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FDD9510L-F085

Onsemi

FDD9510L-F085 by Onsemi

Onsemi's FDD9510L-F085 is a P-CHANNEL Power FET with 40V DS Breakdown Voltage, 50A Drain Current, and 0.022 ohm On Resistance. Ideal for SWITCHING applications in automotive (AEC-Q101) and industrial sectors due to its high power dissipation of 75W and fast turn on/off times of 44ns/220ns.

Median Price

$0.651

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 520 parts In-Stock

1+ parts

-

100+ parts

$0.651

1k+ parts

$0.540

10k+ parts

$0.481

520

-

$0.651

$0.540

$0.481

Distributors (In-Stock)

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Digiode

USA . 2,342 parts In-Stock

1+ parts

$0.507

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-

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2,342

$0.507

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Nova Conductors

Japan . 800 parts In-Stock

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$0.559

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800

$0.559

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Chip Stock

USA . 35,148 parts In-Stock

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Flip Electronics

USA . 12,500 parts In-Stock

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12,500

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Vyrian

USA . 5,212 parts In-Stock

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IBS Electronics

USA . 2,999 parts In-Stock

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$1.234

2,999

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$1.234

Distributors (Availability)

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Ampacity Inc.

Singapore . 149 parts In-Stock

1+ parts

$0.454

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149

$0.454

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Corphita

USA . 253 parts In-Stock

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$0.481

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253

$0.481

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Corohmni

South Africa . 406 parts In-Stock

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$0.534

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Argo Parts USA

USA . 3,466 parts In-Stock

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$0.559

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$0.542

3,466

$0.559

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$0.542

Continental Prestige Electronics

USA . 820 parts In-Stock

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$0.559

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$0.548

820

$0.559

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$0.548

AZTECH Wire

Italy . 339 parts In-Stock

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$11.887

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QUARKTWIN TECHNOLOGY LTD

USA . 13,967 parts In-Stock

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TANS Electronics

Latvia . 6,128 parts In-Stock

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Problanco Electronics

Mexico . 5,889 parts In-Stock

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Lixinc

USA . 4,827 parts In-Stock

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Kulean Microsystems

USA . 1,351 parts In-Stock

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SupplyDigital Components

Austria . 800 parts In-Stock

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UHIMA Technologies

Türkiye . 757 parts In-Stock

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757

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Overview

Looking for a reliable Power Field Effect Transistor (FET)? Look no further than the FDD9510L-F085 by Onsemi. With a reputation for manufacturing high-quality components, Onsemi delivers top-notch products like this P-CHANNEL transistor with built-in diode, perfect for switching applications. The FDD9510L-F085 offers customers incredible value with its enhanced mode operation, low on-resistance, and high power dissipation capabilities. Trust Onsemi to provide the best solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making it suitable for various applications.

Polarity or Channel Type: P-CHANNEL

The P-channel design allows for efficient control and switching capabilities, enhancing overall performance.

Configuration: SINGLE WITH BUILT-IN DIODE

This configuration simplifies the design and assembly process, saving time and reducing costs.

Transistor Application: SWITCHING

The switching functionality enables the efficient control of power flow, making it ideal for power management applications.

Surface Mount: YES

The surface mount capability allows for easy integration onto circuit boards, saving space and improving overall efficiency.

Minimum DS Breakdown Voltage: 40 V

The high breakdown voltage ensures reliable operation and protection against voltage spikes.

Package Shape: RECTANGULAR

The rectangular shape offers a compact design, making it easy to fit into various electronic devices.

Terminal Form: GULL WING

The gull wing terminals provide secure connections and easy soldering during assembly.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for precise control over the transistor's conductance, improving performance.

Avalanche Energy Rating (EAS): 35.3 mJ

The high avalanche energy rating ensures the transistor can handle sudden voltage spikes without damage.

Maximum Drain Current (Abs) (ID): 50 A

The high maximum drain current rating allows for efficient power handling in demanding applications.

No. of Terminals: 2

The two terminals simplify the connection process and make it easy to integrate into existing circuits.

Maximum Power Dissipation (Abs): 75 W

The high maximum power dissipation rating allows for continuous operation without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for high-density mounting on PCBs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

This technology offers high efficiency and reliability, ensuring optimal performance in various conditions.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature range allows for reliable operation in harsh environments.

Transistor Element Material: SILICON

The silicon material provides excellent performance and durability, ensuring long-term reliability.

Maximum Turn On Time (ton): 44 ns

The fast turn-on time allows for quick response and efficient switching between on and off states.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature range ensures reliable performance in cold conditions.

Maximum Turn Off Time (toff): 220 ns

The fast turn-off time enhances overall efficiency and performance in switching applications.

Terminal Finish: MATTE TIN

The matte tin finish provides corrosion resistance and ensures reliable connections for long-term use.

Maximum Drain-Source On Resistance: 0.022 ohm

The low on-resistance minimizes power loss and enhances efficiency during operation.

Terminal Position: SINGLE

The single terminal position simplifies the connection process and allows for easy integration into circuit designs.

Case Connection: DRAIN

The drain case connection offers efficient heat dissipation and contributes to overall reliability.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature ensures proper soldering and prevents damage to the components.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable soldering and ensures component longevity.

Reference Standard: AEC-Q101

Compliant with the AEC-Q101 standard, this product meets strict automotive industry requirements for quality and reliability.

Technical Specifications

Power Field Effect Transistors (FET) FDD9510L-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

35.3 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

50 A

Maximum Drain-Source On Resistance:

.022 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

220 ns

Maximum Turn On Time (ton):

44 ns

Trade Compliance

FDD9510L-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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