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IPD90P04P405AUMA1

Infineon Technologies

IPD90P04P405AUMA1 by Infineon Technologies

IPD90P04P405AUMA1 by Infineon is a P-CHANNEL FET with 40V DS Breakdown Voltage, 360A IDM, and 0.0047 ohm RDS(on). Ideal for power applications due to its 60 mJ EAS rating and SINGLE configuration with BUILT-IN DIODE. Suitable for surface mount designs in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,707 parts In-Stock

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3,707

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Digiode

USA . 791 parts In-Stock

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791

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Distributors (Availability)

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Corohmni

South Africa . 818 parts In-Stock

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$0.387

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818

$0.387

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Aztec Data Supply Inc.

USA . 3,156 parts In-Stock

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$0.760

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$0.760

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Modulus Dynamics

Lithuania . 5,527 parts In-Stock

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$0.926

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$0.889

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$0.852

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5,527

$0.926

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Advanced Electronics

New Zealand . 150 parts In-Stock

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$1.309

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$1.244

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$1.244

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150

$1.309

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$1.244

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Ampacity Inc.

Singapore . 358 parts In-Stock

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$7.050

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$7.050

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AZTECH Wire

Italy . 851 parts In-Stock

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$14.535

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851

$14.535

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Semicontronic

India . 1,106 parts In-Stock

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$47.050

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$45.874

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$45.638

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Continental Prestige Electronics

USA . 3,406 parts In-Stock

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Argo Parts USA

USA . 1,462 parts In-Stock

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Corphita

USA . 893 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Microchip USA

USA . 300 parts In-Stock

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Overview

Unleash the power of innovation with the Infineon Technologies IPD90P04P405AUMA1 Power Field Effect Transistor. Crafted with precision and expertise, this P-CHANNEL FET offers unparalleled performance and reliability for a wide range of applications. From automotive to industrial uses, this transistor's built-in diode and high operating capacity make it the ideal choice for demanding projects. Experience the seamless integration, efficiency, and superior quality that only Infineon Technologies can deliver. Upgrade your systems today with the IPD90P04P405AUMA1 and elevate your performance to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FET, ensuring long-term reliability.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-resistance and high efficiency, making them suitable for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for improved efficiency and protection against reverse current flow, making it a versatile choice for various circuit designs.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and space in circuit designs.

Minimum DS Breakdown Voltage: 40 V

The high breakdown voltage of 40V ensures the FET can handle high voltage applications without damage.

Package Shape: RECTANGULAR

Rectangular shape allows for compact and efficient placement on a circuit board, optimizing space usage.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections during soldering, ensuring stable performance in the circuit.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easier control and high switching speeds, making them ideal for power management applications.

Maximum Pulsed Drain Current (IDM): 360 A

The high pulsed drain current rating of 360A allows for handling high current spikes, ensuring reliable performance in demanding situations.

Avalanche Energy Rating (EAS): 60 mJ

The high avalanche energy rating of 60mJ indicates the FET's ability to withstand transient overvoltage conditions, enhancing overall reliability.

No. of Terminals: 2

The two terminals simplify the design and integration of the FET into various circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and allows for compact and efficient circuit designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability, making this FET suitable for power applications.

Transistor Element Material: SILICON

Silicon material provides high efficiency and reliability, ensuring stable performance in demanding power applications.

Maximum Drain Current (ID): 90 A

The high maximum drain current rating of 90A allows for handling high continuous currents, making it a reliable choice for power circuits.

Maximum Drain-Source On Resistance: 0.0047 ohm

The low on-resistance of 0.0047 ohm minimizes power loss and heat dissipation, improving overall efficiency of the FET.

Terminal Position: SINGLE

Single terminal position simplifies the installation and connection of the FET, enhancing ease of use in circuit designs.

Case Connection: DRAIN

Drain connection simplifies the integration of the FET in power circuit designs, offering efficient routing of current paths.

Technical Specifications

Power Field Effect Transistors (FET) IPD90P04P405AUMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

60 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

90 A

Maximum Drain-Source On Resistance:

.0047 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

360 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

IPD90P04P405AUMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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