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SAK-XC2267-96F80LAC

Infineon Technologies

SAK-XC2267-96F80LAC by Infineon Technologies

SAK-XC2267-96F80LAC by Infineon: 32-bit microcontroller with 24-bit address bus, 16-bit external data bus, and 40 MHz clock frequency. Ideal for automotive applications due to its CMOS technology, FLASH ROM programmability, and PWM channels for precise control.

Median Price

$25.000

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 20 parts In-Stock

1+ parts

$25.000

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20

$25.000

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Nova Conductors

Japan . 900 parts In-Stock

1+ parts

-

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900

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Digiode

USA . 206 parts In-Stock

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206

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 247 parts In-Stock

1+ parts

$8.000

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247

$8.000

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Modulus Dynamics

Lithuania . 3,207 parts In-Stock

1+ parts

$53.179

100+ parts

$51.052

1k+ parts

$48.925

10k+ parts

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3,207

$53.179

$51.052

$48.925

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Corohmni

South Africa . 631 parts In-Stock

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$63.975

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631

$63.975

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Netroflash

USA . 2,000 parts In-Stock

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2,000

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Corphita

USA . 223 parts In-Stock

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223

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Overview

Unlock the power of innovation with the SAK-XC2267-96F80LAC microcontroller by Infineon Technologies. This cutting-edge device offers unmatched quality and reliability, perfect for a wide range of applications in the automotive industry. With advanced features and superior performance, this microcontroller provides exceptional value to customers looking to stay ahead in the fast-paced world of technology. Trust Infineon Technologies to deliver top-notch solutions that drive success and efficiency in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides good durability and protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Surface mount allows for easy and efficient PCB assembly, saving time and reducing manufacturing costs.

Maximum Supply Voltage: 1.6 V

Higher maximum supply voltage provides flexibility in power requirements and compatibility with a wide range of applications.

Address Bus Width: 24

Wider address bus width allows for efficient data processing and manipulation, enhancing overall performance.

Package Shape: SQUARE

Square package shape is ideal for space-saving designs and efficient PCB layout, making it suitable for compact electronic devices.

Bit Size: 32

Larger bit size allows for handling and processing of more complex data and instructions, enabling advanced functionalities.

No. of Terminals: 100

Higher number of terminals provide more connection options and flexibility for interfacing with other components in a system.

Terminal Finish: TIN

Tin terminal finish offers good conductivity and solderability, ensuring reliable electrical connections during PCB assembly.

Maximum Clock Frequency: 40 MHz

Higher maximum clock frequency allows for faster data processing and execution of instructions, enhancing overall system performance.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliable operation in harsh environmental conditions, making it suitable for automotive applications.

Peripheral IC Type: MICROCONTROLLER

Microcontroller design provides integrated peripherals and capabilities for diverse applications, offering a comprehensive solution in a single device.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates to firmware and software, enabling flexibility and adaptability in various applications.

Technical Specifications

Microcontrollers SAK-XC2267-96F80LAC attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

73

No. of Terminals:

100

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SAK-XC2267-96F80LAC Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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