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IPB80P04P4L04ATMA1

Infineon Technologies

IPB80P04P4L04ATMA1 by Infineon Technologies

IPB80P04P4L04ATMA1 by Infineon Technologies is a P-CHANNEL power FET with a min DS breakdown voltage of 40V. It has a max pulsed drain current of 320A and a max drain-source on resistance of 0.0071 ohm. This transistor is suitable for applications requiring high power and low resistance.

Median Price

$1.925

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 56 parts In-Stock

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$1.925

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56

$1.925

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Vyrian

USA . 6,276 parts In-Stock

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6,276

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Bristol Electronics

USA . 55 parts In-Stock

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55

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Digiode

USA . 43 parts In-Stock

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43

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,302 parts In-Stock

1+ parts

$0.368

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3,302

$0.368

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Continental Prestige Electronics

USA . 22 parts In-Stock

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$1.450

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22

$1.450

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Argo Parts USA

USA . 3,465 parts In-Stock

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$1.925

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$1.925

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Netroflash

USA . 50 parts In-Stock

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$1.925

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50

$1.925

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Modulus Dynamics

Lithuania . 25,243 parts In-Stock

1+ parts

$2.160

100+ parts

$2.074

1k+ parts

$1.987

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25,243

$2.160

$2.074

$1.987

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Corohmni

South Africa . 62 parts In-Stock

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$2.160

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62

$2.160

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$2.285

100+ parts

$2.102

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$1.970

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500

$2.285

$2.102

$1.970

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Ampacity Inc.

Singapore . 678 parts In-Stock

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$7.050

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678

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AZTECH Wire

Italy . 229 parts In-Stock

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$18.233

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229

$18.233

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Semicontronic

India . 1,513 parts In-Stock

1+ parts

$45.050

100+ parts

$43.924

1k+ parts

$43.698

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1,513

$45.050

$43.924

$43.698

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Perfect Parts

USA . 5,600 parts In-Stock

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5,600

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Microchip USA

USA . 414 parts In-Stock

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Corphita

USA . 42 parts In-Stock

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Overview

Discover the power of the IPB80P04P4L04ATMA1 by Infineon Technologies! As a leading manufacturer in the industry, Infineon Technologies has crafted this high-quality Power Field Effect Transistor (FET) with utmost precision and expertise. Its P-CHANNEL configuration and built-in diode offer unparalleled performance and reliability. With a minimum DS breakdown voltage of 40V and maximum pulsed drain current of 320A, this FET can handle even the most demanding applications. Whether you're working on automotive systems or industrial automation, the IPB80P04P4L04ATMA1 delivers exceptional value, benefits, and advantages to empower your projects. Upgrade your designs and unlock new possibilities with Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the internal components of the FET, making it durable and long-lasting.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their lower ON-resistance and high switching speeds, making them suitable for various power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps with flyback diode protection, ensuring safe and reliable operation in power circuits.

Surface Mount: YES

Surface mount technology allows for easy installation on PCBs, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 40 V

This high breakdown voltage allows the FET to handle higher voltages, making it suitable for power applications.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to handle and mount on the PCB.

Terminal Form: GULL WING

Gull wing terminals are well-suited for surface mount applications, providing a secure connection to the PCB.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs have lower ON-resistance and better performance compared to depletion mode FETs.

Maximum Pulsed Drain Current (IDM): 320 A

The high pulsed drain current rating means that the FET can handle short bursts of high current, making it suitable for power applications.

Avalanche Energy Rating (EAS): 60 mJ

The high avalanche energy rating ensures that the FET can withstand spikes in voltage and current without damage.

No. of Terminals: 2

Having only two terminals simplifies the wiring and installation process.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low ON-resistance, making it suitable for power applications.

Transistor Element Material: SILICON

Silicon is a commonly used semiconductor material that offers good performance and reliability in power applications.

Terminal Finish: Tin (Sn)

Tin terminal finish provides good conductivity and solderability, ensuring a reliable connection to the PCB.

Maximum Drain Current (ID): 80 A

The high drain current rating allows the FET to handle large amounts of continuous current, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.0071 ohm

The low ON-resistance of the FET results in lower power dissipation and higher efficiency in power circuits.

Terminal Position: SINGLE

A single terminal position simplifies the installation process and reduces the risk of errors in wiring.

Case Connection: DRAIN

The drain connection is important for power control in FETs, allowing for efficient current flow and switching performance.

Technical Specifications

Power Field Effect Transistors (FET) IPB80P04P4L04ATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

60 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0071 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

320 A

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

IPB80P04P4L04ATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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