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FDD9409L-F085

Onsemi

FDD9409L-F085 by Onsemi

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 150 W; Terminal Position: SINGLE; Case Connection: DRAIN;

Median Price

$1.244

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 823,188 parts In-Stock

1+ parts

-

100+ parts

$0.977

1k+ parts

$0.811

10k+ parts

$0.723

823,188

-

$0.977

$0.811

$0.723

Verical

USA . 496,970 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.512

10k+ parts

$1.350

496,970

-

-

$1.512

$1.350

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 388 parts In-Stock

1+ parts

$1.140

100+ parts

-

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388

$1.140

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-

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Flip Electronics

USA . 27,500 parts In-Stock

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-

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27,500

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Bristol Electronics

USA . 10,000 parts In-Stock

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Vyrian

USA . 7,297 parts In-Stock

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7,297

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Distributors (Availability)

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Corphita

USA . 1,420 parts In-Stock

1+ parts

$1.080

100+ parts

-

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1,420

$1.080

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Corohmni

South Africa . 152 parts In-Stock

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$1.200

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152

$1.200

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Microchip USA

USA . 307 parts In-Stock

1+ parts

$5.047

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-

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307

$5.047

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AZTECH Wire

Italy . 164 parts In-Stock

1+ parts

$19.030

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164

$19.030

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Native Components

USA . 319 parts In-Stock

1+ parts

$34.980

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$33.581

319

$34.980

-

-

$33.581

Northwest PG Solutions

USA . 840 parts In-Stock

1+ parts

$38.478

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840

$38.478

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Component Stockers USA

USA . 734 parts In-Stock

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$99.990

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734

$99.990

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Problanco Electronics

Mexico . 8,318 parts In-Stock

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Kulean Microsystems

USA . 5,327 parts In-Stock

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5,327

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SupplyDigital Components

Austria . 4,947 parts In-Stock

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4,947

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Perfect Parts

USA . 2,800 parts In-Stock

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2,800

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UHIMA Technologies

Türkiye . 642 parts In-Stock

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642

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TANS Electronics

Latvia . 93 parts In-Stock

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93

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Technical Specifications

Power Field Effect Transistors (FET) FDD9409L-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

33.7 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

90 A

Maximum Drain-Source On Resistance:

.0044 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

70 ns

Maximum Turn On Time (ton):

47 ns

Trade Compliance

FDD9409L-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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