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SAK-XC161CS-32F40FBB-ATR

Infineon Technologies

SAK-XC161CS-32F40FBB-ATR by Infineon Technologies

SAK-XC161CS-32F40FBB-ATR by Infineon is a 16-bit microcontroller with 262144 ROM words, 12288 RAM bytes, and 12-Ch 10-Bit ADC channels. Ideal for automotive applications, it offers connectivity options like CAN(2), I2C, SPI(2), USART(2) and features peripherals such as RTC and PWM channels. Operating at a max clock frequency of 16 MHz, it has a temperature range from -40 to 125 °C.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 966 parts In-Stock

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966

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Vyrian

USA . 616 parts In-Stock

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616

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Nova Conductors

Japan . 15 parts In-Stock

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15

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Distributors (Availability)

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AZTECH Wire

Italy . 616 parts In-Stock

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$14.314

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616

$14.314

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Semicontronic

India . 1,074 parts In-Stock

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$33.000

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$32.175

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$32.010

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1,074

$33.000

$32.175

$32.010

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Ampacity Inc.

Singapore . 1,256 parts In-Stock

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$34.000

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1,256

$34.000

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Modulus Dynamics

Lithuania . 1,698 parts In-Stock

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$74.300

100+ parts

$71.328

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$68.356

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1,698

$74.300

$71.328

$68.356

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Component Stockers USA

USA . 695 parts In-Stock

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$99.990

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695

$99.990

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Bastille Electronics

Australia . 4,970 parts In-Stock

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Argo Parts USA

USA . 2,796 parts In-Stock

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Perfect Parts

USA . 1,120 parts In-Stock

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Corphita

USA . 251 parts In-Stock

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Continental Prestige Electronics

USA . 99 parts In-Stock

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99

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Overview

Unlock endless possibilities with the SAK-XC161CS-32F40FBB-ATR by Infineon Technologies. This high-quality microcontroller offers exceptional performance and reliability, making it the perfect choice for a wide range of automotive applications. With advanced features such as multiple peripherals, high clock frequency, and extensive connectivity options, this product provides unparalleled value and benefits to customers looking for cutting-edge technology in a compact and efficient package. Trust Infineon Technologies to deliver innovative solutions that drive your projects forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for package body.

Surface Mount: YES

Easy and efficient installation on circuit boards.

Maximum Supply Voltage: 2.7 V

Operates efficiently with low voltage supply.

Address Bus Width: 24

Allows for a larger memory address space.

Bit Size: 16

Suitable for moderate complexity applications.

No. of Terminals: 144

Sufficient number of terminals for connectivity.

Minimum Supply Voltage: 2.35 V

Can operate with slightly lower supply voltage for energy efficiency.

Maximum Operating Temperature: 125 °C

High operating temperature range for robust use cases.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures for versatility.

ADC Channels: YES

Supports analog to digital conversion for sensor integration.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for microcontroller applications.

ROM Words: 262144

Large memory capacity for program storage.

Maximum Clock Frequency: 16 MHz

High clock frequency for fast operation.

RAM Bytes: 12288

Adequate RAM for data processing and storage.

Analog To Digital Convertors: 12-Ch 10-Bit

Multiple ADC channels for accurate sensor readings.

Connectivity: CAN(2), I2C, SPI(2), USART(2)

Various communication interfaces for connectivity options.

Technical Specifications

Microcontrollers SAK-XC161CS-32F40FBB-ATR attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

99

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

12288

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.35 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C, SPI(2), USART(2)

Peripherals:

RTC, TIMER(9), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

SAK-XC161CS-32F40FBB-ATR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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