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FDD9511L-F085

Onsemi

FDD9511L-F085 by Onsemi

FDD9511L-F085 by Onsemi is a P-CHANNEL Power FET with 40V DS Breakdown Voltage and 25A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, operates in ENHANCEMENT MODE, and has an EAS of 25mJ.

Median Price

$0.596

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,298 parts In-Stock

1+ parts

-

100+ parts

$0.585

1k+ parts

$0.485

10k+ parts

$0.432

3,298

-

$0.585

$0.485

$0.432

Verical

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.606

10k+ parts

$0.541

2,500

-

-

$0.606

$0.541

Flip Electronics (Authorized)

USA . 2,500 parts In-Stock

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-

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2,500

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Distributors (In-Stock)

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Digiode

USA . 1,411 parts In-Stock

1+ parts

$0.455

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1,411

$0.455

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Chip Stock

USA . 41,000 parts In-Stock

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41,000

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Vyrian

USA . 4,017 parts In-Stock

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4,017

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Flip Electronics

USA . 2,500 parts In-Stock

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2,500

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Cyclops Electronics Ltd

UK . 2,000 parts In-Stock

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2,000

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Distributors (Availability)

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Native Components

USA . 892 parts In-Stock

1+ parts

$0.289

100+ parts

-

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10k+ parts

$0.278

892

$0.289

-

-

$0.278

Northwest PG Solutions

USA . 1,332 parts In-Stock

1+ parts

$0.318

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-

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$0.281

1,332

$0.318

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$0.281

Corphita

USA . 1,992 parts In-Stock

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$0.431

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$0.431

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Corohmni

South Africa . 359 parts In-Stock

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$0.479

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359

$0.479

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AZTECH Wire

Italy . 380 parts In-Stock

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$9.110

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380

$9.110

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Component Stockers USA

USA . 716 parts In-Stock

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$99.990

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716

$99.990

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Futuretech Components

Singapore . 20,000 parts In-Stock

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Problanco Electronics

Mexico . 7,972 parts In-Stock

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SupplyDigital Components

Austria . 5,760 parts In-Stock

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Perfect Parts

USA . 5,398 parts In-Stock

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Kulean Microsystems

USA . 3,600 parts In-Stock

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Authorized Procurement Solutions

USA . 150 parts In-Stock

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TANS Electronics

Latvia . 101 parts In-Stock

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UHIMA Technologies

Türkiye . 90 parts In-Stock

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90

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Overview

Discover the power and efficiency of the FDD9511L-F085 by Onsemi, a top-tier manufacturer known for delivering high-quality Power Field Effect Transistors. Ideal for switching applications, this P-channel transistor offers enhanced performance and reliability. With a compact design and built-in diode, this product provides exceptional value and benefits to customers seeking superior functionality and versatility in their electronic projects. Experience the difference with Onsemi's innovative technology and elevate your projects to new heights with the FDD9511L-F085.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and protection for the internal components of the transistor.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their higher mobility and conductivity, making them efficient for power management applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides additional protection against reverse polarity and ensures smooth current flow in the circuit.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low on-resistance for efficient power control.

Surface Mount: YES

The surface mount capability makes for easy and convenient installation on PCBs, saving space and simplifying the assembly process.

Maximum Turn On Time (ton): 45 ns

The fast turn-on time of 45 ns ensures quick response in switching applications, reducing switching losses and improving overall efficiency.

Technical Specifications

Power Field Effect Transistors (FET) FDD9511L-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

25 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

25 A

Maximum Drain-Source On Resistance:

.021 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

235 ns

Maximum Turn On Time (ton):

45 ns

Trade Compliance

FDD9511L-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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