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SAKXC167CI32F40FBBAT

Infineon Technologies

SAKXC167CI32F40FBBAT by Infineon Technologies

SAKXC167CI32F40FBBAT by Infineon: 16-bit microcontroller with 262144 ROM words, 12288 RAM bytes, and 16 ADC channels. Ideal for automotive applications due to its low profile package style, wide temperature range (-40 to 125 °C), and connectivity options like CAN and I2C. Max clock frequency of 16 MHz ensures high-speed performance in various automotive systems.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 940 parts In-Stock

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Vyrian

USA . 197 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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Semicontronic

India . 262 parts In-Stock

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$2.000

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$1.950

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$1.940

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$2.000

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$1.940

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AZTECH Wire

Italy . 461 parts In-Stock

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$11.755

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Ampacity Inc.

Singapore . 1,565 parts In-Stock

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Modulus Dynamics

Lithuania . 634 parts In-Stock

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$19.178

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$18.411

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$17.644

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$17.644

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Corohmni

South Africa . 279 parts In-Stock

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$22.717

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Aztec Data Supply Inc.

USA . 299 parts In-Stock

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$22.900

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Argo Parts USA

USA . 4,030 parts In-Stock

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Bastille Electronics

Australia . 2,474 parts In-Stock

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Continental Prestige Electronics

USA . 2,409 parts In-Stock

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Corphita

USA . 650 parts In-Stock

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Overview

Experience the power and precision of the SAKXC167CI32F40FBBAT microcontroller by Infineon Technologies, a leader in cutting-edge technology. Perfect for automotive applications, this microcontroller offers unmatched performance and reliability. With features like 16-bit address and data bus widths, 16 MHz clock frequency, and 16-channel 10-bit ADC, this device provides seamless connectivity with ASC, CAN, I2C, and more. Trust Infineon's quality to deliver exceptional value and efficiency to your projects. Elevate your designs with the SAKXC167CI32F40FBBAT microcontroller today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Makes the product lightweight and durable, ideal for portable applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and cost.

Maximum Supply Voltage: 2.7 V

Provides flexibility in power input options for compatibility with various systems.

Address Bus Width: 16

Enables efficient data transfer and address decoding for complex operations.

Package Shape: SQUARE

Provides a compact form factor, saving space on the PCB.

Bit Size: 16

Allows for processing of larger data chunks, improving overall performance.

No. of Terminals: 144

Offers flexibility in connectivity options for interfacing with external devices.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

Facilitates easy integration into tight spaces with high-density components.

Minimum Supply Voltage: 2.35 V

Ensures stable operation at low power input levels, extending battery life.

Maximum Operating Temperature: 125 °C

Suitable for harsh environments or applications requiring high temperature tolerance.

Minimum Operating Temperature: -40 °C

Ensures operation in extreme cold conditions without performance issues.

ADC Channels: YES

Allows for analog signal conversion for sensor interfacing and data acquisition.

Terminal Position: QUAD

Facilitates easy PCB layout and routing of connections for improved signal integrity.

ROM Words: 262144

Offers ample storage for program code and data, enabling complex algorithms and applications.

Maximum Seated Height: 1.6 mm

Low-profile design minimizes space requirements and allows for compact designs.

Width: 20 mm

Compact width makes it suitable for applications with space constraints.

External Data Bus Width: 16

Supports high-speed data transfer between the microcontroller and external devices.

Peripherals: RTC, TIMER(11), WDT

Offers additional features for precise timing, watchdog functionality, and real-time clock operations.

Maximum Clock Frequency: 16 MHz

Provides high-speed processing capabilities for fast execution of instructions.

Length: 20 mm

Compact length for space-saving designs and flexibility in placement on the PCB.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications with strict temperature requirements and reliability standards.

Peripheral IC Type: MICROCONTROLLER

Dedicated microcontroller functionality for efficient control and processing tasks.

RAM Bytes: 12288

Sufficient RAM capacity for temporary data storage and processing requirements.

Technology: CMOS

Offers low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

Facilitates easy soldering and robust mechanical connections for durability.

Analog To Digital Convertors: 16-Ch 10-Bit

Allows for multiple analog inputs to be converted into digital signals for processing.

Nominal Supply Voltage: 2.5 V

Provides a stable voltage level for reliable operation under normal operating conditions.

PWM Channels: YES

Supports pulse-width modulation for precise control of motors, LEDs, and other devices.

Connectivity: ASC(2), CAN(2), I2C, SSC(2)

Offers versatile communication interfaces for connecting to a wide range of peripherals.

ROM Programmability: FLASH

Enables easy reprogramming of the onboard memory for firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine pitch terminals allow for higher pin density and compact PCB layout.

Speed: 40 rpm

Suitable for applications requiring precise control over rotational speed or positioning.

On Chip Program ROM Width: 8

Ample onboard program memory width for storing firmware and data.

No. of I/O Lines: 103

Provides a high number of I/O lines for interfacing with multiple external devices and peripherals.

Technical Specifications

Microcontrollers SAKXC167CI32F40FBBAT attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

16

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

103

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

12288

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.35 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ASC(2), CAN(2), I2C, SSC(2)

Peripherals:

RTC, TIMER(11), WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

SAKXC167CI32F40FBBAT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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