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IPD90N06S407ATMA2

Infineon Technologies

IPD90N06S407ATMA2 by Infineon Technologies

IPD90N06S407ATMA2 by Infineon is a N-CHANNEL FET with 60V DS breakdown voltage and 90A max drain current. Ideal for power applications, it features a built-in diode, 79W power dissipation, and operates in enhancement mode. Suitable for surface mount designs with a small outline package style.

Median Price

$0.608

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,158 parts In-Stock

1+ parts

$0.576

100+ parts

$0.563

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-

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2,158

$0.576

$0.563

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Arrow

USA . 11,169 parts In-Stock

1+ parts

$0.577

100+ parts

$0.551

1k+ parts

$0.525

10k+ parts

$0.508

11,169

$0.577

$0.551

$0.525

$0.508

Mouser Electronics

USA . 2,679 parts In-Stock

1+ parts

$2.120

100+ parts

$0.908

1k+ parts

$0.660

10k+ parts

$0.586

2,679

$2.120

$0.908

$0.660

$0.586

DigiKey

USA . 19,220 parts In-Stock

1+ parts

$2.540

100+ parts

$1.098

1k+ parts

$0.800

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-

19,220

$2.540

$1.098

$0.800

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Rochester

USA . 15,865 parts In-Stock

1+ parts

-

100+ parts

$0.632

1k+ parts

$0.525

10k+ parts

$0.468

15,865

-

$0.632

$0.525

$0.468

Verical

USA . 12,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.656

10k+ parts

$0.585

12,500

-

-

$0.656

$0.585

RS (Exports)

UK . 7,500 parts In-Stock

1+ parts

-

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$0.585

7,500

-

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$0.585

Future Electronics

Canada . 2,500 parts In-Stock

1+ parts

-

100+ parts

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$0.540

2,500

-

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-

$0.540

Distributors (In-Stock)

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Digiode

USA . 497 parts In-Stock

1+ parts

$0.491

100+ parts

-

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497

$0.491

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Nova Conductors

Japan . 56 parts In-Stock

1+ parts

$0.755

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56

$0.755

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Vyrian

USA . 10,579 parts In-Stock

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10,579

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IBS Electronics

USA . 10,000 parts In-Stock

1+ parts

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$1.753

10,000

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$1.753

Chip Stock

USA . 2,700 parts In-Stock

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2,700

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Semicontronic

India . 10,682 parts In-Stock

1+ parts

$0.363

100+ parts

$0.354

1k+ parts

$0.352

10k+ parts

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10,682

$0.363

$0.354

$0.352

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Ampacity Inc.

Singapore . 10,436 parts In-Stock

1+ parts

$0.363

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10,436

$0.363

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Aztec Data Supply Inc.

USA . 14,756 parts In-Stock

1+ parts

$0.410

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14,756

$0.410

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Corphita

USA . 571 parts In-Stock

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$0.465

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571

$0.465

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Component Stockers USA

USA . 11,875 parts In-Stock

1+ parts

$0.610

100+ parts

$0.570

1k+ parts

$0.520

10k+ parts

$0.520

11,875

$0.610

$0.570

$0.520

$0.520

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.755

100+ parts

$0.740

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1,000

$0.755

$0.740

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Modulus Dynamics

Lithuania . 7,593 parts In-Stock

1+ parts

$0.911

100+ parts

$0.875

1k+ parts

$0.838

10k+ parts

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7,593

$0.911

$0.875

$0.838

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Corohmni

South Africa . 91 parts In-Stock

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$0.911

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91

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Microchip USA

USA . 6,375 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,336 parts In-Stock

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Perfect Parts

USA . 5,600 parts In-Stock

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Argo Parts USA

USA . 2,994 parts In-Stock

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Continental Prestige Electronics

USA . 2,776 parts In-Stock

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Overview

Unlock the power of Infineon Technologies with the IPD90N06S407ATMA2 Power Field Effect Transistor. Designed for reliability and performance, this N-CHANNEL transistor offers a single configuration with a built-in diode, ideal for a wide range of applications. From automotive to industrial use, this transistor provides enhanced efficiency and maximum pulsing drain current of 360 A. With its small outline package style and high operating temperature, customers can trust in the quality and value that this product brings to their projects. Experience the difference with Infineon Technologies today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring longer lifespan and reliable performance.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and fast switching speeds, making this product suitable for applications that require responsive power control.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and helps with protection against reverse voltage spikes, enhancing the overall reliability of the system.

Surface Mount: YES

Allows for easy assembly onto circuit boards, saving time and effort during production while also enabling compact and space-saving designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easy to control and suitable for a wide range of applications, providing flexibility and compatibility with different circuits.

Maximum Pulsed Drain Current (IDM): 360 A

High pulsed drain current capability allows for handling of peak power demands, ensuring reliability and performance under dynamic load conditions.

Maximum Power Dissipation (Abs): 79 W

The high power dissipation rating indicates the FET's ability to handle heat efficiently, enabling continuous operation at high power levels without overheating.

Maximum Operating Temperature: 175 °C

Wide operating temperature range allows for reliable performance in varying environmental conditions, making this FET suitable for industrial and automotive applications.

Maximum Drain Current (ID): 90 A

High drain current rating enables the FET to deliver and control high power levels, making it ideal for applications requiring robust power handling capabilities.

Maximum Drain-Source On Resistance: 0.0069 ohm

Low on-resistance minimizes power losses and improves efficiency, making this FET suitable for high-current applications where low voltage drop is crucial.

Maximum Feedback Capacitance (Crss): 70 pF

Low feedback capacitance helps reduce signal distortion and improve high-frequency performance, making this FET suitable for high-speed switching applications.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 automotive quality standard ensures reliability and durability, making this FET suitable for automotive and other demanding applications.

Technical Specifications

Power Field Effect Transistors (FET) IPD90N06S407ATMA2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

67 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

90 A

Maximum Drain-Source On Resistance:

.0069 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

70 pF

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

360 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

IPD90N06S407ATMA2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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