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IPD90R1K2C3ATMA1

Infineon Technologies

IPD90R1K2C3ATMA1 by Infineon Technologies

IPD90R1K2C3ATMA1 by Infineon is a N-CHANNEL FET with 900V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 10A IDM, 68mJ EAS, and 1.2 ohm RDS(ON). Package: PLASTIC/EPOXY, GULL WING terminals, AEC-Q101 compliant.

Median Price

$0.708

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 2,500 parts In-Stock

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-

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$0.708

2,500

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$0.708

Chip1Stop

Japan . 2,500 parts In-Stock

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-

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$0.638

2,500

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$0.638

Rochester

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$0.923

1k+ parts

$0.766

10k+ parts

$0.683

2,500

-

$0.923

$0.766

$0.683

Distributors (In-Stock)

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Digiode

USA . 134 parts In-Stock

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$0.719

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$0.719

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Nova Conductors

Japan . 73 parts In-Stock

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$1.030

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Chip Stock

USA . 39,800 parts In-Stock

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39,800

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Vyrian

USA . 6,915 parts In-Stock

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EMSNET

USA . 58 parts In-Stock

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Bristol Electronics

USA . 50 parts In-Stock

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50

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Distributors (Availability)

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Semicontronic

India . 2,476 parts In-Stock

1+ parts

$0.540

100+ parts

$0.526

1k+ parts

$0.524

10k+ parts

-

2,476

$0.540

$0.526

$0.524

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Ampacity Inc.

Singapore . 2,040 parts In-Stock

1+ parts

$0.540

100+ parts

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2,040

$0.540

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Corphita

USA . 472 parts In-Stock

1+ parts

$0.681

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472

$0.681

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Argo Parts USA

USA . 2,116 parts In-Stock

1+ parts

$0.976

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$0.976

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Netroflash

USA . 100 parts In-Stock

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$1.030

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$1.009

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100

$1.030

$1.009

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Modulus Dynamics

Lithuania . 15,343 parts In-Stock

1+ parts

$1.055

100+ parts

$1.013

1k+ parts

$0.971

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15,343

$1.055

$1.013

$0.971

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Corohmni

South Africa . 214 parts In-Stock

1+ parts

$1.055

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214

$1.055

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Advanced Electronics

New Zealand . 450 parts In-Stock

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$1.087

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$1.032

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$1.032

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$1.087

$1.032

$1.032

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Continental Prestige Electronics

USA . 3,141 parts In-Stock

1+ parts

$1.370

100+ parts

$0.753

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$0.468

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3,141

$1.370

$0.753

$0.468

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Aztec Data Supply Inc.

USA . 538 parts In-Stock

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$1.910

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538

$1.910

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Microchip USA

USA . 9,394 parts In-Stock

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$5.579

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$5.579

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AZTECH Wire

Italy . 347 parts In-Stock

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$12.780

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$12.780

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RC Electronics

USA . 40,920 parts In-Stock

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$1.080

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$0.980

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$0.950

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Lixinc

USA . 4,387 parts In-Stock

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Perfect Parts

USA . 2,382 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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Robosynatics

Brazil . 20 parts In-Stock

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$0.036

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$0.036

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$0.036

20

-

$0.036

$0.036

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Lucentia Tech

USA . 20 parts In-Stock

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$0.036

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$0.036

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$0.036

20

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$0.036

$0.036

$0.036

Overview

Unleash the power of innovation with the IPD90R1K2C3ATMA1 by Infineon Technologies. As a leader in the industry, Infineon Technologies brings unparalleled quality and reliability to their Power Field Effect Transistors. Ideal for switching applications, this N-CHANNEL transistor offers enhanced performance and efficiency. With a maximum DS breakdown voltage of 900V and a pulsing drain current of 10A, this transistor delivers exceptional value and benefits to customers. Don't settle for anything less than the best - choose Infineon Technologies for your power transistor needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the transistor, making it reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs are known for their high efficiency and low on-state resistance, making them suitable for switching applications.

Minimum DS Breakdown Voltage: 900 V

With a high breakdown voltage of 900V, this FET can handle high voltage applications with ease, providing reliability and safety.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching times and low power dissipation, making it efficient in various circuits.

Avalanche Energy Rating (EAS): 68 mJ

The high avalanche energy rating of 68 mJ ensures that the FET can withstand short-circuit conditions and high energy spikes, enhancing its reliability in demanding environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers improved performance and reliability, making this FET suitable for high-power applications where efficiency and accuracy are crucial.

Maximum Drain-Source On Resistance: 1.2 ohm

With a low on-resistance of 1.2 ohms, this FET minimizes power losses and improves efficiency in switching circuits, making it a cost-effective choice for various applications.

Technical Specifications

Power Field Effect Transistors (FET) IPD90R1K2C3ATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

68 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

900 V

Maximum Drain Current (ID):

5.1 A

Maximum Drain-Source On Resistance:

1.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

10 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPD90R1K2C3ATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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