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IPB80P04P405XT

Infineon Technologies

IPB80P04P405XT by Infineon Technologies

IPB80P04P405XT by Infineon is a P-CHANNEL FET with 40V DS Breakdown Voltage, 320A IDM, and 0.0049 ohm RDS(on). It's used in automotive applications due to AEC-Q101 standard compliance and EAS of 64mJ for robust performance.

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3

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1k+

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Digiode

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Vyrian

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Nova Conductors

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Corohmni

South Africa . 816 parts In-Stock

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Aztec Data Supply Inc.

USA . 5,777 parts In-Stock

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Modulus Dynamics

Lithuania . 335 parts In-Stock

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AZTECH Wire

Italy . 311 parts In-Stock

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Ampacity Inc.

Singapore . 499 parts In-Stock

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Aranea Global

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Argo Parts USA

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Overview

Enhance your power management capabilities with the IPB80P04P405XT by Infineon Technologies. This high-quality P-channel power field effect transistor offers superior performance and reliability, making it perfect for a wide range of applications. With a maximum drain current of 80A and a low on-resistance of 0.0049 ohm, this transistor provides excellent efficiency and power handling capacity. Whether you're designing automotive systems or industrial equipment, this transistor's built-in diode and enhancement mode operation will help you achieve optimal results. Trust Infineon Technologies to deliver cutting-edge technology that meets your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection to the internal components of the FET, making it suitable for various operating conditions.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their superior thermal stability and lower input capacitance, making them ideal for high-performance applications where efficient power management is crucial.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the efficiency of the FET by providing additional protection against reverse current flow, ensuring reliable performance in different circuit configurations.

Surface Mount: YES

The surface mount capability allows for easy and compact integration of the FET onto printed circuit boards, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 40 V

The high breakdown voltage rating of 40V ensures reliable operation in high-voltage applications, making this FET suitable for use in a wide range of power management systems.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient space utilization on circuit boards, enabling a neat and organized layout for improved system performance.

Terminal Form: GULL WING

The gull-wing terminal form provides secure and reliable connections during the mounting process, preventing any potential damage or disconnection issues that could affect performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer faster switching speeds and lower power consumption compared to depletion mode FETs, making them ideal for applications that require high efficiency and performance.

Maximum Pulsed Drain Current (IDM): 320 A

The high pulsed drain current rating of 320A allows for handling large current spikes effectively, ensuring stable operation even under demanding operating conditions.

Avalanche Energy Rating (EAS): 64 mJ

The high avalanche energy rating of 64mJ indicates the FET's ability to withstand short-duration high-energy pulses without damage, making it reliable for use in applications with potential transient events.

No. of Terminals: 2

The two-terminal design simplifies the installation and connection process, reducing complexity and potential points of failure in the circuit for improved reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and allows for a more compact overall system design, making it suitable for applications where board real estate is limited.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology offers high reliability and performance in power management applications, ensuring efficient operation and longevity of the FET.

Transistor Element Material: SILICON

Silicon transistor elements are known for their high conductivity and durability, providing stable and consistent performance over a wide range of operating conditions.

Maximum Drain Current (ID): 80 A

The high maximum drain current rating of 80A allows for efficient handling of large current loads, making this FET suitable for high-power applications where reliable current conduction is essential.

Maximum Drain-Source On Resistance: 0.0049 ohm

The low drain-source on resistance of 0.0049 ohm helps minimize power losses and improve overall efficiency in power management applications, making it a cost-effective and energy-efficient choice.

Terminal Position: SINGLE

The single terminal position simplifies the connection process and ensures a secure and reliable electrical connection for consistent performance in various circuit configurations.

Case Connection: DRAIN

The drain case connection facilitates efficient heat dissipation and improves thermal management, enhancing the FET's overall reliability and longevity in high-power applications.

Reference Standard: AEC-Q101

Conformance to the AEC-Q101 standard ensures the FET meets stringent automotive industry requirements for reliability, durability, and performance, making it suitable for automotive and other high-reliability applications.

Technical Specifications

Power Field Effect Transistors (FET) IPB80P04P405XT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

64 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0049 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

320 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

IPB80P04P405XT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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