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SAK-XC866-4FRI

Infineon Technologies

SAK-XC866-4FRI by Infineon Technologies

SAK-XC866-4FRI by Infineon: 8-bit microcontroller with 5V supply, 12MHz clock freq, and 512B RAM. Ideal for automotive applications due to -40 to 125 °C operating temp range. Features include 27 I/O lines, ADC channels, and ROM programmable FLASH memory.

Median Price

$3.424

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$3.424

100+ parts

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900

$3.424

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Vyrian

USA . 338 parts In-Stock

1+ parts

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338

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Digiode

USA . 55 parts In-Stock

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55

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,140 parts In-Stock

1+ parts

$3.424

100+ parts

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1k+ parts

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10k+ parts

$3.356

5,140

$3.424

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$3.356

Argo Parts USA

USA . 2,966 parts In-Stock

1+ parts

$3.424

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2,966

$3.424

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Netroflash

USA . 1,000 parts In-Stock

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$3.424

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1,000

$3.424

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AZTECH Wire

Italy . 848 parts In-Stock

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$9.559

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848

$9.559

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Corohmni

South Africa . 15 parts In-Stock

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$20.313

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15

$20.313

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Ampacity Inc.

Singapore . 1,115 parts In-Stock

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$26.000

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$26.000

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Modulus Dynamics

Lithuania . 51 parts In-Stock

1+ parts

$37.665

100+ parts

$36.158

1k+ parts

$34.652

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51

$37.665

$36.158

$34.652

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Aztec Data Supply Inc.

USA . 100 parts In-Stock

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$67.551

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100

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Corphita

USA . 16 parts In-Stock

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Overview

Elevate your projects with the SAK-XC866-4FRI by Infineon Technologies, a top-tier microcontroller that promises unmatched quality and reliability. Designed by a leading manufacturer in the industry, this versatile device offers endless possibilities for applications in various fields. From automotive to industrial automation, this microcontroller delivers exceptional performance, efficiency, and precision. Experience the value and benefits it brings to your projects, unlock new opportunities, and achieve unparalleled results with the SAK-XC866-4FRI.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and resistance to damage, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly on circuit boards, saving time and effort in production.

Maximum Supply Voltage: 5.5 V

Higher maximum supply voltage provides flexibility in power options and compatibility with a wide range of applications.

Package Shape: RECTANGULAR

Rectangular package shape is common and standardized, making it easy to design and integrate into various systems.

Bit Size: 8

8-bit processing capability allows for handling relatively complex tasks and calculations, suitable for many applications.

Power Supplies (V): 5

Stable 5V power supply ensures consistent performance and reliable operation of the microcontroller.

No. of Terminals: 38

Higher number of terminals provide more connectivity options and interfacing capabilities for peripheral devices and sensors.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style saves space on the circuit board and allows for more efficient layout of components.

Minimum Supply Voltage: 4.5 V

Lower minimum supply voltage increases efficiency and power saving features, ideal for battery-operated devices.

Maximum Operating Temperature: 125 °C

Wide operating temperature range ensures stability and reliability in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature allows for use in extreme cold environments without performance issues.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and solderability, ensuring secure connections and reliability in electrical contact.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals, expanding its applicability.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout and provides redundancy in case of connectivity issues.

ROM Words: 16384

Large ROM capacity allows for storing extensive program code and data, suitable for complex applications.

Maximum Seated Height: 1.2 mm

Low seated height eases installation and reduces the overall profile of the device, making it suitable for compact designs.

Width: 4.4 mm

Narrow width saves space on the PCB and allows for densely packed components in the system design.

Maximum Clock Frequency: 12 MHz

High maximum clock frequency enables fast processing speed, improving real-time performance and responsiveness of the system.

Length: 9.7 mm

Compact length facilitates flexible placement on the PCB and contributes to a space-efficient design.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliable operation in automotive applications with stringent temperature requirements.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, the product integrates various peripherals and processing capabilities in a single chip, simplifying system design.

RAM Bytes: 512

Adequate RAM capacity allows for efficient data processing and manipulation, supporting the execution of complex algorithms.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing energy efficiency and reliability of the product.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical support and facilitates reliable soldering during assembly, ensuring robust connections.

Nominal Supply Voltage: 5 V

Standard 5V nominal supply voltage ensures compatibility with common power sources and simplifies circuit design.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates of firmware and software, enhancing the product's versatility and flexibility.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on the PCB, supporting compact and space-saving design requirements.

Speed: 80 rpm

Fast operating speed of 80 rpm ensures responsive performance and efficient execution of tasks, meeting the demands of various applications.

No. of I/O Lines: 27

Sufficient number of I/O lines provide ample interfacing options for communication with external devices and peripherals, enhancing connectivity.

Technical Specifications

Microcontrollers SAK-XC866-4FRI attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e3

Length:

9.7 mm

No. of I/O Lines:

27

No. of Terminals:

38

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

SAK-XC866-4FRI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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