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IPD90N04S4-04

Infineon Technologies

IPD90N04S4-04 by Infineon Technologies

IPD90N04S4-04 by Infineon Technologies is a N-channel power FET with 40V DS breakdown voltage and 360A max pulsed drain current. It is used in applications requiring high power dissipation, such as motor control systems and power supplies. The transistor features a built-in diode, operates in enhancement mode, and has a low on-resistance of 0.0041 ohm for efficient performance.

Median Price

$1.620

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,485 parts In-Stock

1+ parts

$1.620

100+ parts

$0.680

1k+ parts

$0.488

10k+ parts

$0.426

3,485

$1.620

$0.680

$0.488

$0.426

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 336 parts In-Stock

1+ parts

$1.302

100+ parts

-

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336

$1.302

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Vyrian

USA . 578 parts In-Stock

1+ parts

$1.370

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578

$1.370

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Rutronik

Germany . 72,500 parts In-Stock

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$0.530

72,500

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$0.530

Astute Electronics Inc

. 55,000 parts In-Stock

1+ parts

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55,000

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Cyclops Electronics Ltd

UK . 44,132 parts In-Stock

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44,132

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 6,586 parts In-Stock

1+ parts

$1.092

100+ parts

$1.048

1k+ parts

$1.005

10k+ parts

-

6,586

$1.092

$1.048

$1.005

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Corphita

USA . 288 parts In-Stock

1+ parts

$1.233

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288

$1.233

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Lixinc

USA . 8,753 parts In-Stock

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8,753

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Perfect Parts

USA . 8,400 parts In-Stock

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8,400

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A-Z Elektronik GmbH

Germany . 7,520 parts In-Stock

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7,520

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Assy Fe

Spain . 5,412 parts In-Stock

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5,412

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Alle Elektronik GmbH

Germany . 5,066 parts In-Stock

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5,066

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Kepictronics

USA . 1,080 parts In-Stock

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1,080

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Futuretech Components

Singapore . 645 parts In-Stock

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645

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Overview

Infineon Technologies 20V to 40V N-Channel Automotive MOSFETs are AEC-Q101 qualified for automotive applications, and available in a wide range of package types, including D-PAK, TOLL (HSOF-8),  TOLG (HSOG-8), and SSO8 (TDSON-8). These MOSFETs address broad range of applications, including EPS motor control, 3-phase and H-bridge motors, HVAC fan control, and electric pumps in combination with PWM control.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-state resistance and higher switching speeds compared to P-channel FETs, making them ideal for applications requiring high efficiency and performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the FET from reverse current flow, enhancing overall reliability.

Surface Mount: YES

Surface mount compatibility allows for easy and efficient PCB assembly, saving time and labor costs.

Minimum DS Breakdown Voltage: 40 V

The minimum breakdown voltage of 40V ensures reliable operation in high voltage applications, providing robust protection against voltage spikes.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact design that saves space on the PCB, making it suitable for applications with limited board real estate.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally off devices, offering better control over power consumption and reducing heat dissipation during operation.

Maximum Pulsed Drain Current (IDM): 360 A

The high pulsed drain current rating of 360A allows the FET to handle short-term overload conditions or peak power demands without the risk of damage.

Avalanche Energy Rating (EAS): 95 mJ

The high avalanche energy rating of 95mJ indicates the FET's ability to withstand high energy transients and voltage spikes, enhancing system reliability.

Maximum Drain Current (Abs) (ID): 90 A

The maximum drain current rating of 90A ensures the FET can handle high current loads without overheating or performance degradation.

No. of Terminals: 2

Having only 2 terminals simplifies the FET's connection to the circuit, reducing the risk of wiring errors and improving overall system reliability.

Maximum Power Dissipation (Abs): 71 W

The high power dissipation rating of 71W allows the FET to handle significant power loads while maintaining stable operation without exceeding thermal limits.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact designs and applications with size constraints.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FET technology offers low ON-state resistance, high efficiency, and fast switching speeds, making it ideal for high-performance applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175°C ensures reliable operation even in harsh environments with elevated temperatures, increasing the FET's versatility.

Transistor Element Material: SILICON

Silicon-based transistor elements offer high reliability, low leakage current, and excellent thermal stability, enhancing the overall performance and longevity of the FET.

Terminal Finish: TIN

The tin terminal finish provides good solderability and corrosion resistance, ensuring secure connections and long-term stability in various operating conditions.

Maximum Drain-Source On Resistance: 0.0041 ohm

The low drain-source on resistance of 0.0041 ohm minimizes power losses and heat dissipation, improving the efficiency and performance of the FET in power applications.

Terminal Position: SINGLE

With a single terminal position, the FET is easy to integrate into the circuit design, reducing wiring complexity and enhancing overall reliability and performance.

Case Connection: DRAIN

The drain case connection simplifies the FET's mounting and heatsinking process, improving thermal management and overall system reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for reliable soldering during the assembly process, ensuring secure connections and long-term performance of the FET.

Technical Specifications

Power Field Effect Transistors (FET) IPD90N04S4-04 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

95 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

90 A

Maximum Drain Current (ID):

90 A

Maximum Drain-Source On Resistance:

.0041 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

360 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

IPD90N04S4-04 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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