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FDD9407L-F085

Onsemi

FDD9407L-F085 by Onsemi

FDD9407L-F085 by Onsemi is a N-CHANNEL Power FET with 40V DS Breakdown Voltage. It features SINGLE configuration with built-in diode, 0.0024 ohm Drain-Source Resistance, and 128mJ Avalanche Energy Rating. Ideal for SWITCHING applications in automotive (AEC-Q101) and industrial sectors due to its high temp range (-55 to 175 °C) and METAL-OXIDE SEMICONDUCTOR technology.

Median Price

$1.060

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 12,500 parts In-Stock

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$0.818

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$0.818

Element14

Singapore . 12,500 parts In-Stock

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$1.620

12,500

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$1.620

Mouser Electronics

USA . 4,844 parts In-Stock

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$1.060

4,844

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$1.060

Distributors (In-Stock)

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Vyrian

USA . 1,380 parts In-Stock

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$0.750

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1,380

$0.750

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Digiode

USA . 2,007 parts In-Stock

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2,007

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LWI Electronics Inc

India . 20 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 276 parts In-Stock

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$1.060

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276

$1.060

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QUARKTWIN TECHNOLOGY LTD

USA . 27,112 parts In-Stock

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Continental Prestige Electronics

USA . 12,500 parts In-Stock

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$1.200

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$1.200

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ChipstoGo Electronic ltd

UK . 10,000 parts In-Stock

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Lixinc

USA . 9,415 parts In-Stock

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TANS Electronics

Latvia . 7,428 parts In-Stock

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Problanco Electronics

Mexico . 5,080 parts In-Stock

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Kulean Microsystems

USA . 3,743 parts In-Stock

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SupplyDigital Components

Austria . 3,333 parts In-Stock

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3,333

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Authorized Procurement Solutions

USA . 3,008 parts In-Stock

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Corphita

USA . 2,992 parts In-Stock

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Supply Digital

USA . 2,755 parts In-Stock

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Futuretech Components

Singapore . 2,000 parts In-Stock

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Northwest PG Solutions

USA . 1,864 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Native Components

USA . 332 parts In-Stock

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332

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UHIMA Technologies

Türkiye . 267 parts In-Stock

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267

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Overview

Unleash the power of the FDD9407L-F085 by Onsemi, a top-quality Power Field Effect Transistor that guarantees exceptional performance and reliability. Manufactured by Onsemi, a reputable industry leader, this N-CHANNEL transistor with a built-in diode is ideal for switching applications. With its advanced technology and high energy rating, this transistor offers unmatched value and benefits to customers, providing seamless operation even in the most demanding environments. Upgrade your systems with the FDD9407L-F085 and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and fast switching speeds, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode eliminates the need for an external diode, saving space and simplifying the circuit design.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable and efficient performance in such scenarios.

Surface Mount: YES

Surface mount technology allows for easy and compact integration onto circuit boards, saving space and facilitating automated assembly.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40V, this FET can handle higher voltages without sustaining damage, ensuring a stable operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and low power consumption, making this FET suitable for energy-efficient applications.

Maximum Operating Temperature: 175 °C

Capable of operating at high temperatures, ensuring stability and reliability in harsh environmental conditions.

Avalanche Energy Rating (EAS): 128 mJ

The high avalanche energy rating indicates the FET's ability to handle high-energy transients and surge currents without being damaged.

Maximum Drain-Source On Resistance: 0.0024 ohm

With a low on-resistance, this FET minimizes power loss and heat generation, making it ideal for high-efficiency applications.

Technical Specifications

Power Field Effect Transistors (FET) FDD9407L-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

128 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain-Source On Resistance:

.0024 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDD9407L-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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