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IPB80P04P4L06XT

Infineon Technologies

IPB80P04P4L06XT by Infineon Technologies

IPB80P04P4L06XT by Infineon is a P-CHANNEL FET with 40V DS Breakdown Voltage, 320A IDM, and 0.0064 ohm RDS(on). Ideal for power applications in enhancement mode operation. Features GULL WING terminals, RECTANGULAR package shape, and METAL-OXIDE SEMICONDUCTOR technology.

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Digiode

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Modulus Dynamics

Lithuania . 13,593 parts In-Stock

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AZTECH Wire

Italy . 267 parts In-Stock

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Argo Parts USA

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Overview

Unleash the power of innovation with the IPB80P04P4L06XT by Infineon Technologies, a top-quality P-CHANNEL Power Field Effect Transistor that exceeds expectations. Infineon Technologies is known for their superior products and this transistor is no exception. With a built-in diode, high pulsing capabilities, and a low on-resistance, this transistor is perfect for a variety of applications. From automotive to industrial, this transistor offers unmatched performance and reliability. Experience the difference with the IPB80P04P4L06XT and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides good insulation and protection for the internal components of the FET.

Polarity or Channel Type: P-CHANNEL

P-channel FETs typically have lower on-resistance compared to N-channel FETs, making them suitable for high efficiency power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and can provide protection against reverse current flow.

Surface Mount: YES

Surface mount technology allows for convenient and compact placement of the FET on a PCB, saving space and facilitating automated assembly processes.

Minimum DS Breakdown Voltage: 40 V

The 40V minimum breakdown voltage ensures reliable operation in high voltage applications.

Maximum Pulsed Drain Current (IDM): 320 A

The high pulsed drain current rating allows the FET to handle large current spikes without damage, making it suitable for high power applications.

Avalanche Energy Rating (EAS): 31 mJ

The high avalanche energy rating indicates the FET's ability to withstand energy spikes, improving reliability in demanding conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high switching speeds and low gate drive requirements, enhancing the FET's performance in power applications.

Maximum Drain Current (ID): 80 A

The high maximum drain current rating allows the FET to handle large continuous currents, making it suitable for high power applications.

Maximum Drain-Source On Resistance: 0.0064 ohm

The low on-resistance of 0.0064 ohm minimizes power loss and improves efficiency in power circuit designs.

Technical Specifications

Power Field Effect Transistors (FET) IPB80P04P4L06XT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

31 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0064 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

320 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

IPB80P04P4L06XT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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