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IPD90P03P4L04ATMA1

Infineon Technologies

IPD90P03P4L04ATMA1 by Infineon Technologies

IPD90P03P4L04ATMA1 by Infineon is a P-CHANNEL FET with 30V DS Breakdown Voltage, 360A IDM, and 0.0068 ohm RDS(on). It's used for SWITCHING applications in automotive (AEC-Q101) due to its high current handling capabilities and low on-resistance.

Median Price

$1.980

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 29 parts In-Stock

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$1.980

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29

$1.980

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Element14

Singapore . 36,330 parts In-Stock

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$3.990

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$2.280

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$1.360

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$1.250

36,330

$3.990

$2.280

$1.360

$1.250

Verical

USA . 7,831 parts In-Stock

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-

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$1.079

10k+ parts

$0.962

7,831

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$1.079

$0.962

Rochester

USA . 7,831 parts In-Stock

1+ parts

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$1.040

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$0.863

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$0.770

7,831

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$1.040

$0.863

$0.770

RS (Exports)

UK . 2,295 parts In-Stock

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$2.631

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$2.247

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2,295

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$2.631

$2.247

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Distributors (In-Stock)

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Digiode

USA . 652 parts In-Stock

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$0.811

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652

$0.811

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Nova Conductors

Japan . 10 parts In-Stock

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$1.721

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10

$1.721

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Chip Stock

USA . 19,630 parts In-Stock

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Bristol Electronics

USA . 12,700 parts In-Stock

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Vyrian

USA . 8,513 parts In-Stock

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J2 Sourcing AB

Sweden . 188 parts In-Stock

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Sensible Micro Corp

USA . 74 parts In-Stock

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ComSIT Distribution GmbH

Germany . 56 parts In-Stock

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56

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ComSIT USA

USA . 56 parts In-Stock

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Prism Electronics

USA . 55 parts In-Stock

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55

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 4,592 parts In-Stock

1+ parts

$0.549

100+ parts

$0.527

1k+ parts

$0.505

10k+ parts

-

4,592

$0.549

$0.527

$0.505

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Semicontronic

India . 8,603 parts In-Stock

1+ parts

$0.730

100+ parts

$0.712

1k+ parts

$0.708

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8,603

$0.730

$0.712

$0.708

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Ampacity Inc.

Singapore . 6,387 parts In-Stock

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$0.730

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6,387

$0.730

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Corphita

USA . 957 parts In-Stock

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$0.769

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957

$0.769

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Corohmni

South Africa . 231 parts In-Stock

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$1.468

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231

$1.468

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Aztec Data Supply Inc.

USA . 4,462 parts In-Stock

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$1.580

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4,462

$1.580

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Continental Prestige Electronics

USA . 5,290 parts In-Stock

1+ parts

$1.721

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$1.687

5,290

$1.721

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$1.687

Argo Parts USA

USA . 3,156 parts In-Stock

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$1.721

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$1.721

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Netroflash

USA . 100 parts In-Stock

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$1.721

100+ parts

$1.687

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100

$1.721

$1.687

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$1.805

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$1.714

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$1.714

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$1.805

$1.714

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Microchip USA

USA . 3,232 parts In-Stock

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$8.174

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$8.174

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AZTECH Wire

Italy . 945 parts In-Stock

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$21.230

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QUARKTWIN TECHNOLOGY LTD

USA . 25,540 parts In-Stock

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Infinite Electronics LLP (Excess)

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Perfect Parts

USA . 4,518 parts In-Stock

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4,518

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Overview

Unleash the power of Infineon Technologies with the IPD90P03P4L04ATMA1 Power Field Effect Transistor. This high-quality P-CHANNEL transistor offers unparalleled performance and reliability for switching applications. With a maximum drain current of 90A and a low on-resistance of 0.0068 ohm, this FET ensures efficient operation and optimal power management. Whether you're designing automotive systems or industrial machinery, trust in the IPD90P03P4L04ATMA1 to deliver exceptional results every time. Elevate your projects with the cutting-edge technology and superior craftsmanship of Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the FET.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their high input impedance, making them suitable for applications requiring low power consumption.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse voltage spikes, making the FET more reliable.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides fast switching speeds and efficient power management.

Minimum DS Breakdown Voltage: 30 V

The high breakdown voltage rating ensures reliable operation and protection against voltage spikes.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy and secure mounting on circuit boards, improving overall stability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easy to control and offer low on-state resistance, making them ideal for power switching applications.

Maximum Pulsed Drain Current (IDM): 360 A

With a high pulsed drain current rating, this FET can handle peak current demands without overheating or failing.

Avalanche Energy Rating (EAS): 370 mJ

The high avalanche energy rating indicates the FET's ability to withstand voltage spikes and transient events without damage.

No. of Terminals: 2

With only 2 terminals, this FET is easy to incorporate into circuit designs and offers a simple connection interface.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on circuit boards and allows for efficient use of layout design.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers low on-state resistance and fast switching speeds, making this FET suitable for high-performance applications.

Transistor Element Material: SILICON

Silicon-based transistors offer high reliability and performance, making this FET a dependable choice for various applications.

Maximum Drain Current (ID): 90 A

With a high drain current rating, this FET can handle substantial amounts of current without overheating or failing.

Maximum Drain-Source On Resistance: 0.0068 ohm

The low on-resistance of the FET reduces power losses and improves efficiency in power switching applications.

Terminal Position: SINGLE

Having a single terminal position simplifies installation and connection, making the FET user-friendly in various setups.

Case Connection: DRAIN

The drain case connection simplifies the thermal management of the FET, improving heat dissipation and overall performance.

Reference Standard: AEC-Q101

Compliance with the AEC-Q101 standard ensures high-quality and reliability for automotive applications, where stringent requirements are essential.

Technical Specifications

Power Field Effect Transistors (FET) IPD90P03P4L04ATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

370 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

90 A

Maximum Drain-Source On Resistance:

.0068 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

360 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPD90P03P4L04ATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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