ADC Channels: YES

Integrated ADC channels enable analog signal conversion, making the microcontroller suitable for applications requiring analog input processing.

DMA Channels: YES

DMA channels enhance data transfer efficiency and reduce CPU load, improving overall system performance in data-intensive operations.

Terminal Position: QUAD

Quad terminal position facilitates easy connectivity and efficient signal routing, contributing to reliable circuit operation.

Width: 14 mm

Compact width dimension allows for space-saving integration in tight PCB layouts, ideal for applications with size constraints.

External Data Bus Width: 16

Wide external data bus width facilitates high-speed data transfer between the microcontroller and external memory, enhancing overall system speed.

Maximum Clock Frequency: 40 MHz

High clock frequency enables rapid processing of instructions, making the microcontroller suitable for tasks requiring real-time responsiveness.

Length: 14 mm

Short length dimension complements the compact width, further optimizing space usage in circuit board designs.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller architecture offers efficient instruction execution and low power consumption, suitable for battery-powered devices and embedded systems.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering and ensures secure mechanical connections, enhancing the durability and reliability of the microcontroller.

Nominal Supply Voltage: 1.5 V

Stable nominal supply voltage ensures consistent performance and reliable operation of the microcontroller under varying load conditions.

PWM Channels: YES

Integrated PWM channels enable precise control of analog output signals, making the microcontroller suitable for applications requiring accurate signal modulation.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, saving space and enabling compact circuit board designs.

Speed: 80 rpm

High speed rating ensures fast data processing and response times, making the microcontroller ideal for applications requiring rapid computation.

No. of I/O Lines: 73

Abundant I/O lines facilitate versatile interfacing with external devices and peripherals, enhancing the microcontroller's connectivity and functionality.

Technical Specifications

Microcontrollers SAK-XC2365-72F66LAC attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Length:

14 mm

No. of I/O Lines:

73

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Speed:

80 rpm

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SAK-XC2365-72F66LAC Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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