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FDD9411L-F085

Onsemi

FDD9411L-F085 by Onsemi

FDD9411L-F085 by Onsemi is a N-CHANNEL Power FET with 40V DS Breakdown Voltage and 25A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, operates in ENHANCEMENT MODE, and has a low on-resistance of 0.0115 ohm.

Median Price

$0.550

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 25,000 parts In-Stock

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Rochester

USA . 8,815 parts In-Stock

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$0.539

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$0.448

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$0.399

8,815

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$0.539

$0.448

$0.399

Verical

USA . 7,500 parts In-Stock

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$0.560

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$0.499

7,500

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$0.560

$0.499

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Digiode

USA . 2,317 parts In-Stock

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$0.421

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Flip Electronics

USA . 25,000 parts In-Stock

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Vyrian

USA . 7,101 parts In-Stock

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Corphita

USA . 2,226 parts In-Stock

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$0.399

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$0.399

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Corohmni

South Africa . 340 parts In-Stock

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$0.443

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$0.443

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AZTECH Wire

Italy . 1,116 parts In-Stock

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$12.940

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$12.940

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Native Components

USA . 46 parts In-Stock

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$33.520

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$32.179

46

$33.520

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$32.179

Northwest PG Solutions

USA . 1,860 parts In-Stock

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$36.872

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TANS Electronics

Latvia . 7,205 parts In-Stock

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Problanco Electronics

Mexico . 6,301 parts In-Stock

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SupplyDigital Components

Austria . 6,126 parts In-Stock

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Kulean Microsystems

USA . 1,736 parts In-Stock

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UHIMA Technologies

Türkiye . 726 parts In-Stock

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Overview

Experience the power of innovation with the FDD9411L-F085 by Onsemi. As a leader in power field effect transistors (FET), Onsemi delivers top-notch quality and reliability. This N-channel single transistor with built-in diode is perfect for switching applications, offering enhanced performance and efficiency. With a maximum drain current of 25A and minimum DS breakdown voltage of 40V, this transistor ensures optimal functionality and durability. Trust Onsemi to provide cutting-edge technology that meets your power needs effortlessly. Elevate your projects with the FDD9411L-F085 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower ON-resistance and higher current capabilities compared to P-Channel FETs, making them suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the performance and reliability of the switching applications by providing protection against reverse current flow.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast turn-on and turn-off times, making it efficient in controlling power flow.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require a positive voltage at the gate to turn on, allowing for precise control over the switching operation.

Maximum Drain Current (Abs) (ID): 25 A

With a high maximum drain current rating, this FET can handle heavy loads and high-power applications reliably.

Maximum Power Dissipation (Abs): 48.4 W

This FET can dissipate heat effectively, ensuring stable operation even under high-power conditions.

Maximum Operating Temperature: 175 °C

Capable of operating at high temperatures, this FET is suitable for a wide range of industrial and automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) FDD9411L-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

22 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

25 A

Maximum Drain-Source On Resistance:

.0115 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

28 pF

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

36 ns

Maximum Turn On Time (ton):

17 ns

Trade Compliance

FDD9411L-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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