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SAK-XC2287-96F66LAC

Infineon Technologies

SAK-XC2287-96F66LAC by Infineon Technologies

SAK-XC2287-96F66LAC by Infineon: 32-bit microcontroller with 24-bit address bus, 16-bit external data bus, and 40 MHz clock frequency. Ideal for automotive applications due to its CMOS technology, FLASH ROM programmability, and PWM channels for precise control.

Median Price

$6.540

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1 parts In-Stock

1+ parts

$6.540

100+ parts

$6.410

1k+ parts

$6.280

10k+ parts

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1

$6.540

$6.410

$6.280

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Distributors (In-Stock)

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Digiode

USA . 381 parts In-Stock

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381

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Vyrian

USA . 171 parts In-Stock

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171

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Nova Conductors

Japan . 48 parts In-Stock

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48

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Distributors (Availability)

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Ampacity Inc.

Singapore . 272 parts In-Stock

1+ parts

$6.000

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272

$6.000

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Modulus Dynamics

Lithuania . 4,057 parts In-Stock

1+ parts

$28.473

100+ parts

$27.334

1k+ parts

$26.195

10k+ parts

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4,057

$28.473

$27.334

$26.195

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Corohmni

South Africa . 64 parts In-Stock

1+ parts

$46.697

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64

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Argo Parts USA

USA . 2,567 parts In-Stock

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2,567

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Continental Prestige Electronics

USA . 1,057 parts In-Stock

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1,057

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Netroflash

USA . 1,000 parts In-Stock

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Corphita

USA . 890 parts In-Stock

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890

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Overview

Unlock the power of innovation with the SAK-XC2287-96F66LAC microcontroller by Infineon Technologies. This cutting-edge device offers unparalleled quality and reliability, perfect for a wide range of applications in the automotive industry and beyond. With advanced features like ADC channels, PWM channels, and ROM programmability, this microcontroller delivers exceptional performance and flexibility to meet your unique needs. Experience the value and benefits of Infineon's expertise in technology with the SAK-XC2287-96F66LAC, setting new standards in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the microcontroller.

Surface Mount: YES

Allows for easy integration into various electronic circuits and PCB designs.

Maximum Supply Voltage: 1.6 V

Operates efficiently within a safe voltage range.

Address Bus Width: 24

Enables the microcontroller to efficiently address a large memory space.

Package Shape: SQUARE

Optimizes space utilization on the PCB.

Bit Size: 32

Provides enhanced processing capabilities for complex algorithms and tasks.

No. of Terminals: 144

Offers multiple connection points for interfacing with external devices and peripherals.

Terminal Finish: MATTE TIN

Ensures good conductivity and solderability for reliable connections.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling the microcontroller to interact with analog sensors and signals.

Maximum Clock Frequency: 40 MHz

Enables fast processing speeds and real-time responsiveness.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications where temperature variations are common.

ROM Programmability: FLASH

Facilitates easy reprogramming of the microcontroller's memory.

PWM Channels: YES

Supports pulse-width modulation for precise control of output signals.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture, ensuring reliability in different environments.

Technical Specifications

Microcontrollers SAK-XC2287-96F66LAC attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

115

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

66 rpm

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

SAK-XC2287-96F66LAC Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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