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FDD9410-F085

Onsemi

FDD9410-F085 by Onsemi

FDD9410-F085 by Onsemi is a N-CHANNEL Power FET with 40V DS Breakdown Voltage and 50A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, operates in ENHANCEMENT MODE, and has a low on-resistance of 0.0041 ohm.

Median Price

$0.601

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 77,636 parts In-Stock

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77,636

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Rochester

USA . 21,480 parts In-Stock

1+ parts

-

100+ parts

$0.590

1k+ parts

$0.490

10k+ parts

$0.437

21,480

-

$0.590

$0.490

$0.437

Verical

USA . 13,980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.612

10k+ parts

$0.546

13,980

-

-

$0.612

$0.546

Distributors (In-Stock)

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Digiode

USA . 1,794 parts In-Stock

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$0.460

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1,794

$0.460

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Vyrian

USA . 1,395 parts In-Stock

1+ parts

$0.484

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1,395

$0.484

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Flip Electronics

USA . 38,818 parts In-Stock

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Chip Stock

USA . 18,500 parts In-Stock

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18,500

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Distributors (Availability)

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Corphita

USA . 2,234 parts In-Stock

1+ parts

$0.436

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2,234

$0.436

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Corohmni

South Africa . 205 parts In-Stock

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$0.484

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205

$0.484

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Native Components

USA . 492 parts In-Stock

1+ parts

$19.941

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492

$19.941

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Northwest PG Solutions

USA . 511 parts In-Stock

1+ parts

$21.935

100+ parts

$19.742

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511

$21.935

$19.742

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Problanco Electronics

Mexico . 8,292 parts In-Stock

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SupplyDigital Components

Austria . 7,520 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Kulean Microsystems

USA . 2,876 parts In-Stock

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2,876

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TANS Electronics

Latvia . 2,837 parts In-Stock

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2,837

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Supply Digital

USA . 2,662 parts In-Stock

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2,662

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UHIMA Technologies

Türkiye . 165 parts In-Stock

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Overview

Unleash the power of innovation with the FDD9410-F085 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that excel in switching applications. With a single configuration and built-in diode, this N-CHANNEL transistor offers unmatched performance and reliability. Perfect for a wide range of applications, this product is designed to enhance efficiency and optimize power management. Trust Onsemi to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the FDD9410-F085 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the FET, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-state resistance and higher switching speeds compared to P-channel FETs, making them more efficient for switching applications.

Transistor Application: SWITCHING

Designed for switching applications, this FET can efficiently control current flow in circuits, making it ideal for power management.

Minimum DS Breakdown Voltage: 40 V

The high breakdown voltage of 40V allows the FET to handle higher voltages safely, ensuring reliable performance in various electronic systems.

Maximum Drain Current (Abs) (ID): 50 A

With a high maximum drain current of 50A, this FET is capable of handling heavy loads without overheating, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 75 W

The high power dissipation rating of 75W ensures that the FET can effectively dissipate heat generated during operation, preventing thermal issues.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature of 175 °C, this FET can withstand elevated temperatures, making it suitable for demanding environments.

Maximum Turn On Time (ton): 38 ns

The fast turn-on time of 38ns ensures quick switching speeds, enhancing the overall efficiency and performance of the FET in electronic circuits.

Technical Specifications

Power Field Effect Transistors (FET) FDD9410-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

40 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

50 A

Maximum Drain-Source On Resistance:

.0041 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

45 ns

Maximum Turn On Time (ton):

38 ns

Trade Compliance

FDD9410-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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