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SAK-XC886CM-8FFA5VACTR

Infineon Technologies

SAK-XC886CM-8FFA5VACTR by Infineon Technologies

SAK-XC886CM-8FFA5VACTR by Infineon: 8-bit microcontroller with 32768 ROM words, 1756 RAM bytes, and 12 MHz clock frequency. Ideal for automotive applications due to its CAN, LIN, SSC, and UART connectivity options. Operates in a temperature range of -40 to 125 °C.

Median Price

-

Lifecycle Status

EOL

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3

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1k+

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Digiode

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Nova Conductors

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AZTECH Wire

Italy . 620 parts In-Stock

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Ampacity Inc.

Singapore . 946 parts In-Stock

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Modulus Dynamics

Lithuania . 2,205 parts In-Stock

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Component Stockers USA

USA . 704 parts In-Stock

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Bastille Electronics

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Perfect Parts

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Continental Prestige Electronics

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Argo Parts USA

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Overview

Experience the next level of innovation with the SAK-XC886CM-8FFA5VACTR by Infineon Technologies. This high-quality microcontroller offers unparalleled performance and reliability, making it a top choice for automotive applications. With advanced features like CAN connectivity, PWM channels, and 8-channel ADC, this product provides customers with enhanced functionality and flexibility to meet their project requirements. Trust in the expertise of Infineon Technologies to deliver cutting-edge solutions that exceed expectations. Elevate your designs with the SAK-XC886CM-8FFA5VACTR and unlock endless possibilities in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability for the microcontroller package, ensuring long-term performance.

Maximum Supply Voltage: 2.7 V

Higher operating voltage allows for flexibility in power supply options and compatibility with a wide range of applications.

Bit Size: 8

8-bit architecture provides a good balance between performance and cost, suitable for many embedded system applications.

ADC Channels: YES

Analog to Digital Converters enable the microcontroller to interface with and process analog signals, expanding its capabilities.

ROM Words: 32768

Large ROM capacity allows for storing a significant amount of program data, supporting complex algorithms and functions.

Maximum Clock Frequency: 12 MHz

High clock frequency enables fast processing speeds, making the microcontroller suitable for real-time applications.

Peripheral IC Type: MICROCONTROLLER

Dedicated peripherals such as BOD, POR, TIMER, and WDT enhance the functionality and versatility of the microcontroller.

RAM Bytes: 1756

Sufficient RAM capacity enables efficient data storage and manipulation, supporting multitasking and data-intensive applications.

Connectivity: CAN(2), LIN, SSC, UART(2)

Multiple communication interfaces provide flexible connectivity options for interfacing with other devices and systems.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliable operation in harsh environmental conditions, making it suitable for automotive applications.

Technical Specifications

Microcontrollers SAK-XC886CM-8FFA5VACTR attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 3.3V NOMINAL SUPPLY VOLTAGE

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of I/O Lines:

34

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

1756

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

24 rpm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), LIN, SSC, UART(2)

Peripherals:

BOD, POR, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

SAK-XC886CM-8FFA5VACTR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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