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SAK-XC167CI-32F40FBB-A

Infineon Technologies

SAK-XC167CI-32F40FBB-A by Infineon Technologies

SAK-XC167CI-32F40FBB-A by Infineon: 16-bit microcontroller with 2.7V max supply voltage, 144 terminals, and 16MHz clock freq. Ideal for automotive applications due to its FLASH ROM programmability, PWM channels, and CMOS technology.

Median Price

$62.270

Lifecycle Status

EOL

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

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$30.480

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$30.480

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Rutronik

Germany . 21 parts In-Stock

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$62.270

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$49.470

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Maritex

Poland . 617 parts In-Stock

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$207.297

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617

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Chip Stock

USA . 3,025 parts In-Stock

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Vyrian

USA . 1,574 parts In-Stock

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Digiode

USA . 179 parts In-Stock

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EPE Components Inc.

USA . 1 parts In-Stock

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Bristol Electronics

USA . 1 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 796 parts In-Stock

1+ parts

$13.000

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$13.000

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AZTECH Wire

Italy . 526 parts In-Stock

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$13.363

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526

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Semicontronic

India . 2,654 parts In-Stock

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$14.000

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$13.650

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$13.580

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2,654

$14.000

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$13.580

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Continental Prestige Electronics

USA . 2,785 parts In-Stock

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$30.480

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$29.870

2,785

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Netroflash

USA . 50 parts In-Stock

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$30.480

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Corohmni

South Africa . 642 parts In-Stock

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$32.676

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Advanced Electronics

New Zealand . 59 parts In-Stock

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$35.357

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$32.528

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$30.480

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59

$35.357

$32.528

$30.480

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Aztec Data Supply Inc.

USA . 2,427 parts In-Stock

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$49.700

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Modulus Dynamics

Lithuania . 4,375 parts In-Stock

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$50.208

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$48.200

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$46.191

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Andel Nordic

Denmark . 1,546 parts In-Stock

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$52.190

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$36.532

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$36.532

1,546

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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Microchip USA

USA . 2,547 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,500 parts In-Stock

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Perfect Parts

USA . 806 parts In-Stock

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Argo Parts USA

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Corphita

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Overview

Elevate your projects with the SAK-XC167CI-32F40FBB-A microcontroller by Infineon Technologies. Boasting superior quality and reliability, this device is a game-changer in the world of electronics. Ideal for automotive applications, this microcontroller offers unmatched performance, efficiency, and versatility. With its advanced features and innovative design, the SAK-XC167CI-32F40FBB-A delivers exceptional value to customers looking to elevate their products to the next level. Trust in Infineon Technologies to provide cutting-edge solutions that drive success in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, ensuring longevity and reliability in various operating conditions.

Surface Mount: YES

Surface mount technology allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 2.7 V

Operates efficiently within the specified voltage range, minimizing power consumption and reducing the risk of damage from overvoltage.

Address Bus Width: 16

The 16-bit address bus width enables access to a larger memory space, increasing the capabilities and performance of the microcontroller.

Package Shape: SQUARE

The square package shape allows for easy and compact placement on circuit boards, optimizing space utilization in electronic designs.

Bit Size: 16

16-bit processing capability provides sufficient computational power for a wide range of applications, delivering efficient performance and responsiveness.

Power Supplies (V): 2.5,5

Supports multiple power supply options, allowing flexibility in design and compatibility with various power sources.

No. of Terminals: 144

The abundance of terminals provides ample connectivity options for interfacing with external components and peripherals, enhancing the versatility of the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package styles offer space-saving solutions for densely populated circuit boards, promoting efficient layout designs.

Minimum Supply Voltage: 2.35 V

Works reliably even at low supply voltages, ensuring stable operation in power-constrained environments.

Maximum Operating Temperature: 125 °C

Operates effectively at high temperatures, making it suitable for applications where thermal performance is critical, such as automotive systems.

CPU Family: C166

Belongs to the C166 CPU family, known for its robust performance and reliability, ensuring consistent operation in demanding environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely cold conditions, making it suitable for a wide range of industrial and automotive applications.

Terminal Finish: TIN

TIN terminal finish provides excellent conductivity and solderability, facilitating secure connections and reliable electrical contacts.

ADC Channels: YES

Integrated ADC channels enable analog-to-digital conversion capabilities, allowing the microcontroller to interact with analog sensors and signals effectively.

Terminal Position: QUAD

Quad terminal position offers a convenient layout for easy soldering and connection of external components, streamlining the assembly process.

ROM Words: 262144

Large ROM capacity of 262144 words enables extensive program storage, accommodating complex algorithms and applications without running out of memory.

Maximum Seated Height: 1.6 mm

With a low seated height of 1.6 mm, the microcontroller can be mounted in slim devices and compact spaces, enhancing design flexibility.

Width: 20 mm

Compact width of 20 mm enables easy integration into space-constrained electronic products, allowing for versatile design implementations.

External Data Bus Width: 16

16-bit external data bus width facilitates efficient data transfer between the microcontroller and external memory or peripherals, enhancing overall system performance.

Maximum Clock Frequency: 16 MHz

Operating at a maximum clock frequency of 16 MHz, the microcontroller provides fast and responsive processing capabilities for real-time applications.

Technical Specifications

Microcontrollers SAK-XC167CI-32F40FBB-A attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

16

CPU Family:

C166

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

103

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,5

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.35 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

SAK-XC167CI-32F40FBB-A Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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