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SAKXC167CI32F40FBBATR

Infineon Technologies

SAKXC167CI32F40FBBATR by Infineon Technologies

SAKXC167CI32F40FBBATR by Infineon: 16-bit microcontroller with 262144 ROM words, 16 ADC channels, and 12288 RAM bytes. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and connectivity options like CAN(2) and I2C. Max clock frequency of 16 MHz for high-speed performance in automotive systems.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,466 parts In-Stock

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Digiode

USA . 453 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Semicontronic

India . 559 parts In-Stock

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$3.000

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$2.925

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$2.910

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$3.000

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$2.910

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AZTECH Wire

Italy . 395 parts In-Stock

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$16.234

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Ampacity Inc.

Singapore . 717 parts In-Stock

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Modulus Dynamics

Lithuania . 2,868 parts In-Stock

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$32.467

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$31.114

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Corohmni

South Africa . 1,248 parts In-Stock

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$50.415

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Aztec Data Supply Inc.

USA . 76 parts In-Stock

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Continental Prestige Electronics

USA . 3,715 parts In-Stock

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Bastille Electronics

Australia . 2,298 parts In-Stock

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Argo Parts USA

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Corphita

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Overview

Unlock the power of cutting-edge technology with the SAKXC167CI32F40FBBATR microcontroller by Infineon Technologies. As a trusted manufacturer in the industry, Infineon delivers high-quality products designed to meet the demands of various applications. With its compact package and advanced features like ADC Channels, PWM Channels, and Connectivity options, this microcontroller is a versatile solution for automotive and industrial projects. Experience seamless performance, reliability, and efficiency with the SAKXC167CI32F40FBBATR, bringing unparalleled value and benefits to your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Ease of installation and space-saving design.

Maximum Supply Voltage: 2.7 V

Allows for a wide range of voltage input options without risking damage to the microcontroller.

Address Bus Width: 16

Allows for efficient data transfer and processing within the microcontroller.

Package Shape: SQUARE

Aesthetically pleasing design that can fit easily into various electronic devices.

Bit Size: 16

Provides sufficient processing power for a range of applications.

No. of Terminals: 144

Offers versatility in connectivity options for integrating the microcontroller into different systems.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Compact and low-profile design for efficient use of space in electronic devices.

Minimum Supply Voltage: 2.35 V

Ensures reliable performance even at lower voltage inputs.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions, expanding its usability.

ADC Channels: YES

Allows for analog to digital conversion, enabling the microcontroller to interact with analog signals.

Terminal Position: QUAD

Quad terminal positioning provides stability and ease of connection.

ROM Words: 262144

Large ROM size for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design for space-constrained applications.

Width: 20 mm

Compact width for fitting into various electronic devices.

External Data Bus Width: 16

Efficient data transfer capabilities for processing information.

Peripherals: RTC, TIMER(11), WDT

Includes various peripherals for enhanced functionality and features.

Maximum Clock Frequency: 16 MHz

High clock frequency for fast processing speeds.

Length: 20 mm

Compact length for fitting into different electronic devices.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive temperature requirements.

Peripheral IC Type: MICROCONTROLLER

Specifically designed for microcontroller applications with integrated peripherals.

RAM Bytes: 12288

Sufficient RAM memory for storing data during processing.

Technology: CMOS

Low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

Gull wing terminals for secure and reliable connections.

Analog To Digital Convertors: 16-Ch 10-Bit

Multiple ADC channels for precise analog to digital conversion.

Nominal Supply Voltage: 2.5 V

Stable supply voltage for consistent performance.

PWM Channels: YES

Pulse Width Modulation (PWM) channels for control and signal processing.

Connectivity: ASC(2), CAN(2), I2C, SSC(2)

Multiple connectivity options for communication with other devices.

ROM Programmability: FLASH

Flash ROM programmability for easy and quick updates.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact design and easy soldering.

Speed: 40 rpm

Operates at a speed of 40 rotations per minute for efficient processing.

On Chip Program ROM Width: 8

On-chip ROM width of 8 for storing program instructions.

No. of I/O Lines: 103

Sufficient input/output lines for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers SAKXC167CI32F40FBBATR attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

16

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

103

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

12288

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.35 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ASC(2), CAN(2), I2C, SSC(2)

Peripherals:

RTC, TIMER(11), WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

SAKXC167CI32F40FBBATR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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